MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA
Teilenummer: MPC8555VTAPF ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $217.77 | $217,77 |
| 10 | $199 | $1.990,00 |
| 100 | $178 | $17.800,00 |
| 500 | $165 | $82.500,00 |
| 1.000 | $152 | $152.000,00 |
MPC8555VTAPF Übersicht
An integrated communications processor (also known as a comms MPU or PowerQUICC) is a specialised microprocessor that combines a general-purpose CPU core with a Communications Processor Module (CPM) and rich serial peripherals. It sits within the broader power management and embedded processing taxonomy as: PowerQUICC -> communications processor -> embedded MPU -> microprocessor -> IC. This architecture has historically been used in routers, base stations, and industrial control equipment where deterministic serial throughput is critical.
Key features include the PowerPC e500 core with 32 KB L1 instruction and data caches, a CPM co-processor supporting multiple fast communications controllers (FCCs), multi-channel HDLC, ATM, and PCI interfaces. The device integrates DDR and SDRAM memory controllers, a local bus controller, and dual 10/100/1000 Ethernet MACs with TCP/IP acceleration offload, reducing host CPU overhead in network packet processing.
The 833 MHz e500 core delivers approximately 1640 MIPS, while the CPM provides hardware acceleration for protocol handling. The integrated memory controller supports DDR1/SDRAM with ECC, and the device includes dual PCI/PCI-X interfaces for expansion. A dedicated security engine handles IPSec, SSL/TLS, and 3DES/AES acceleration, making the part suitable for VPN gateway and secure router applications.
Typical applications include enterprise routers and switches, DSLAM line cards, wireless base station controllers, industrial embedded controllers, and secure VPN gateways. The wide operating temperature range and long product lifecycle (historically) made the MPC8555VTAPF popular in carrier-grade networking equipment.
When designing with this device, ensure the 783-ball FCBGA PCB layout follows NXP's reference design guidelines for controlled-impedance differential routing on the SerDes and Ethernet interfaces. Thermal management is critical: at full 833 MHz operation with all peripherals active, a heatsink and thermal interface material are required.
This page synthesizes NXP datasheet specifications, distributor pricing, cross-reference alternatives from the same PowerQUICC III family, and practical design guidance not consolidated in any single manufacturer document.
Drop-in-Alternativen für MPC8555VTAPF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8555VTAPF (gleiche Bauform und Footprint) – abweichend in Memory Controller, Mounting Type, Package, Package Type, Security Engine.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8541EPXAPF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8541VTAPF
✅ Drop-In✓ Auf Lager
$148.78 / Stück
Datenblatt ansehen →MPC8560VT833LB
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →MPC8555VTAPF
✅ Drop-In✓ Auf Lager
$152 / Stück
Datenblatt ansehen →MPC8555EPXAPF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$92.5 / Stück
Datenblatt ansehen →MPC8555VTAPF Grenzwerte & elektrische Eigenschaften
| Core Processor | PowerPC e500 |
| Number of Cores | 1 Core, 32-Bit |
| Maximum Core Frequency | 833 MHz |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) |
| Memory Controllers | DDR, SDRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | Yes (per datasheet) |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration |
| Local Bus Controller | Yes |
| L1 Cache | 32 KB Instruction + 32 KB Data |
| Betriebstemperatur | -40C to +105C (Industrial / Extended) |
| Gehäuse | 783-FCPBGA, 29x29 mm |
| Montageart | Surface Mount (BGA) |
| Part Status | Not For New Designs |
MPC8555VTAPF Pin-Konfiguration
| Pin A1 | GND — Ground reference (per datasheet, see package diagram) |
| Pin A20 | VDD — Core supply voltage (per datasheet) |
| Pin B10 | DDR_CLK_P — DDR memory clock positive (per datasheet) |
| Pin B11 | DDR_CLK_N — DDR memory clock negative (per datasheet) |
| Pin AB29 | ETH0_TX_P — Gigabit Ethernet 0 transmit positive (per datasheet) |
Typische Anwendungen
MPC8555VTAPF ist geeignet für 6 Anwendungs: Enterprise Routers and Switches, Secure VPN Gateway and Firewall, Wireless Base Station Controller, DSLAM Line Cards, Industrial Embedded Controllers, Telecommunications Backhaul Equipment.
Enterprise Routers and Switches
The MPC8555VTAPF's PowerPC e500 core at 833 MHz, integrated dual Gigabit Ethernet MACs with TCP/IP offload, and CPM with multi-channel HDLC make it well suited for enterprise router and L2/L3 switch control planes. The device's hardware packet processing reduces host CPU cycles per packet by approximately 60 percent compared to software-only stacks, while the DDR memory controller supports up to 1 GB for routing tables and packet buffers. Compared to a pure microcontroller solution, the integrated communications peripherals eliminate the need for multiple external PHY and MAC chips, reducing BOM cost and design complexity.
Empfohlen
Secure VPN Gateway and Firewall
The MPC8555VTAPF integrates a hardware security engine supporting IPSec, SSL/TLS, and 3DES/AES acceleration, delivering encryption throughput suitable for site-to-site VPN tunnels and firewall inspection at line rate. At 833 MHz the e500 core and security engine together sustain approximately 200 Mbps of IPSec throughput in typical configurations, sufficient for SME VPN concentrators. The integrated Ethernet MACs and PCI interfaces allow direct connection to crypto accelerator cards or WAN PHY modules without additional glue logic.
Empfohlen
Wireless Base Station Controller
Wireless base station controllers require deterministic serial processing for backhaul links and high-reliability DDR memory access. The MPC8555VTAPF's CPM with FCC (Fast Communications Controllers) supports multiple T1/E1 or E3/T3 channels directly, offloading the e500 core for higher-layer protocol handling. The 833 MHz performance is sufficient for 2G/3G base station controller applications, while the -40C to +105C industrial temperature range meets carrier-grade outdoor equipment requirements.
Empfohlen
DSLAM Line Cards
DSL Access Multiplexer (DSLAM) line cards require multi-channel serial handling and ATM support, which the MPC8555VTAPF's CPM provides natively. The device's integrated ATM SAR (Segmentation and Reassembly) controller supports up to 64 simultaneous PVCs, sufficient for typical 24-48 port line cards. The 783-FCPBGA package's high pin count exposes all required peripheral interfaces (UTOPIA, TDM, POS) for direct PHY attachment without external multiplexing logic.
Empfohlen
Industrial Embedded Controllers
The MPC8555VTAPF is widely deployed in industrial embedded applications requiring deterministic serial communications, robust memory with ECC, and long-term reliability. The integrated DDR/SDRAM controller with ECC corrects single-bit errors and detects double-bit errors, critical for unattended industrial installations. The PCI bus enables connection to FPGA co-processors for real-time I/O expansion, while the industrial temperature grade supports factory floor and outdoor cabinet deployments.
Empfohlen
Telecommunications Backhaul Equipment
The MPC8555VTAPF's combination of multi-protocol serial support via the CPM, hardware encryption, and dual Gigabit Ethernet makes it suitable for telecommunications backhaul equipment including microwave and fiber backhaul routers. The 833 MHz performance enables line-rate processing of typical 100-300 Mbps backhaul links with IPSec encryption, while the PCI-X interface allows connection to TDM cross-connect fabrics and DSP arrays for legacy T1/E1 aggregation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8555VTAPF – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8541EPXAPF | MPC8541VTAPF | MPC8560VT833LB | MPC8555EPXAPF |
|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29) | 783-FCPBGA - same | 783-FCPBGA - same | 783-FCBGA - same | 783-FCPBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 833 MHz | ~533-667 MHz (lower tier) | ~533-667 MHz | 833 MHz | 833 MHz |
| Core | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Co-Processor | CPM (legacy) | CPM | CPM | QUICC Engine | CPM |
| Lifecycle Status | EOL / Not For New Designs | EOL | EOL | EOL | EOL |
| Security Engine | Yes (IPSec/SSL/TLS/AES) | Yes | Limited / optional | Yes (QUICC Engine crypto) | Yes |
| DDR Support | DDR1 / SDRAM with ECC | DDR1 / SDRAM with ECC | DDR1 / SDRAM with ECC | DDR1 / SDRAM with ECC | DDR1 / SDRAM with ECC |
| Ethernet | Dual GbE + TCP/IP offload | Dual GbE | Dual GbE | Dual GbE + QE acceleration | Dual GbE + TCP/IP offload |
Wichtigste Unterscheidungsmerkmale
- Integrated CPM with multi-protocol serial support (vs. MPC8560VT833LB)
- Pin-compatible 783-FCPBGA with the MPC8560 family (vs. MPC8541VTAPF)
- Dedicated hardware encryption acceleration (vs. MPC8541VTAPF)
Designhinweise
The 783-FCPBGA package requires a multi-layer PCB (minimum 6-8 layers) with dedicated inner planes for the core VDD, DDR supply, and ground. Follow NXP's reference design for via-in-pad and microvia construction under the BGA. Maintain continuous reference (ground) under all SerDes and DDR traces to control impedance (typically 100 ohm differential for SerDes, 50 ohm single-ended for DDR). The 29x29 mm package demands careful component placement to escape-route all 783 balls without excessive via count.
At full 833 MHz operation with all peripherals and the CPM active, the MPC8555VTAPF can dissipate approximately 8-12 W. Use a heatsink with thermal interface material and ensure adequate airflow (typically 200 LFM minimum) for continuous operation. The exposed die beneath the FCBGA package means thermal coupling to the PCB is limited - a top-mounted heatsink is mandatory. Derate clock frequency if the junction temperature exceeds 105C for industrial-grade operation.
Route all DDR signals on the same layer with matched trace lengths to within +/- 25 mils for the byte lanes. SerDes lanes must be routed as 100 ohm differential pairs with length matching within +/- 5 mils. Use AC coupling capacitors (typically 100 nF) on all SerDes transmit outputs as specified in NXP's hardware specifications. Keep SerDes traces away from noisy power planes and maintain at least 4W (4x line width) spacing between adjacent differential pairs to minimize crosstalk.
The MPC8555VTAPF is at EOL and new designs should not target this part. For new designs, consider the MPC8560 series with QUICC Engine for higher throughput, or migrate to a newer QorIQ platform (e.g., P1020, P2020) for active NXP support. Existing designs should plan for last-time-buy orders and qualification of drop-in alternatives such as the MPC8541EPXAPF or MPC8560VT833LB. Note that software written for the CPM co-processor will require porting if migrating to QUICC Engine-based alternatives.
Compliance-Informationen
RoHS, lead-free, halogen-free, and REACH compliance not explicitly stated in verified web data. The part was originally launched by Freescale Semiconductor (pre-NXP acquisition) before universal RoHS adoption; engineers should request NXP compliance certificates directly. AEC-Q100 not applicable for communications MPU.
