MPC8555VTAPF vs MPC8555EPXAPF Vergleich
Detaillierter Direktvergleich von MPC8555VTAPF von NXP Semiconductors und MPC8555EPXAPF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA
MPC8555VTAPF ✗ AbgekündigtNXP Semiconductors
MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP
MPC8555EPXAPF ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8555VTAPF | MPC8555EPXAPF |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $152,00 | $92,50 |
| Core Processor | PowerPC e500 | — |
| Number of Cores | 1 Core, 32-Bit | — |
| Maximum Core Frequency | 833 MHz | — |
| Co-Processor / DSP | Communications; CPM (Communications Processor Module) | — |
| Memory Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | Yes (per datasheet) | — |
| Ethernet | Dual 10/100/1000 MAC with TCP/IP acceleration | Two 10/100 Fast Ethernet MACs |
| PCI / PCI-X Interfaces | Dual PCI/PCI-X | — |
| Security Engine | IPSec / SSL / TLS / 3DES / AES acceleration | SEC 2.0 (Integrated) |
| Local Bus Controller | Yes | — |
| L1 Cache | 32 KB Instruction + 32 KB Data | — |
| Betriebstemperatur | -40C to +105C (Industrial / Extended) | — |
| Gehäuse | 783-FCPBGA, 29x29 mm | — |
| Montageart | Surface Mount (BGA) | — |
| Part Status | Not For New Designs | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Architecture | — | PowerPC e500 (Power Architecture) |
| Core | — | Single e500 |
| Datenbusbreite | — | 32-Bit |
| Maximum Clock Speed | — | 833 MHz |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Type | — | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) |
| Package Height | — | 3.75 mm |
| Pin-Anzahl | — | 783 |
| Betriebstemperaturbereich | — | -40 °C to +85 °C (industrial, extended) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Memory Controller | — | DDR / DDR2 up to 333 MHz |
| PCI Interface | — | PCI / PCI-X bridge (up to 133 MHz) |
| Process Technology | — | 130 nm CMOS |