MSC8156HAG1000B vs MSC8157TAG1000A Vergleich

Detaillierter Direktvergleich von MSC8156HAG1000B von NXP Semiconductors und MSC8157TAG1000A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Aktiv
NXP Semiconductors
MSC8157TAG1000A MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP

MSC8157TAG1000A ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter MSC8156HAG1000B MSC8157TAG1000A
Marke NXP Semiconductors NXP Semiconductors
Kategorie DSP DSP
Lebenszyklusstatus Aktiv Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $198,75 $178,00
Product Type Multi-core Digital Signal Processor (DSP) —
DSP Cores 6 x StarCore SC3850 —
Core Clock Frequency 1 GHz per core —
On-chip RAM 576 KB (L1/L2 SRAM) —
On-chip ROM 96 KB —
Hardware Accelerator MAPLE-B (turbo/Viterbi FEC) —
External Memory Interface DDR2/DDR3 with ECC —
High-speed Serial Fabric 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 —
Ethernet 2 x Gigabit Ethernet (SGMII/RGMII) —
Queuing Engine Yes (QE for packet/traffic management) —
Peripheral Interfaces SPI, I2C, UART, PCI —
Process Technology CMOS —
Gehäuse 783-ball FCBGA (FCP-BGA), 29 x 29 mm 783-FCPBGA (29x29 mm)
Montageart Surface Mount —
Betriebstemperatur 0C to +105C -40C to +105C
Peak Reflow Temperature 245C (JEDEC J-STD-020) —
Terminal Finish Tin Silver Copper (e1 per JESD-609) —
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED]
RoHS-Status Compliant (per distributor datasheet listing) [DATA_NEEDED]
Device Type — Six-core Digital Signal Processor (DSP)
DSP Architecture — StarCore SC3850 (6x cores)
Core Frequency — 1 GHz per core
L1 Instruction Cache — 32 KB per core
L1 Data Cache — 32 KB per core
Unified L2 Cache — 512 KB (configurable as M2 in 64 KB increments)
Accelerator — MAPLE-B2 baseband accelerator
Memory Controller — Dual-channel DDR2/DDR3 with ECC
High-Speed Serial I/O — 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI
Ball Pitch — 1.0 mm
Versorgungsspannung — [DATA_NEEDED: core/IO voltage]
MMU — Yes
Interrupt Controller — EPIC (Extended Programmable Interrupt Controller)
Timers — 2x 32-bit general-purpose per core

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern