P1010NSE5KHA - QorIQ P1 PowerPC SoC, 1.0GHz, 425-TEPBGA | NXP
Teilenummer: P1010NSE5KHA ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.4 | $78,40 |
| 10 | $74.2 | $742,00 |
| 100 | $67.5 | $6.750,00 |
| 500 | $60.1 | $30.050,00 |
| 1.000 | $54.25 | $54.250,00 |
P1010NSE5KHA Übersicht
A QorIQ SoC (System-on-Chip) is a multicore communications microprocessor that consolidates CPU cores, networking peripherals, security engines, and memory controllers into one device. The QorIQ P1 family sits between NXP's lower-end PowerQUICC devices and the higher-tier P2/P4 families; it is classified as a microprocessor IC for embedded computing and belongs to the broader MPU > embedded processor > communications processor > SoC taxonomy.
Key features include a single e500v2 core up to 1.0 GHz, integrated SEC 4.x hardware cryptography, hardware-accelerated Trusted Boot, two 10/100/1000 Mb/s Ethernet MACs, two USB 2.0 controllers (host + device), two SATA 2.0 ports, two PCIe Gen1 controllers, and a DDR3 SDRAM controller with ECC. The 425-TEPBGA package exposes the full address/data bus and SerDes lanes required for industrial gateways.
Architecturally, the P1010NSE5KHA uses NXP's e500v2 superscalar core paired with a three-level cache hierarchy and a coherent system bus to the on-chip peripherals. Hardware virtualization is not present on this device, but the SEC engine offloads AES, 3DES, SHA, and public-key acceleration, reducing CPU load for IPsec/TLS workloads.
Typical applications include industrial HMI panels, secure edge gateways, networked printers, embedded Linux routers, building automation controllers, and power-converter control with Ethernet connectivity. The wide I/O set reduces the companion chip count versus smaller Cortex-A parts.
When designing with this device, allocate proper thermal relief for the 425-ball BGA and follow NXP's layout guide for DDR3 length matching. The 0 to 105 °C operating range covers industrial enclosures but not full automotive AEC-Q100 Grade 2.
This page synthesizes distributor pricing, drop-in NXP-family alternatives, and practical design notes that supplement the manufacturer datasheet and speed up your component selection.
Drop-in-Alternativen für P1010NSE5KHA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1010NSE5KHA (gleiche Bauform und Footprint) – abweichend in Memory Controller, Operating Temperature, Package, Core Architecture, Ethernet.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1010NSN5KHA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1020NSE5HHA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1014NSE5KHA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1020NSN5HHA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P1010NSE5KHB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1010NSE5KHA Grenzwerte & elektrische Eigenschaften
| Family | QorIQ P1 |
| Core Architecture | PowerPC e500v2, 32-bit |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.0 GHz |
| Memory Controller | DDR3 with ECC |
| Ethernet | 2 x 10/100/1000 Mb/s (RGMII) |
| USB | 2 x USB 2.0 (Host + Device) |
| SATA | 2 x SATA 2.0 |
| PCIe | 2 x PCIe Gen1 |
| Security Engine | SEC (AES/3DES/SHA/RSA) |
| Trusted Boot | Hardware-accelerated |
| Versorgungsspannung | 1.0 V core |
| Betriebstemperatur | 0 °C to +105 °C |
| Gehäuse | 425-TEPBGA, 19x19 mm |
| Montageart | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
| Part Status | Active |
P1010NSE5KHA 425-tepbga, 19x19 mm Pinbelegungsleitfaden
Pinbelegung für P1010NSE5KHA (425-tepbga, 19x19 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1010NSE5KHA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1010NSE5KHA ist geeignet für 7 Anwendungs: Industrial Secure Edge Gateway, Networked Printers and MFPs, Industrial HMI Panels, Building Automation Controllers, Power Conversion Controllers with Ethernet, Embedded Linux Router and Firewall, Smart Grid RTU and IEC 61850 IEDs.
Industrial Secure Edge Gateway
The P1010NSE5KHA's hardware SEC engine, dual GbE, and 1.0 GHz e500v2 core make it well matched to IPsec VPN gateways that aggregate fieldbus data from Modbus/TCP and EtherCAT nodes. With hardware-accelerated AES and SHA offload, line-rate VPN throughput does not compromise routing CPU cycles. Compared with Cortex-A8 gateways, the MPU offers native DDR3 with ECC for high-altitude or industrial EMI robustness, and TEPBGA thermal headroom supports fanless sealed enclosures.
Empfohlen
Networked Printers and MFPs
Networked printers and multifunction devices use the P1010NSE5KHA as an embedded controller for image pipeline processing, RIP, and dual GbE connectivity. The 1.0 GHz core handles PDL rasterization while the dual SATA ports attach to local storage for spooling; USB 2.0 hosts connect to scanner front ends. The TEPBGA package's 19x19 mm footprint fits inside compact printer mainboards and its industrial 0-105 °C rating survives elevated chassis temperatures.
Empfohlen
Industrial HMI Panels
Human-Machine Interface panels using capacitive touchscreens drive LVDS displays from the P1010NSE5KHA's PCIe lanes and DDR3 framebuffer. The e500v2's deterministic interrupt latency simplifies real-time Qt/Embedded GUI scheduling at 60 Hz refresh. Hardware Trusted Boot authenticates firmware on every boot, meeting IEC 62443 industrial-cyber-security requirements for control room HMIs.
Empfohlen
Building Automation Controllers
BACnet/IP and KNXnet/IP gateways benefit from the P1010NSE5KHA's two GbE MACs and dual PCIe for sub-network bridges to DALI, Modbus, and LonWorks trunks. The SEC engine secures BACnet/IP packets while the 1.0 GHz core handles trend logging and analytic rules. Industrial temperature grade 0 to 105 °C ensures continuous duty in mechanical-room cabinets.
Empfohlen
Power Conversion Controllers with Ethernet
Smart inverters and UPS controllers attach to the P1010NSE5KHA via the dual PCIe links for ADC and DSP peripherals while GbE uplinks report to SCADA. Hardware crypto on the SEC engine secures grid-protocol packets (IEEE 2030.5, OpenADR) and supports signed firmware updates required by IEC 61850 utility deployments.
Empfohlen
Embedded Linux Router and Firewall
Mainstream Linux routers running iproute2, nftables, and StrongSwan benefit from the P1010NSE5KHA at the heart of small business firewalls. Its SEC engine executes AES-256-GCM at tens of hundreds of Mbps IPsec throughput, and the DDR3 controller with ECC delivers reliable memory for long-uptime deployments. Dual GbE plus optional link aggregation enable WAN/USB-LTE failover firmware on a single SoC.
Empfohlen
Smart Grid RTU and IEC 61850 IEDs
Substation Remote Terminal Units use the P1010NSE5KHA to implement IEC 61850 GOOSE messaging, SV sampling, and DNP3 over Ethernet. Trusted Boot and SEC crypto authenticate substation configuration and meet IEC 62351 cyber-security requirements. Dual GbE allow PRP/HSR network redundancy, while the 105 °C ambient operating envelope handles the high-temperature demands of metal-clad switchgear enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1010NSE5KHA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1010NSN5KHA | P1020NSE5HHA | P1014NSE5KHA | P1020NSN5HHA | P1010NSE5KHB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same |
| Number of Cores | 1 | 1 | 2 | 1 | 2 | 1 |
| Core Frequency | 1.0 GHz | 800 MHz (-20%) | 800 MHz (-20%) | 1.0 GHz | 800 MHz (-20%) | 1.0 GHz |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Memory Controller | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
| Ethernet | 2 x GbE (RGMII) | 2 x GbE | 2 x GbE | 2 x GbE | 2 x GbE | 2 x GbE |
| USB | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 |
| SATA | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 |
| PCIe | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
Wichtigste Unterscheidungsmerkmale
- Highest clock grade in the single-core QorIQ P1 family (vs. P1010NSN5KHA)
- Single core simplifies deterministic scheduling vs dual-core variant (vs. P1020NSE5HHA)
- P1010 vs P1014A: higher speed grade available (vs. P1014NSE5KHA)
Designhinweise
Estimated: The 425-TEPBGA exposes a thermal pad on the bottom; it must be soldered to the PCB land and connected via thermal vias to a copper pour or external heatsink. With a sealed enclosure design, assume theta_JA around 13 to 18 C/W, derate core voltage above 105 °C junction, and use 8-layer PCB stack-up so that inner copper planes spread heat from the die to the edge of the 19x19 mm BGA footprint. Source a thermal model from the QorIQ P1010 hardware design guide before locking enclosure mechanics.
DDR3 length-matching on the address/command/control lanes must follow the QorIQ P1010 design guidelines: keep the address and command tracks within ±25 mil matched length, and route byte lanes within each 8-bit group with ±10 mil matching. Use 100 ohm differential SERDES routing for SATA and PCIe, with AC-coupled capacitors placed near the SoC balls. Decouple the 1 V core with 100 nF X7R + 10 uF bulk ceramic + 330 uF polymer within the smallest loop area possible.
Do not enable the core PLL above 1.0 GHz on P1010NSE5KHA silicon - confusing letter codes (KHA vs KHB vs KHC) reference speed grades, and the KHA is the 1000 MHz version. PCIe Gen1 at 2.5 Gbps has aggressive SERDES signal-integrity requirements: reference-plane continuity under the BGA, ground stitching vias every λ/20, and never route the differential pair over plane splits. The TEPBGA lands must receive microvias or via-in-pad with OSP or ENIG finish for BGA soldering reliability.
Compliance-Informationen
RoHS compliant per NXP material declaration; industrial 0 to 105 °C operating range only, not AEC-Q100 automotive grade. Halogen-free status not explicitly listed in the verified web data - marked as unknown.
