P1010NSE5KHA - QorIQ P1 PowerPC SoC, 1.0GHz, 425-TEPBGA | NXP
부품 번호: P1010NSE5KHA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $74.2 | $742.00 |
| 100 | $67.5 | $6,750.00 |
| 500 | $60.1 | $30,050.00 |
| 1,000 | $54.25 | $54,250.00 |
P1010NSE5KHA 개요
A QorIQ SoC (System-on-Chip) is a multicore communications microprocessor that consolidates CPU cores, networking peripherals, security engines, and memory controllers into one device. The QorIQ P1 family sits between NXP's lower-end PowerQUICC devices and the higher-tier P2/P4 families; it is classified as a microprocessor IC for embedded computing and belongs to the broader MPU > embedded processor > communications processor > SoC taxonomy.
Key features include a single e500v2 core up to 1.0 GHz, integrated SEC 4.x hardware cryptography, hardware-accelerated Trusted Boot, two 10/100/1000 Mb/s Ethernet MACs, two USB 2.0 controllers (host + device), two SATA 2.0 ports, two PCIe Gen1 controllers, and a DDR3 SDRAM controller with ECC. The 425-TEPBGA package exposes the full address/data bus and SerDes lanes required for industrial gateways.
Architecturally, the P1010NSE5KHA uses NXP's e500v2 superscalar core paired with a three-level cache hierarchy and a coherent system bus to the on-chip peripherals. Hardware virtualization is not present on this device, but the SEC engine offloads AES, 3DES, SHA, and public-key acceleration, reducing CPU load for IPsec/TLS workloads.
Typical applications include industrial HMI panels, secure edge gateways, networked printers, embedded Linux routers, building automation controllers, and power-converter control with Ethernet connectivity. The wide I/O set reduces the companion chip count versus smaller Cortex-A parts.
When designing with this device, allocate proper thermal relief for the 425-ball BGA and follow NXP's layout guide for DDR3 length matching. The 0 to 105 °C operating range covers industrial enclosures but not full automotive AEC-Q100 Grade 2.
This page synthesizes distributor pricing, drop-in NXP-family alternatives, and practical design notes that supplement the manufacturer datasheet and speed up your component selection.
드롭인 대체품: P1010NSE5KHA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P1010NSE5KHA (동일 폼 팩터 및 풋프린트) — 차이점: Memory Controller, Operating Temperature, Package, Core Architecture, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
P1010NSN5KHA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1020NSE5HHA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1014NSE5KHA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1020NSN5HHA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P1010NSE5KHB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1010NSE5KHA 최대 정격 & 전기적 특성
| Family | QorIQ P1 |
| Core Architecture | PowerPC e500v2, 32-bit |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.0 GHz |
| Memory Controller | DDR3 with ECC |
| Ethernet | 2 x 10/100/1000 Mb/s (RGMII) |
| USB | 2 x USB 2.0 (Host + Device) |
| SATA | 2 x SATA 2.0 |
| PCIe | 2 x PCIe Gen1 |
| Security Engine | SEC (AES/3DES/SHA/RSA) |
| Trusted Boot | Hardware-accelerated |
| 공급 전압 | 1.0 V core |
| 동작 온도 | 0 °C to +105 °C |
| 패키지 | 425-TEPBGA, 19x19 mm |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Part Status | Active |
P1010NSE5KHA 425-tepbga, 19x19 mm 핀 구성 가이드
P1010NSE5KHA(425-tepbga, 19x19 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P1010NSE5KHA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P1010NSE5KHA 적합 용도: 7 애플리케이션s: Industrial Secure Edge Gateway, Networked Printers and MFPs, Industrial HMI Panels, Building Automation Controllers, Power Conversion Controllers with Ethernet, Embedded Linux Router and Firewall, Smart Grid RTU and IEC 61850 IEDs.
Industrial Secure Edge Gateway
The P1010NSE5KHA's hardware SEC engine, dual GbE, and 1.0 GHz e500v2 core make it well matched to IPsec VPN gateways that aggregate fieldbus data from Modbus/TCP and EtherCAT nodes. With hardware-accelerated AES and SHA offload, line-rate VPN throughput does not compromise routing CPU cycles. Compared with Cortex-A8 gateways, the MPU offers native DDR3 with ECC for high-altitude or industrial EMI robustness, and TEPBGA thermal headroom supports fanless sealed enclosures.
추천
Networked Printers and MFPs
Networked printers and multifunction devices use the P1010NSE5KHA as an embedded controller for image pipeline processing, RIP, and dual GbE connectivity. The 1.0 GHz core handles PDL rasterization while the dual SATA ports attach to local storage for spooling; USB 2.0 hosts connect to scanner front ends. The TEPBGA package's 19x19 mm footprint fits inside compact printer mainboards and its industrial 0-105 °C rating survives elevated chassis temperatures.
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Industrial HMI Panels
Human-Machine Interface panels using capacitive touchscreens drive LVDS displays from the P1010NSE5KHA's PCIe lanes and DDR3 framebuffer. The e500v2's deterministic interrupt latency simplifies real-time Qt/Embedded GUI scheduling at 60 Hz refresh. Hardware Trusted Boot authenticates firmware on every boot, meeting IEC 62443 industrial-cyber-security requirements for control room HMIs.
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Building Automation Controllers
BACnet/IP and KNXnet/IP gateways benefit from the P1010NSE5KHA's two GbE MACs and dual PCIe for sub-network bridges to DALI, Modbus, and LonWorks trunks. The SEC engine secures BACnet/IP packets while the 1.0 GHz core handles trend logging and analytic rules. Industrial temperature grade 0 to 105 °C ensures continuous duty in mechanical-room cabinets.
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Power Conversion Controllers with Ethernet
Smart inverters and UPS controllers attach to the P1010NSE5KHA via the dual PCIe links for ADC and DSP peripherals while GbE uplinks report to SCADA. Hardware crypto on the SEC engine secures grid-protocol packets (IEEE 2030.5, OpenADR) and supports signed firmware updates required by IEC 61850 utility deployments.
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Embedded Linux Router and Firewall
Mainstream Linux routers running iproute2, nftables, and StrongSwan benefit from the P1010NSE5KHA at the heart of small business firewalls. Its SEC engine executes AES-256-GCM at tens of hundreds of Mbps IPsec throughput, and the DDR3 controller with ECC delivers reliable memory for long-uptime deployments. Dual GbE plus optional link aggregation enable WAN/USB-LTE failover firmware on a single SoC.
추천
Smart Grid RTU and IEC 61850 IEDs
Substation Remote Terminal Units use the P1010NSE5KHA to implement IEC 61850 GOOSE messaging, SV sampling, and DNP3 over Ethernet. Trusted Boot and SEC crypto authenticate substation configuration and meet IEC 62351 cyber-security requirements. Dual GbE allow PRP/HSR network redundancy, while the 105 °C ambient operating envelope handles the high-temperature demands of metal-clad switchgear enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: P1010NSE5KHA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P1010NSN5KHA | P1020NSE5HHA | P1014NSE5KHA | P1020NSN5HHA | P1010NSE5KHB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same | 425-TEPBGA (19x19) - same |
| Number of Cores | 1 | 1 | 2 | 1 | 2 | 1 |
| Core Frequency | 1.0 GHz | 800 MHz (-20%) | 800 MHz (-20%) | 1.0 GHz | 800 MHz (-20%) | 1.0 GHz |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Memory Controller | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
| Ethernet | 2 x GbE (RGMII) | 2 x GbE | 2 x GbE | 2 x GbE | 2 x GbE | 2 x GbE |
| USB | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 | 2 x USB 2.0 |
| SATA | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 | 2 x SATA 2.0 |
| PCIe | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 | 2 x PCIe Gen1 |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
주요 차별점
- Highest clock grade in the single-core QorIQ P1 family (vs P1010NSN5KHA)
- Single core simplifies deterministic scheduling vs dual-core variant (vs P1020NSE5HHA)
- P1010 vs P1014A: higher speed grade available (vs P1014NSE5KHA)
설계 노트
Estimated: The 425-TEPBGA exposes a thermal pad on the bottom; it must be soldered to the PCB land and connected via thermal vias to a copper pour or external heatsink. With a sealed enclosure design, assume theta_JA around 13 to 18 C/W, derate core voltage above 105 °C junction, and use 8-layer PCB stack-up so that inner copper planes spread heat from the die to the edge of the 19x19 mm BGA footprint. Source a thermal model from the QorIQ P1010 hardware design guide before locking enclosure mechanics.
DDR3 length-matching on the address/command/control lanes must follow the QorIQ P1010 design guidelines: keep the address and command tracks within ±25 mil matched length, and route byte lanes within each 8-bit group with ±10 mil matching. Use 100 ohm differential SERDES routing for SATA and PCIe, with AC-coupled capacitors placed near the SoC balls. Decouple the 1 V core with 100 nF X7R + 10 uF bulk ceramic + 330 uF polymer within the smallest loop area possible.
Do not enable the core PLL above 1.0 GHz on P1010NSE5KHA silicon - confusing letter codes (KHA vs KHB vs KHC) reference speed grades, and the KHA is the 1000 MHz version. PCIe Gen1 at 2.5 Gbps has aggressive SERDES signal-integrity requirements: reference-plane continuity under the BGA, ground stitching vias every λ/20, and never route the differential pair over plane splits. The TEPBGA lands must receive microvias or via-in-pad with OSP or ENIG finish for BGA soldering reliability.
규정 준수 정보
RoHS compliant per NXP material declaration; industrial 0 to 105 °C operating range only, not AEC-Q100 automotive grade. Halogen-free status not explicitly listed in the verified web data - marked as unknown.
