P1013NXE2LFB - 1.067GHz e500v2 QorIQ MPU | NXP | Networking SoC
Teilenummer: P1013NXE2LFB ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1.685,00 |
| 100 | $142.75 | $14.275,00 |
| 500 | $121 | $60.500,00 |
| 1.000 | $108.4 | $108.400,00 |
P1013NXE2LFB Übersicht
What is an MPU SoC? An MPU (Microprocessor Unit) System-on-Chip integrates a CPU core, memory controllers, and a wide range of peripherals (Ethernet, PCIe, USB, security blocks) onto a single die. Within the NXP QorIQ P1 family it sits in the hierarchical chain: e500v2 core -> PowerPC core -> Power Architecture MPU -> communications processor -> embedded SoC. This level of integration reduces board area, BOM cost, and design complexity for routers, switches, and industrial gateways that previously required a CPU plus a multi-chip peripheral set.
Key features include hardware-accelerated IPSec/SEC, a 32-bit DDR2/DDR3 controller with ECC, integrated LCD display controller up to 1280x1024, four PCI Express lanes, three Gigabit Ethernet MACs (one configurable as 2.5G), FlexCAN 2.0, dual USB 2.0 with PHY, and a True Hardware Random Number Generator. Industrial peripherals include two I2C, two UART, two SPI, and an SD/MMC interface.
The P1013NXE2LFB uses the e500v2 superscalar core with dual integer and dual floating-point (single-precision) units, BTB and 16 KB/16 KB instruction/data L1 caches, and a 256 KB backend L2. The platform integrates a high-bandwidth interconnect plus dedicated DMA channels to sustain throughput on Ethernet and PCIe paths while keeping interrupt latency bounded. According to the NXP product page, the device is marked End of Life and is targeted for replacement by the Layerscape LS1021A family.
Typical applications include industrial routers, factory-floor gateways, networked HMI panels, single-board computers, secure access points, CAN-bridge automation controllers, and SMB network attached storage. Its wide -40C to +125C temperature range and integrated peripherals make it suited for harsh-environment networking equipment and automotive telematics ECUs.
Designers should plan for a multi-layer PCB with controlled-impedance DDR3 routing, a 5 mm keep-out around the 31x31 mm BGA, and bulk decoupling sized for the simultaneous switching of PCIe and SerDes I/O. For new designs, evaluate the Layerscape LS1021A as the recommended drop-in successor.
This page synthesizes distributor stock, lifecycle status, pin-compatible QorIQ alternatives, and practical board-design notes that supplement the manufacturer datasheet and the NXP end-of-life notice.
Drop-in-Alternativen für P1013NXE2LFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1013NXE2LFB (gleiche Bauform und Footprint) – abweichend in Ethernet MACs, Memory Controller, Mounting Type, Operating Temperature, Security Engine.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1022NXN2LFB
✅ Drop-In✓ Auf Lager
$78.4 / Stück
Datenblatt ansehen →P1013NSN2KFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1022NSN2KFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1014NXE2LFB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P1012NXE2LFB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P2020NSN2KFB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P1013NXE2LFB Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Maximum Core Frequency | 1.067 GHz |
| L1 Cache (Instruction + Data) | 16 KB + 16 KB |
| L2 Cache | 256 KB |
| Memory Controller | DDR2/DDR3 with ECC, 32-bit |
| Ethernet MACs | 3 x 10/100/1000 (one supports 2.5G SGMII) |
| PCI Express | 4 controllers (x4/x2/x1 configurable) |
| USB | 2 x USB 2.0 (with integrated PHY) |
| Security Engine | SEC with IPSec, RNG, tamper detection |
| LCD Controller | Yes, up to 1280 x 1024 |
| CAN | FlexCAN 2.0 (2 channels) |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 689-TEPBGA II (31x31 mm) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Temperature Grade | Automotive / Industrial |
P1013NXE2LFB 689-tepbga ii (31x31 mm) Pinbelegungsleitfaden
Pinbelegung für P1013NXE2LFB (689-tepbga ii (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1013NXE2LFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1013NXE2LFB ist geeignet für 7 Anwendungs: Industrial Router, Factory-Floor Gateway with CAN, Networked HMI / Panel PC, Secure VPN Access Point, Automotive Telematics ECU, Industrial Edge SBC, Smart-Energy Substation Controller.
Industrial Router
The NXP P1013NXE2LFB fits industrial routers because it integrates three 10/100/1000 Ethernet MACs (one configurable as 2.5G SGMII) directly with four PCI Express controllers and the SEC hardware crypto engine. At 1.067 GHz the e500v2 core provides deterministic throughput for route-table lookups and IPSec offload, while the DDR2/DDR3 controller with ECC supports the memory bandwidth needed by line-rate packet classification. Placed on the main SoC board alongside a 4 Gb DDR3 and a small PHY, the part removes the need for an external CPU companion. Compared with FPGA-accelerated routers the P1013NXE2LFB cuts BOM by an estimated 25-35% at similar packet-per-second rates.
Empfohlen
Factory-Floor Gateway with CAN
The P1013NXE2LFB adds native FlexCAN 2.0 (2 channels) plus GPIO, SPI, I2C, and UART for use as a factory-floor gateway. Its -40C to +125C operating range suits vibration-prone, thermally harsh enclosures. A real installation pairs this MPU with a CAN transceiver such as the NXP TJA1057 on the HS lines, while the on-chip Ethernet moves aggregated traffic to the plant network. The P1013's SEC engine can sign sensor data at the edge without an external TPM, reducing exposure of unencrypted CAN frames on the factory LAN.
Empfohlen
Networked HMI / Panel PC
The P1013NXE2LFB's integrated LCD controller supports displays up to 1280x1024, allowing a single-chip HMI without a companion GPU. Combined with three Ethernet MACs it can drive a multi-protocol panel PC front-end - Modbus TCP on one port, EtherNet/IP on another, and a management link on the third. The DDR3 controller sustains video frame-buffer bandwidth, while GPIO and SPI handle backlight, touch sensing, and keypad interfaces. Industrial users benefit from the wide -40C to +125C temperature range across weld-shop and outdoor deployments.
Empfohlen
Secure VPN Access Point
The P1013NXE2LFB integrates an SEC engine with IPSec protocol offload, an onboard True Hardware Random Number Generator, and tamper-detection interfaces - critical for secure access points. At 1.067 GHz it can sustain over 200 Mbps AES-SHA1 IPsec throughput while still serving control-plane and routing functions. Three Gigabit Ethernet MACs allow split LAN/WAN/DMZ ports, while two USB 2.0 ports accommodate secure-boot mass storage or an external smart-card reader for two-factor authentication.
Empfohlen
Automotive Telematics ECU
The P1013NXE2LFB was specifically designed for automotive/industrial use with operation from -40C to +125C. Its two FlexCAN interfaces connect directly to vehicle CAN and CAN-FD networks, while three Gigabit Ethernet MACs serve newer in-vehicle networks and cellular backhaul. The SEC engine with RNG and tamper detection handles trusted boot and key storage, important for connected-car ECUs. Designers should confirm software support for AUTOSAR or target RTOS, and follow JEDEC-based automotive qualification reports.
Empfohlen
Industrial Edge SBC
The P1013NXE2LFB integrates Ethernet, PCI Express, USB 2.0, SATA, GPIO, and dual CAN onto a single die - making it an ideal core for compact industrial single-board computers. A 4-layer PCB can host the SoC plus a single DDR3 SODIMM slot, mPCIe, and dual Ethernet jacks. At 1.067 GHz the part runs lightweight Linux distributions such as Yocto and Buildroot, suitable for edge data-collection nodes in machine-vision or remote-monitoring plants. The 31x31 mm BGA package, however, requires controlled-impedance stack-up and aggressive thermal relief.
Empfohlen
Smart-Energy Substation Controller
The P1013NXE2LFB's combined triple-Ethernet, dual-CAN, and SEC hardware engine make it a strong candidate for IEC 61850 substation controllers. The e500v2 core runs the necessary networking protocols at deterministic timing, the DDR3 controller supports complex IEC 104 and 103 stack buffers, and the SEC engine secures GOOSE messages. Designers must still perform IEC 61850 conformance testing and adhere to substation electromagnetic compliance (IEC 61000-4) standards - confirm specific protocol support with your NXP FAE before committing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1013NXE2LFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1022NXN2LFB | P1013NSN2KFB | P1022NSN2KFB | P1014NXE2LFB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Number of Cores | 1 e500v2 | 2 e500v2 | 1 e500v2 | 2 e500v2 | 1 e500v2 |
| Maximum Core Frequency | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.0 GHz |
| L2 Cache | 256 KB | 512 KB (dual-core shared) | 256 KB | 512 KB (dual-core shared) | 256 KB |
| DDR2/DDR3 Controller | 32-bit with ECC | 32-bit with ECC | 32-bit with ECC | 32-bit with ECC | 32-bit with ECC |
| Ethernet MACs | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) |
| PCI Express | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Approx Unit Price (qty 1, USD) | 185.00 | ~250.00 | ~165.00 | ~260.00 | ~190.00 |
Wichtigste Unterscheidungsmerkmale
- Single e500v2 core for power-constrained designs (vs. P1022NXN2LFB)
- Triple Gigabit Ethernet with 2.5G-capable SGMII on one port (vs. P1014NXE2LFB)
- Wide industrial temperature range with automotive qualification (vs. P1013NSN2KFB)
Designhinweise
The 689-ball TEPBGA II (31x31 mm) demands a 6-layer minimum PCB stack-up with 0.5 mm-pitch BGA escape routes on the top two layers and a continuous ground plane on layer 2. Per Freescale/NXP layout guidelines for QorIQ P1/P2, allocate four PCB layers for the DDR3 byte lanes with matched-length tolerances of +/-25 mils. Maintain a 5 mm keep-out beneath the SoC for thermal vias - a 0.2 mm pitch staggered via array filled with conductive epoxy reduces junction-to-case theta_JA by an estimated 30% compared to a bare BGA footprint.
Estimated: at maximum junction temperature +125C with 1.5 W typical power dissipation, the on-board thermal solution must keep the case below +95C in a still-air industrial enclosure. A thermal compound pad plus 30 x 30 x 10 mm copper spreader or a low-profile clip-on heatsink is recommended for -40C to +85C ambient. Verify your thermal profile with the QorIQ P1022 thermal model document.
Pin compatibility is OS-dependent. Migrating from P1013NXE2LFB to the dual-core P1022NXN2LFB requires recompiling for SMP (use SMP-enabled Linux or vxWorks). Do not assume board-level drop-in implies software-drop-in. Confirm the BOOT configuration block against the Alternate Configurable Reset Configuration Word (ACRCW) header for each substitution.
Use the NXP VRM reference design with a 4-phase buck for VCORE and a 3 A LDO for the DDR3 termination rail. The IO supply (1.8/2.5/3.3 V) must ramp within 100 ms of the VCORE supply or the part powers down into a non-deterministic state. Add a 10 uF + 1 uF + 100 nF decoupling pyramid within a 5 mm radius of the BGA.
Compliance-Informationen
RoHS and lead-free confirmed via distributor listings (DigiKey, Mouser, Arrow). AEC-Q100 status not explicitly stated in the verified web data; the part is marketed for automotive/industrial thermal range but designers should confirm automotive qualification directly with NXP FAE before use in automotive safety-critical applications.
