P3041NXN7MMC - QorIQ Quad-Core 1.2GHz SoC | NXP Semiconductors
Teilenummer: P3041NXN7MMC ✗ AbgekündigtP3041NXN7MMC Übersicht
A QorIQ SoC (System-on-Chip) is a highly-integrated communications processor that combines CPU cores, memory controllers, and high-speed serial I/O on a single die. QorIQ processors sit within the broader taxonomy of embedded processors -> microprocessors -> integrated circuits, and the P3041 family specifically addresses power- and cost-efficient mid-range networking workloads distinct from the higher-end P4 platform parts.
Key features include 4 e500mc cores with three-level cache hierarchy, dedicated hardware accelerators for packet parsing and security, dual DDR3/3L controllers supporting up to 16 GB of addressable memory, and flexible SerDes lanes that can be software-configured between PCIe, SATA, SRIO, and Ethernet SGMII/XAUI/10GBase-T PHYs. The device delivers robust performance-per-watt and is compatible with the broader NXP QorIQ software ecosystem.
Architecturally, the P3041 leverages the e500mc core (32-bit superscalar Power Architecture technology) with out-of-order execution and a coherent fabric interconnect shared across all four cores. Integrated SEC (Security Engine) blocks accelerate IPSec, SSL/TLS, and bulk cryptography in hardware, while DPAA (Data Path Acceleration Architecture) primitives offload queue, scheduling, and buffer-management tasks from the cores.
Typical applications include industrial routers and switches, LTE / 4G small-cell base stations, network-attached storage controllers, smart-grid aggregation gateways, and defense/aerospace embedded networking. The wide operating temperature range and integrated multi-protocol I/O simplify BOM and reduce board area versus discrete CPU-plus-ASIC designs.
When designing with this part, ensure that the FCBGA substrate and PCB stack-up meet the impedance and via-in-pad requirements for the 1295-ball 0.8 mm-pitch package; thermal management at the SoC level (typically a heat spreader or top-side heatsink) is required at full load, since the device can exceed 10 W under heavy I/O activity.
Drop-in-Alternativen für P3041NXN7MMC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P3041NXN7MMC (gleiche Bauform und Footprint) – abweichend in Package, Series, Ethernet, Manufacturer, Memory Controller.
P3041NXE7MMC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P2041NXE7MMC
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →P3041NXN7MMC-R2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P3041NSN7MMC
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →P4080NSN8MMC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P3041NXN7MMC Grenzwerte & elektrische Eigenschaften
| Part Number | P3041NXN7MMC |
| Architecture | Power Architecture e500mc, 32-bit |
| Number of Cores | 4 |
| Core Frequency | 1.2 GHz |
| Gehäuse | 1295-ball FCBGA (37.5 mm x 37.5 mm) |
| Memory Interface | DDR3 / DDR3L (dual controllers) |
| PCIe | Yes (integrated) |
| SATA | Yes (integrated) |
| Serial RapidIO (SRIO) | Yes (integrated) |
| Ethernet | 1G / 10GbE interfaces |
| Betriebstemperaturbereich | -40C to +105C |
| Series | QorIQ P3 |
| Revision | Rev 2.0 |
| Montageart | Surface Mount |
| Versorgungsspannung | 1.05 V (max supply voltage, per cross-reference data) |
| Manufacturer | NXP USA Inc. |
P3041NXN7MMC 1295-ball fcbga (37.5 mm x 37.5 mm) Pinbelegungsleitfaden
Pinbelegung für P3041NXN7MMC (1295-ball fcbga (37.5 mm x 37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P3041NXN7MMC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P3041NXN7MMC ist geeignet für 6 Anwendungs: Industrial Routers and Switches, LTE / 4G Small-Cell Base Station, Network-Attached Storage (NAS) Controller, Smart-Grid Substation Gateway, Defense and Aerospace Embedded Networking, Edge Compute / Industrial IoT Gateway.
Industrial Routers and Switches
The P3041NXN7MMC's integrated 1G/10GbE controllers and PCIe/SRIO make it ideal for industrial routers and Layer-2/3 switches, providing hardware-accelerated packet parsing via DPAA primitives. The four e500mc cores handle routing tables, ACL processing, and management-plane workloads concurrently, while the -40C to +105C operating range allows deployment in outdoor cabinets. Compared to discrete CPU-plus-NIC designs, the integrated 10GbE and PCIe eliminate external components. The SerDes lanes configure as XAUI for 10G uplinks and SGMII for 1G access ports.
Empfohlen
LTE / 4G Small-Cell Base Station
The four Power Architecture cores combined with the SEC security engine accelerate LTE Layer-1 baseband pre-processing and IPSec backhaul encryption in small-cell base stations. The integrated SRIO links to DSPs and RFICs, while 10GbE uplinks connect to the mobile backhaul. The industrial-grade -40C to +105C temperature range allows outdoor or street-cabinet deployment. Power consumption scales dynamically, helping meet small-cell energy budgets while maintaining deterministic throughput under load bursts.
Empfohlen
Network-Attached Storage (NAS) Controller
The two integrated SATA controllers, together with PCIe and 10GbE, make the P3041NXN7MMC well suited to mid-range NAS controllers that need to bridge HDD/SSD arrays to GbE/10GbE networks. The four cores dedicate to filesystem, RAID parity, SMB/NFS protocol, and deduplication tasks. Hardware CRC and XOR engines in the e500mc cores accelerate RAID-5/6 reconstruction. The DDR3L memory controller supports up to 16 GB of addressable RAM, sufficient for metadata-heavy ZFS or Btrfs deployments.
Empfohlen
Smart-Grid Substation Gateway
Substation gateways aggregating IEC 61850 traffic from bay controllers benefit from the P3041NXN7MMC's deterministic e500mc cores and built-in hardware cryptography. The wide -40C to +105C operating range supports IEC 61850-3 substation environmental requirements. Multiple SGMII ports connect to fiber-managed Ethernet switches, while PCIe interfaces to line cards. Integrated SEC accelerates TLS, VPN, and grid authentication without CPU overhead, freeing cores for protocol conversion and SCADA bridging.
Empfohlen
Defense and Aerospace Embedded Networking
The rugged P3041NXN7MMC supports mission-critical defense networking equipment that must operate from -40C to +105C and withstand vibration, shock, and temperature extremes. The four cores run ARINC 653 partitioned real-time OS or MILS-secured Linux for tactical switch/router payloads. SRIO links connect to DSP sensor arrays, while 10GbE provides backbone uplink. Hardware-secured boot and tamper-resistant SEC blocks satisfy common criteria requirements for crypto-sensitive payloads deployed in unmanned systems.
Empfohlen
Edge Compute / Industrial IoT Gateway
The P3041NXN7MMC provides ample compute for edge analytics on industrial IoT gateways aggregating MQTT, OPC-UA, and Modbus traffic from sensors. Four e500mc cores at 1.2 GHz handle containerized workloads (Docker via NXP SDK) and analytics pipelines on time-series data. PCIe connects to GPUs or AI accelerators, while the wide temperature envelope supports factory-floor enclosures. Hardware-accelerated cryptography secures TLS tunnels to cloud endpoints without sacrificing analytics throughput.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P3041NXN7MMC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P3041NXE7MMC | P2041NXE7MMC | P3041NXN7MMC-R2 | P3041NSN7MMC | P4080NSN8MMC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-FCBGA (37.5x37.5) | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same |
| Number of Cores | 4 | 4 | 2 | 4 | 4 | 8 |
| Core Frequency | 1.2 GHz | 1.2 GHz | 1.0 GHz | 1.2 GHz | 1.2 GHz | 1.5 GHz |
| Architecture | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Memory Interface | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L |
| Serial RapidIO / PCIe / SATA | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) |
Wichtigste Unterscheidungsmerkmale
- Four e500mc cores at 1.2 GHz with wide -40C to +105C operating range (vs. P2041NXE7MMC)
- Combined 10GbE, PCIe, SATA, and SRIO on a single SoC die (vs. P4080NSN8MMC)
- Industrial-grade -40C to +105C temperature support on QorIQ P3 platform (vs. Freescale P3041NXN7MMC (EOL dual-source))
Designhinweise
Estimated: at full-load with all four cores and high SerDes I/O activity, the P3041NXN7MMC dissipates roughly 10-15 W. A top-side heat spreader or integrated heatsink plus adequate PCB copper for the FCBGA thermal balls is required to maintain the -40C to +105C junction rating. Ensure thermals are characterized before sealed enclosure integration.
The 1295-ball FCBGA at 0.8 mm pitch demands via-in-pad PCB manufacturing with controlled-impedance stack-up. Differential pairs for 10GbE XAUI and SRIO require 100-ohm differential impedance, while DDR3/3L interfaces need matched-length routing with proper termination. Use the NXP design reference PCB stack-up document for guidance, including specific dielectric thickness, trace width, and via geometry targets.
Do not confuse the P3041NXN7MMC (industrial -40C to +105C, Rev 2.0) with the consumer/commercial P3041NXE7MMC bin; both share the FCBGA-1295 footprint but are graded for different temperature ranges and may have different errata. Verify the silicon revision and full part number (including the trailing suffix) before PCB firmware initialization; rev-mismatch can cause boot failures. Confirm DDR3/DDR3L initialization sequence using the published SPD values, not generic JEDEC timings.
The P3041NXN7MMC requires multiple DC rails (1.05 V core, 1.5/1.8 V DDR3L, 3.3 V I/O, and SerDes supply rails) sequenced per the datasheet. Use a multi-rail PMIC such as the NXP VR5100 or equivalent to guarantee power-up sequencing and to support hot-swap/event-based reset. Decouple each rail with 0.1 uF X7R close to the package balls plus bulk 22-47 uF tantalum/poly caps on the PCB; do not allow hot-plug of the 1.05 V core rail relative to DDR.
Compliance-Informationen
Lead-free assumed per modern NXP BGA manufacturing. RoHS, REACH, AEC-Q100, halogen-free, and conflict-mineral statements are not present in the verified web snippets and remain [DATA_NEEDED] pending direct datasheet verification. The part is NOT AEC-Q100 qualified (industrial/comms grade, not automotive).
