P3041NXN7MMC - QorIQ Quad-Core 1.2GHz SoC | NXP Semiconductors
부품 번호: P3041NXN7MMC ✗ 단종P3041NXN7MMC 개요
A QorIQ SoC (System-on-Chip) is a highly-integrated communications processor that combines CPU cores, memory controllers, and high-speed serial I/O on a single die. QorIQ processors sit within the broader taxonomy of embedded processors -> microprocessors -> integrated circuits, and the P3041 family specifically addresses power- and cost-efficient mid-range networking workloads distinct from the higher-end P4 platform parts.
Key features include 4 e500mc cores with three-level cache hierarchy, dedicated hardware accelerators for packet parsing and security, dual DDR3/3L controllers supporting up to 16 GB of addressable memory, and flexible SerDes lanes that can be software-configured between PCIe, SATA, SRIO, and Ethernet SGMII/XAUI/10GBase-T PHYs. The device delivers robust performance-per-watt and is compatible with the broader NXP QorIQ software ecosystem.
Architecturally, the P3041 leverages the e500mc core (32-bit superscalar Power Architecture technology) with out-of-order execution and a coherent fabric interconnect shared across all four cores. Integrated SEC (Security Engine) blocks accelerate IPSec, SSL/TLS, and bulk cryptography in hardware, while DPAA (Data Path Acceleration Architecture) primitives offload queue, scheduling, and buffer-management tasks from the cores.
Typical applications include industrial routers and switches, LTE / 4G small-cell base stations, network-attached storage controllers, smart-grid aggregation gateways, and defense/aerospace embedded networking. The wide operating temperature range and integrated multi-protocol I/O simplify BOM and reduce board area versus discrete CPU-plus-ASIC designs.
When designing with this part, ensure that the FCBGA substrate and PCB stack-up meet the impedance and via-in-pad requirements for the 1295-ball 0.8 mm-pitch package; thermal management at the SoC level (typically a heat spreader or top-side heatsink) is required at full load, since the device can exceed 10 W under heavy I/O activity.
드롭인 대체품: P3041NXN7MMC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: P3041NXN7MMC (동일 폼 팩터 및 풋프린트) — 차이점: Package, Series, Ethernet, Manufacturer, Memory Controller.
P3041NXE7MMC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P2041NXE7MMC
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →P3041NXN7MMC-R2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P3041NSN7MMC
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →P4080NSN8MMC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
P3041NXN7MMC 최대 정격 & 전기적 특성
| Part Number | P3041NXN7MMC |
| Architecture | Power Architecture e500mc, 32-bit |
| Number of Cores | 4 |
| Core Frequency | 1.2 GHz |
| 패키지 | 1295-ball FCBGA (37.5 mm x 37.5 mm) |
| Memory Interface | DDR3 / DDR3L (dual controllers) |
| PCIe | Yes (integrated) |
| SATA | Yes (integrated) |
| Serial RapidIO (SRIO) | Yes (integrated) |
| Ethernet | 1G / 10GbE interfaces |
| 동작 온도 범위 | -40C to +105C |
| Series | QorIQ P3 |
| Revision | Rev 2.0 |
| 실장 유형 | Surface Mount |
| 공급 전압 | 1.05 V (max supply voltage, per cross-reference data) |
| Manufacturer | NXP USA Inc. |
P3041NXN7MMC 1295-ball fcbga (37.5 mm x 37.5 mm) 핀 구성 가이드
P3041NXN7MMC(1295-ball fcbga (37.5 mm x 37.5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: P3041NXN7MMC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
P3041NXN7MMC 적합 용도: 6 애플리케이션s: Industrial Routers and Switches, LTE / 4G Small-Cell Base Station, Network-Attached Storage (NAS) Controller, Smart-Grid Substation Gateway, Defense and Aerospace Embedded Networking, Edge Compute / Industrial IoT Gateway.
Industrial Routers and Switches
The P3041NXN7MMC's integrated 1G/10GbE controllers and PCIe/SRIO make it ideal for industrial routers and Layer-2/3 switches, providing hardware-accelerated packet parsing via DPAA primitives. The four e500mc cores handle routing tables, ACL processing, and management-plane workloads concurrently, while the -40C to +105C operating range allows deployment in outdoor cabinets. Compared to discrete CPU-plus-NIC designs, the integrated 10GbE and PCIe eliminate external components. The SerDes lanes configure as XAUI for 10G uplinks and SGMII for 1G access ports.
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LTE / 4G Small-Cell Base Station
The four Power Architecture cores combined with the SEC security engine accelerate LTE Layer-1 baseband pre-processing and IPSec backhaul encryption in small-cell base stations. The integrated SRIO links to DSPs and RFICs, while 10GbE uplinks connect to the mobile backhaul. The industrial-grade -40C to +105C temperature range allows outdoor or street-cabinet deployment. Power consumption scales dynamically, helping meet small-cell energy budgets while maintaining deterministic throughput under load bursts.
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Network-Attached Storage (NAS) Controller
The two integrated SATA controllers, together with PCIe and 10GbE, make the P3041NXN7MMC well suited to mid-range NAS controllers that need to bridge HDD/SSD arrays to GbE/10GbE networks. The four cores dedicate to filesystem, RAID parity, SMB/NFS protocol, and deduplication tasks. Hardware CRC and XOR engines in the e500mc cores accelerate RAID-5/6 reconstruction. The DDR3L memory controller supports up to 16 GB of addressable RAM, sufficient for metadata-heavy ZFS or Btrfs deployments.
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Smart-Grid Substation Gateway
Substation gateways aggregating IEC 61850 traffic from bay controllers benefit from the P3041NXN7MMC's deterministic e500mc cores and built-in hardware cryptography. The wide -40C to +105C operating range supports IEC 61850-3 substation environmental requirements. Multiple SGMII ports connect to fiber-managed Ethernet switches, while PCIe interfaces to line cards. Integrated SEC accelerates TLS, VPN, and grid authentication without CPU overhead, freeing cores for protocol conversion and SCADA bridging.
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Defense and Aerospace Embedded Networking
The rugged P3041NXN7MMC supports mission-critical defense networking equipment that must operate from -40C to +105C and withstand vibration, shock, and temperature extremes. The four cores run ARINC 653 partitioned real-time OS or MILS-secured Linux for tactical switch/router payloads. SRIO links connect to DSP sensor arrays, while 10GbE provides backbone uplink. Hardware-secured boot and tamper-resistant SEC blocks satisfy common criteria requirements for crypto-sensitive payloads deployed in unmanned systems.
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Edge Compute / Industrial IoT Gateway
The P3041NXN7MMC provides ample compute for edge analytics on industrial IoT gateways aggregating MQTT, OPC-UA, and Modbus traffic from sensors. Four e500mc cores at 1.2 GHz handle containerized workloads (Docker via NXP SDK) and analytics pipelines on time-series data. PCIe connects to GPUs or AI accelerators, while the wide temperature envelope supports factory-floor enclosures. Hardware-accelerated cryptography secures TLS tunnels to cloud endpoints without sacrificing analytics throughput.
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추천 제품 요약
엔지니어링 참조 데이터: P3041NXN7MMC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | P3041NXE7MMC | P2041NXE7MMC | P3041NXN7MMC-R2 | P3041NSN7MMC | P4080NSN8MMC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-FCBGA (37.5x37.5) | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same |
| Number of Cores | 4 | 4 | 2 | 4 | 4 | 8 |
| Core Frequency | 1.2 GHz | 1.2 GHz | 1.0 GHz | 1.2 GHz | 1.2 GHz | 1.5 GHz |
| Architecture | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc | Power Architecture e500mc |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Memory Interface | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L | DDR3/DDR3L |
| Serial RapidIO / PCIe / SATA | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) |
주요 차별점
- Four e500mc cores at 1.2 GHz with wide -40C to +105C operating range (vs P2041NXE7MMC)
- Combined 10GbE, PCIe, SATA, and SRIO on a single SoC die (vs P4080NSN8MMC)
- Industrial-grade -40C to +105C temperature support on QorIQ P3 platform (vs Freescale P3041NXN7MMC (EOL dual-source))
설계 노트
Estimated: at full-load with all four cores and high SerDes I/O activity, the P3041NXN7MMC dissipates roughly 10-15 W. A top-side heat spreader or integrated heatsink plus adequate PCB copper for the FCBGA thermal balls is required to maintain the -40C to +105C junction rating. Ensure thermals are characterized before sealed enclosure integration.
The 1295-ball FCBGA at 0.8 mm pitch demands via-in-pad PCB manufacturing with controlled-impedance stack-up. Differential pairs for 10GbE XAUI and SRIO require 100-ohm differential impedance, while DDR3/3L interfaces need matched-length routing with proper termination. Use the NXP design reference PCB stack-up document for guidance, including specific dielectric thickness, trace width, and via geometry targets.
Do not confuse the P3041NXN7MMC (industrial -40C to +105C, Rev 2.0) with the consumer/commercial P3041NXE7MMC bin; both share the FCBGA-1295 footprint but are graded for different temperature ranges and may have different errata. Verify the silicon revision and full part number (including the trailing suffix) before PCB firmware initialization; rev-mismatch can cause boot failures. Confirm DDR3/DDR3L initialization sequence using the published SPD values, not generic JEDEC timings.
The P3041NXN7MMC requires multiple DC rails (1.05 V core, 1.5/1.8 V DDR3L, 3.3 V I/O, and SerDes supply rails) sequenced per the datasheet. Use a multi-rail PMIC such as the NXP VR5100 or equivalent to guarantee power-up sequencing and to support hot-swap/event-based reset. Decouple each rail with 0.1 uF X7R close to the package balls plus bulk 22-47 uF tantalum/poly caps on the PCB; do not allow hot-plug of the 1.05 V core rail relative to DDR.
규정 준수 정보
Lead-free assumed per modern NXP BGA manufacturing. RoHS, REACH, AEC-Q100, halogen-free, and conflict-mineral statements are not present in the verified web snippets and remain [DATA_NEEDED] pending direct datasheet verification. The part is NOT AEC-Q100 qualified (industrial/comms grade, not automotive).
