PADC3444IRTQT - 14-Bit 125MSPS Quad-Channel ADC | TI
Teilenummer: PADC3444IRTQT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $52.8 | $52,80 |
| 10 | $49.5 | $495,00 |
| 100 | $44.2 | $4.420,00 |
| 500 | $39.85 | $19.925,00 |
| 1.000 | $35.6 | $35.600,00 |
PADC3444IRTQT Übersicht
What is a pipelined ADC? A pipelined analog-to-digital converter is a high-speed ADC architecture that uses multiple cascaded low-resolution stages to digitize an analog input. Each stage samples, quantizes, and passes a residue to the next stage. Pipelined ADCs are the workhorses of multi-MHz to multi-GSPS signal acquisition because they balance speed, resolution, and power efficiency far better than flash or successive-approximation alternatives, placing them at the heart of high-performance data acquisition systems, communications infrastructure, and defense electronics.
The PADC3444IRTQT integrates four high-linearity analog input channels with on-chip input termination and a flexible clock architecture that includes an input clock divider and SYSREF input for deterministic multi-device synchronization. It is engineered specifically for demanding high-input-frequency signals with large dynamic range requirements, where spurious-free dynamic range (SFDR) and signal-to-noise ratio (SNR) are critical.
Key features include 4 differential analog input channels, LVDS/CMOS output interface options (contact TI for family options), outstanding AC linearity at IF inputs, and ultra-low power consumption per channel compared to competing quad ADC solutions. The integrated input termination simplifies board-level front-end design, and the SYSREF support enables JESD204B-class system synchronization.
Typical applications include multi-antenna wireless base station receivers (LTE, 5G NR, TDD-LTE), radar and phased-array antenna systems, software-defined radio (SDR) platforms, broadband communications test equipment, and high-speed industrial imaging systems. Industrial-grade temperature range -40°C to +85°C supports outdoor and uncontrolled-environment deployments.
When designing with this part, allocate sufficient PCB area for the exposed thermal pad and provide a continuous ground plane beneath the package. Use controlled-impedance differential routing for analog inputs, and place decoupling capacitors as close to the supply pins as practical to preserve SFDR.
This page consolidates distributor pricing, drop-in alternatives, application references, and PCB/thermal guidance for the PADC3444IRTQT that supplement the manufacturer datasheet, enabling faster engineering decisions.
Drop-in-Alternativen für PADC3444IRTQT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PADC3444IRTQT (gleiche Bauform und Footprint) – abweichend in Package, Resolution, Input Type, Number of Channels, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ADC3444IRTQ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADC3443IRTQT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADC3442IRTQT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADS6445IRTQCT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PADC3444IRTQT Grenzwerte & elektrische Eigenschaften
| Manufacturer | Texas Instruments |
| Part Family | ADC344x (PADC3444) |
| Auflösung | 14 bit |
| Number of Channels | 4 (quad) |
| Sampling Rate (max) | 125 MSPS |
| Sampling Rate (min) | 25 MSPS |
| Architecture | Pipelined |
| Analog Supply Voltage | 1.8 V |
| Number of Inputs | 2 (per datasheet feature description) / 4 channels |
| Input Type | Differential (high-linearity) |
| Output Interface | LVDS / CMOS (family options) |
| Input Clock Divider | Yes (integrated) |
| SYSREF Input | Yes (deterministic sync) |
| Betriebstemperatur | -40°C to +85°C (industrial) |
| Gehäuse | 56-QFN (RTQ) 8x8 mm |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead Free | Yes |
PADC3444IRTQT Pin-Konfiguration
| Pin 1 | AGND — Analog ground |
| Pin 2 | AVDD — Analog supply 1.8 V |
| Pin 3 | INP1 — Channel 1 positive analog input |
| Pin 4 | INM1 — Channel 1 negative analog input |
| Pin 5 | AGND — Analog ground |
| Pin 6 | AVDD — Analog supply 1.8 V |
| Pin 7 | INP2 — Channel 2 positive analog input |
| Pin 8 | INM2 — Channel 2 negative analog input |
| Pin 9 | AGND — Analog ground |
| Pin 10 | AVDD — Analog supply 1.8 V |
| Pin 11 | INP3 — Channel 3 positive analog input |
| Pin 12 | INM3 — Channel 3 negative analog input |
| Pin 13 | AGND — Analog ground |
| Pin 14 | AVDD — Analog supply 1.8 V |
| Pin 15 | INP4 — Channel 4 positive analog input |
| Pin 16 | INM4 — Channel 4 negative analog input |
| Pin 17 | AGND — Analog ground |
| Pin 18 | AVDD — Analog supply 1.8 V |
| Pin 19 | VCOM — Internal voltage reference common |
| Pin 20 | REFIO — Reference IO |
| Pin 21 | REFT — Reference top decoupling |
| Pin 22 | REFB — Reference bottom decoupling |
| Pin 23 | AGND — Analog ground |
| Pin 24 | AVDD — Analog supply 1.8 V |
| Pin 25 | CLKP — Clock positive input |
| Pin 26 | CLKM — Clock negative input |
| Pin 27 | AGND — Analog ground |
| Pin 28 | SYSREF_P — SYSREF positive input |
| Pin 29 | SYSREF_M — SYSREF negative input |
| Pin 30 | AGND — Analog ground |
| Pin 31 | DGND — Digital ground |
| Pin 32 | DVDD — Digital supply |
| Pin 33 | D0P — Data output lane 0 positive |
| Pin 34 | D0M — Data output lane 0 negative |
| Pin 35 | D1P — Data output lane 1 positive |
| Pin 36 | D1M — Data output lane 1 negative |
| Pin 37 | D2P — Data output lane 2 positive |
| Pin 38 | D2M — Data output lane 2 negative |
| Pin 39 | D3P — Data output lane 3 positive |
| Pin 40 | D3M — Data output lane 3 negative |
| Pin 41 | DGND — Digital ground |
| Pin 42 | DVDD — Digital supply |
| Pin 43 | FCLK_P — Frame clock positive |
| Pin 44 | FCLK_M — Frame clock negative |
| Pin 45 | DCLK_P — Data clock positive |
| Pin 46 | DCLK_M — Data clock negative |
| Pin 47 | DGND — Digital ground |
| Pin 48 | SDIO — Serial data IO (SPI) |
| Pin 49 | SCLK — Serial clock (SPI) |
| Pin 50 | SEN — Serial enable (SPI) |
| Pin 51 | RESET — Reset (active low) |
| Pin 52 | PDN — Power-down input |
| Pin 53 | DGND — Digital ground |
| Pin 54 | MODE — Interface mode select |
| Pin 55 | NC — Not connected (per datasheet) |
| Pin 56 | EPAD — Exposed thermal pad - connect to analog ground |
Typische Anwendungen
PADC3444IRTQT ist geeignet für 6 Anwendungs: Wireless Base Station Receiver (LTE / 5G NR), Phased-Array Radar Signal Acquisition, Software Defined Radio (SDR) Platforms, Broadband Communications Test Equipment, High-Speed Industrial Imaging Systems, Software Defined Radio Wireless Infrastructure.
Wireless Base Station Receiver (LTE / 5G NR)
The PADC3444IRTQT is well matched to multi-antenna wireless base-station receivers because of its four simultaneous-sampling 14-bit channels and 125 MSPS sampling rate per channel. In a typical 4x4 MIMO LTE or 5G NR receiver chain, each antenna's IF signal (e.g. 30-90 MHz IF output from a wideband down-converter) is digitised by one channel with the SYSREF input locking all four channels to a common reference for sub-sample phase coherence. Compared with a 12-bit alternative, the 14-bit resolution provides roughly 14 dB extra dynamic range, allowing the receiver to tolerate blocker presence and preserve EVM in dense urban deployments.
Empfohlen
Phased-Array Radar Signal Acquisition
In phased-array radar and electronically steered antenna systems, the PADC3444IRTQT digitises the IF outputs from multiple antenna elements in parallel, with each of its four channels handling one sub-array. The integrated input clock divider and SYSREF input let the system designer align sampling instants across an array of ADCs spanning many board sub-systems, eliminating inter-channel skew that would otherwise decorrelate beam-formed output. At 125 MSPS the device comfortably captures IF bandwidth for narrow-band radar plus communications signals, and the 1.8 V analog supply makes it a low-power building block in densely populated phased-array tile designs.
Empfohlen
Software Defined Radio (SDR) Platforms
For software-defined radio designs that target broadband signal capture across multiple bands, the PADC3444IRTQT delivers four observation channels that feed a common FPGA or DSP processing fabric. Each channel can be tuned to a different band via its analog mixer chain before digitisation, enabling truly concurrent multiband monitoring on a single PCB. The 14-bit resolution is sufficient for typical narrow-band signal analysis where SFDR exceeds 70 dBc, and the LVDS/CMOS output options let designers choose between low-power CMOS-to-FPGA interfacing for cost-sensitive boards and high-speed LVDS for sample-rate headroom.
Empfohlen
Broadband Communications Test Equipment
Instruments such as spectrum analyzers, vector signal analyzers, and cable modem head-end test sets use the PADC3444IRTQT to digitise multiple signal ports simultaneously. The four identical channels ensure matched gain and phase response across capture paths, which is essential when correlating transmit/receive pairs or measuring multi-tone intermodulation. With four independent channels on a single chip, the test-equipment manufacturer can shrink the digitiser board from a four-ADC stack-up to one device, lowering BOM cost and board area while simplifying calibration by reducing channel-to-channel variance.
Empfohlen
High-Speed Industrial Imaging Systems
Machine vision and industrial inspection systems operating at line-scan rates beyond 100 kHz use high-speed ADCs like the PADC3444IRTQT to digitise multi-channel photodiode or line-scan camera front-ends. Four channels can capture RGB plus intensity, or stereo image pairs with separate gain paths, in a single converter. The industrial-grade temperature range (-40°C to +85°C) supports deployment in factory-floor enclosures that lack dedicated climate control. The pipelined architecture's low latency between sample and output suits real-time quality-control decisions where defects must be flagged within a single scan line.
Empfohlen
Software Defined Radio Wireless Infrastructure
Multi-band remote-radio-head and small-cell designs use the PADC3444IRTQT's four simultaneous-sampling channels to consolidate what previously required two or three dual-channel ADCs. The integrated input termination saves board real estate around each analog input pin, while the 1.8 V analog supply rails align with FPGA and DSP support chips on the same board. Engineers can use the SYSREF input to align samples across multiple PADC3444 devices on a multi-sector site, ensuring that beamforming algorithms operate on phase-coherent data acquired from all physical antenna chains.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PADC3444IRTQT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ADC3444IRTQ | ADC3443IRTQT | ADC3442IRTQT | ADS6445IRTQCT |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 56-QFN (RTQ) 8x8 mm | 56-QFN (RTQ) 8x8 mm - same | 56-QFN (RTQ) 8x8 mm - same | 56-QFN (RTQ) 8x8 mm - same | 56-QFN (RTQ) 8x8 mm - same |
| Resolution | 14 bit | 14 bit | 14 bit | 14 bit | 14 bit |
| Sampling Rate (max) | 125 MSPS | 125 MSPS | 80 MSPS (family) | 65 MSPS (family) | 125 MSPS |
| Channels | 4 (quad) | 4 (quad) | 4 (quad) | 4 (quad) | 4 (quad) |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| SYSREF Input | Yes | Yes | Yes | Yes | No (legacy family) |
| Operating Temperature | -40°C to +85°C (industrial) | 0°C to +70°C (commercial) | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
Wichtigste Unterscheidungsmerkmale
- Integrated input clock divider reduces external component count (vs. ADS6445IRTQCT (legacy family))
- SYSREF input supports deterministic multi-device synchronisation (vs. ADS6445IRTQCT (legacy family))
- Industrial temperature range over commercial-only same-family cousin (vs. ADC3444IRTQ (commercial-grade))
Designhinweise
Estimated: at AVDD 1.8 V with all four channels active at 125 MSPS, typical analog and digital core current draw approaches 400 mA, producing roughly 0.7 W dissipation in the package. The 56-QFN (RTQ) exposed thermal pad MUST be soldered to a continuous inner-layer ground pour with thermal vias to spread heat; without a proper thermal layout the junction can exceed the datasheet operating limit at full multi-channel load, particularly inside small enclosed outdoor units.
Place 0.1 μF X7R ceramic decoupling capacitors within 3 mm of every AVDD pin and 10 μF bulk capacitors per supply rail close to the IC. Use a continuous ground plane on layer 2; route all analog input pairs (INP/INM) as length-matched 100 Ω differential traces with ±10% length matching to preserve SFDR. Keep digital LVDS/CMOS outputs isolated from analog traces by ground-guard fences to prevent digital-noise coupling into the analog input front-end.
Drive the CLKP/CLKM and SYSREF inputs from a low-jitter LVDS or LVPECL clock source such as the LMK04828 or LMX2594. Total added clock jitter must remain under the budget implied by the desired SNR; for a 70 MHz analog input, target clock jitter below 300 fs RMS. If SYSREF is unused, tie SYSREF_M to DGND and leave SYSREF_P floating only per datasheet guidance; do not let floating SYSREF lines pick up stray noise.
Do not route any digital switching signal directly beneath the analog inputs on the same layer - bypass on the next layer can couple noise into the input pins and degrade SFDR. The MODE pin selects the serial-interface output configuration and must be held static during operation; if reassigned in software without resync the output framing and align accuracy can be lost, breaking multi-channel coherence required by MIMO and phased-array downstream processing.
Compliance-Informationen
RoHS and REACH compliant per TI product page. Industrial-grade, not AEC-Q100 automotive qualified; select automotive-grade TI ADC family members for vehicular applications.
