PIC16F1783-E/MV - 8-bit MCU 32MHz 7KB Flash 28-UQFN | Microchip
Teilenummer: PIC16F1783-E/MV ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.95 | $2,95 |
| 10 | $2.78 | $27,80 |
| 100 | $2.55 | $255,00 |
| 500 | $2.32 | $1.160,00 |
| 1.000 | $2.15 | $2.150,00 |
PIC16F1783-E/MV Übersicht
An 8-bit microcontroller (MCU) is a microprocessor core with an 8-bit data bus, optimized for deterministic real-time control with low power consumption and a small instruction set. Microcontrollers sit at the lowest tier of the embedded-processor hierarchy, below DSP-32 and 32-bit Cortex-M class devices, and are widely used in sensor conditioning, human-interface, motor control and battery-powered nodes. The PIC16F1783 belongs to the enhanced mid-range PIC16F1 family that adds a CIP (Core Independent Peripheral) set including a 12-bit ADC, an 8-bit DAC, op-amps, comparators and PWM/Signal Measurement timers.
Key features of the PIC16F1783-E/MV include 7 KB self-programmable Flash, 512 bytes of SRAM, 256 bytes of EEPROM, a 12-bit ADC with up to 14 channels, an 8-bit DAC, two operational amplifiers, two comparators, PWM modules, EUSART, I2C/SPI, and the eXtreme Low Power (XLP) sleep modes that drop quiescent current into the nanoamp range. The 28-UQFN (4x4 mm) exposed-pad package lowers thermal resistance and lets the part dissipate more power in compact PCB layouts.
The architecture combines a Harvard RISC core with hardware multiplier, interrupt-driven peripheral set, and on-chip debug via ICD. The XLP technology plus nanoWatt XLP features yields typical sleep currents below 50 nA with RTC active, making the part attractive for battery-backed sensor nodes and energy-harvesting designs.
Typical applications include IoT sensor nodes, low-power wireless transmitters (paired with sub-GHz or BLE modules), battery-powered instrumentation, LED lighting controllers, consumer appliances, and small motor/valve control loops where the on-chip op-amps and DAC close the analog loop without external parts.
When designing with this part, allocate the bottom exposed pad to a contiguous ground copper pour; missing the EP connection reduces thermal performance and may cause EEPROM/ADC drift under load. Use MPLAB X IDE with the XC8 compiler and a PICkit 4 or MPLAB SNAP programmer to access the in-circuit debugger.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives drawn from Microchip's own family plus cross-brand equivalents, and practical design notes beyond what the datasheet alone supplies.
Drop-in-Alternativen für PIC16F1783-E/MV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F1783-E/MV (gleiche Bauform und Footprint) – abweichend in Package, ADC, Comparators, Operating Temperature, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F1783-I/MV
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.62 / Stück
Datenblatt ansehen →PIC16F1782-E/MV
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC16F1782-I/MV
✅ Drop-In✓ Auf Lager
$1.18 / Stück
Datenblatt ansehen →PIC16F1782-E/ML
✅ Drop-In✓ Auf Lager
$1.82 / Stück
Datenblatt ansehen →PIC16F1719-E/MV
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.75 / Stück
Datenblatt ansehen →PIC16F1713-E/MV
✅ Drop-In✓ Auf Lager
$1.38 / Stück
Datenblatt ansehen →PIC16F1783-E/MV Grenzwerte & elektrische Eigenschaften
| Product Family | PIC16F178x, 8-bit PIC MCU (enhanced mid-range) |
| Core | 8-bit Harvard RISC, 32 MHz max |
| Instruction Set | PIC16 enhanced mid-range (16-bit instructions) |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| Data SRAM | 512 bytes |
| EEPROM | 256 bytes |
| ADC | 12-bit, up to 14 channels |
| DAC | 8-bit, 1 channel |
| Op-Amps | 2 on-chip |
| Comparators | 2 on-chip |
| Timers/PWM/SMT | Multiple 8/16-bit timers, PWM, Signal Measurement Timer |
| Communication | EUSART, I2C/SPI, mTouch capacitive |
| I/O Pins | Up to 25 (depends on package) |
| Operating Voltage | 1.8 V to 5.5 V |
| Low-Power Features | eXtreme Low Power (XLP), nanoWatt XLP, sleep < 50 nA typ |
| Betriebstemperatur | -40 C to +125 C (E = extended) |
| Gehäuse | 28-UQFN (MV) 4x4 mm with exposed pad |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
PIC16F1783-E/MV Pin-Konfiguration
| Pin 1 | RA5 — Digital I/O / analog input / DAC1 output |
| Pin 2 | RA4 — Digital I/O / analog input |
| Pin 3 | RA3 — Digital I/O / analog input / MCLR |
| Pin 4 | RC5 — Digital I/O |
| Pin 5 | RC4 — Digital I/O |
| Pin 6 | RC3 — Digital I/O / SCL (I2C) |
| Pin 7 | RC6 — Digital I/O / TX (EUSART) |
| Pin 8 | RC7 — Digital I/O / RX (EUSART) |
| Pin 9 | RC0 — Digital I/O |
| Pin 10 | RC1 — Digital I/O |
| Pin 11 | RC2 — Digital I/O |
| Pin 12 | VSS — Ground |
| Pin 13 | VDD — Positive supply (1.8-5.5 V) |
| Pin 14 | RB7 — Digital I/O / ICDPG |
| Pin 15 | RB6 — Digital I/O / ICSPCLK |
| Pin 16 | RB5 — Digital I/O / analog input |
| Pin 17 | RB4 — Digital I/O / analog input |
| Pin 18 | RB3 — Digital I/O / analog input |
| Pin 19 | RB2 — Digital I/O / analog input |
| Pin 20 | RB1 — Digital I/O / analog input |
| Pin 21 | RB0 — Digital I/O / analog input |
| Pin 22 | RA2 — Digital I/O / analog input |
| Pin 23 | RA1 — Digital I/O / analog input / OPA1OUT |
| Pin 24 | RA0 — Digital I/O / analog input |
| Pin 25 | RA7 — Digital I/O / OSC1 |
| Pin 26 | RA6 — Digital I/O / OSC2 |
| Pin 27 | RE3 — Digital I/O (PIC16F1783 only) |
| Pin 28 | RC5 — Digital I/O |
| Pin 29 | EP — Exposed pad - thermal/electrical ground connection (must be soldered) |
Typische Anwendungen
PIC16F1783-E/MV ist geeignet für 6 Anwendungs: Battery-Powered Wireless Sensor Node, LED Lighting Color and Brightness Controller, Low-Power Portable Instrumentation, Industrial Control Loop / Smart Valve, Consumer Appliance User Interface, Capacitive Touch / mTouch Front Panel.
Battery-Powered Wireless Sensor Node
Why the PIC16F1783-E/MV fits wireless sensor nodes: the nanoWatt XLP sleep mode drops quiescent current below 50 nA while keeping the RTC and wake-on-interrupt alive, and the 12-bit ADC with two on-chip op-amps closes the analog front-end for a sensor bridge or thermistor without external components. With 7 KB Flash and 512 B SRAM, the part runs small Zigbee/BLE host stacks paired with a sub-GHz or BLE module. How it is used + performance consideration: the MCU wakes periodically, digitizes one sensor channel, transmits a packet via EUSART/SPI to the radio, and returns to sleep; this duty-cycling can stretch a CR2032 life to multiple years, with trade-off being peak current limited by the radio companion part.
Empfohlen
LED Lighting Color and Brightness Controller
Why the PIC16F1783-E/MV fits LED lighting: the on-chip 12-bit ADC reads ambient light sensors and potentiometers smoothly, the 8-bit DAC and PWM modules mix multiple LED channels with 10-bit resolution, and the two on-chip comparators implement hardware current-limit foldback without external ICs. The 32 MHz core updates 4-8 channel LED control at 1 Hz. How it is used + performance consideration: place the MCU on the LED-driver board; the 8-bit DAC sets a base bias while the PWM modulates brightness, achieving smoother dimming than pure PWM at low duty cycles, with the trade-off of slightly higher MCU load vs single-PWM solutions.
Empfohlen
Low-Power Portable Instrumentation
Why the PIC16F1783-E/MV fits portable instrumentation: the 12-bit ADC delivers 14 channels of measurement for strain, pressure or bioelectric signals, the on-chip op-amps implement gain and active filtering stages, and XLP sleep keeps battery life long between measurements. The 7 KB Flash fits typical UI state machines. How it is used + performance consideration: the MCU samples multiple analog channels, applies digital filtering, displays readings on an OLED, and returns to sleep; battery life on two AAA cells can reach 6-12 months at 5 sample-per-day duty cycle, with trade-off being display current dominates over MCU quiescent current.
Empfohlen
Industrial Control Loop / Smart Valve
Why the PIC16F1783-E/MV fits industrial loops: the 12-bit ADC + 8-bit DAC + on-chip op-amps close a PID loop on a 4-20 mA actuator with minimal external parts, the EUSART serves Modbus RTU slaves, and the 256-byte EEPROM stores calibration constants across power cycles. How it is used + performance consideration: the MCU reads the setpoint, drives the DAC into a current loop, monitors feedback via ADC, and updates the actuator every 10 ms; this 100 Hz loop rate is fast enough for slow process control, with trade-off being the part lacks the isolation needed for hazardous-area use - external isolation is required.
Empfohlen
Consumer Appliance User Interface
Why the PIC16F1783-E/MV fits appliance control: the mTouch capacitive sensing peripheral plus the 12-bit ADC read sliders, buttons and proximity sensors directly, the PWM modules drive motor and buzzer outputs, and XLP sleep keeps standby power below the 0.5 W EU eco-design limits. How it is used + performance consideration: the MCU replaces discrete touch-IC plus logic IC with one chip, reading 8-12 touch pads and updating display/backlight; PCB area drops by 30-40% vs discrete solutions, with trade-off being firmware complexity increases.
Empfohlen
Capacitive Touch / mTouch Front Panel
Why the PIC16F1783-E/MV fits capacitive front panels: the mTouch peripheral uses the CVD (Charge-Voltage Discharge) technique to measure capacitance change without external components, the 12-bit ADC provides noise filtering, and the on-chip op-amps implement active shielding for EMI robustness. How it is used + performance consideration: the MCU scans a matrix of up to 16 touch pads every 8-16 ms with averaging for noise rejection; this 100 Hz scan is comfortable for snappy UX, with trade-off of higher firmware complexity compared to a dedicated touch IC.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F1783-E/MV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F1783-I/MV | PIC16F1782-E/MV | PIC16F1782-I/MV | PIC16F1782-E/ML | PIC16F1719-E/MV | PIC16F1713-E/MV |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (MV) 4x4 mm | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-QFN (ML) 6x6 mm - different footprint | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same |
| Flash | 7 KB | 7 KB | 4 KB | 4 KB | 4 KB | 14 KB | 7 KB |
| SRAM | 512 B | 512 B | 256 B | 256 B | 256 B | 1 KB | 256 B |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 10-bit | 10-bit |
| DAC | 8-bit, 1 ch | 8-bit, 1 ch | 8-bit, 1 ch | 8-bit, 1 ch | 8-bit, 1 ch | none | 5-bit, 1 ch |
| On-Chip Op-Amps | 2 | 2 | 2 | 2 | 2 | 0 | 0 |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Temperature Range | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +125 C (E) |
Wichtigste Unterscheidungsmerkmale
- Higher ADC resolution than PIC16F1719/1713 family (vs. PIC16F1719-E/MV)
- More EEPROM and SRAM than PIC16F1782 sibling (vs. PIC16F1782-E/MV)
- Industrial extended vs automotive grade supply (vs. PIC16F1783-I/MV)
Designhinweise
Estimated: the 28-UQFN exposed pad carries most heat out of the part. Without a continuous GND copper pour under the EP, junction-to-ambient thermal resistance theta_JA can rise from approximately 30 C/W to over 60 C/W on a 1 oz 4-layer PCB, causing EEPROM write/ADC accuracy to drift at high ambient temperatures. Always solder the EP to a 0.5-1.0 sq inch GND copper pour with at least 6 thermal vias.
Route the analog signals (RA0-RA3, RB0-RB3) away from PWM and digital switching traces; place the 0.1 uF VDD bypass capacitor within 3 mm of pin 13 (VDD), with a 10 uF bulk capacitor nearby. The on-chip 12-bit ADC reaches 60+ dB SNR only when source impedance stays below 1 kOhm and digital I/O is quiet during conversion; use the ADC channel-off sequencing in software to avoid digital switching noise.
Estimated: at 32 MHz, 3.3 V, active mode current is roughly 7 mA, dropping to under 1 uA in sleep and below 50 nA in XLP sleep with WDT off. Use the lowest practical FOSC that meets your real-time deadline; on average, halving FOSC from 32 MHz to 16 MHz reduces active power by 45-50% with proportional firmware cycle budget. Disable unused modules via CONFIG words and peripheral disable registers to maximize battery life.
Do not leave the MCLR/RA3 pin floating; a 10 kOhm pull-up to VDD prevents spurious resets. ICD pins (RB6/RB7) used by PICkit 4/SNAP must be reachable on the PCB; if they are bonded to other functions, firmware release builds disable ICD and the pin can be reused - but the PCB layout must allow the debugger access during development. EEPROM endurance is 100 k cycles per cell; rotate write addresses if updating more frequently.
The on-chip op-amps have a unity-gain bandwidth around 1-3 MHz and offset of a few mV; they are well suited for sensor conditioning but not for high-fidelity audio. When chaining op-amp gain stages, keep total gain below 1000 (60 dB) to avoid amplifying noise; use the on-chip 8-bit DAC for bias generation rather than external reference if drift matching matters. For capacitive touch, route shield traces around touch pads and avoid ground planes directly under pads.
Compliance-Informationen
RoHS compliant per Microchip product page and distributor listings. E temperature grade is industrial-extended, not AEC-Q100 automotive-qualified; for AEC-Q100 designs choose the automotive-grade PIC16F1783 variants (separate ordering code).
