PIC24FJ512GL406-E/MR - 16-bit 32MHz 512KB Flash MCU | Microchip
Teilenummer: PIC24FJ512GL406-E/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.1 | $81,00 |
| 100 | $7.3 | $730,00 |
| 500 | $6.55 | $3.275,00 |
| 1.000 | $5.8 | $5.800,00 |
PIC24FJ512GL406-E/MR Übersicht
An MCU (microcontroller unit) is a single-chip computer containing a processor core, program memory, RAM, and peripheral interfaces, designed for embedded control applications. Within the broader category hierarchy, a microcontroller falls under integrated circuits -> microcontrollers -> 16-bit microcontrollers -> PIC24F family, where PIC24F denotes Microchip's 16-bit Flash MCU platform optimized for low-power and mixed-signal applications with peripheral integration including USB and LCD drivers.
Key features of the PIC24FJ512GL406-E/MR include 512KB of self-programmable Flash with dual-partition OTA support, 32KB SRAM, hardware ECC, integrated full-speed USB 2.0 device/host/OTG, integrated segmented LCD driver (up to 60 segments), multiple Core Independent Peripherals (CIPs) including configurable logic cells and numerically controlled oscillator, and a 12-bit A/D converter with up to 16 channels. The 16-bit Modified Harvard architecture delivers 16 MIPS while consuming as little as 150 uA/MHz active current.
Architecturally, the device uses a 16-bit modified Harvard CPU with a 24-bit instruction word, dual-partition Flash allowing simultaneous execution from one partition while writing to the other, and a peripheral pin select (PPS) system that maps digital functions to user-selected pins, simplifying PCB layout. The hardware ECC engine detects and corrects single-bit Flash errors, supporting safety-critical and automotive-style reliability profiles.
Typical applications include IoT sensor nodes with USB diagnostics ports, human-machine interface (HMI) panels with LCD + USB, medical glucose meters and infusion pumps, smart energy metering with segmented LCD readouts, automotive body controllers and instrument clusters, and industrial HMI terminals where OTA firmware update capability, low-power sleep modes, and an integrated LCD driver reduce BOM cost and board area.
When designing with this MCU, ensure VDD is decoupled with a 1uF plus 0.1uF pair within 5 mm of the package pins, route the 32 kHz secondary oscillator away from switching nodes, and budget at least 200 mA total USB VBUS inrush for peripheral-powered designs. Verify the 64-QFN (9x9) thermal pad is soldered to a continuous ground pour for adequate theta_JA under high-active-current loads.
This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC24FJ family, and practical design notes not found in the standalone manufacturer datasheet, including ECC behavior, dual-partition OTA flow, and segmented LCD bias network sizing.
Drop-in-Alternativen für PIC24FJ512GL406-E/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC24FJ512GL406-E/MR (gleiche Bauform und Footprint) – abweichend in Package, ADC, Operating Temperature, Core Architecture, Core.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC24FJ256GL406-I/MR
✅ Drop-In✓ Auf Lager
$3.65 / Stück
Datenblatt ansehen →PIC24FJ256GL406-E/MR
✅ Drop-In✓ Auf Lager
$3.4 / Stück
Datenblatt ansehen →PIC24FJ128GL306T-I/MR
✅ Drop-In✓ Auf Lager
$2.5 / Stück
Datenblatt ansehen →PIC24FJ128GB606-I/MR
✅ Drop-In✓ Auf Lager
$3.62 / Stück
Datenblatt ansehen →PIC24FJ256GU406-E/MR
✅ Drop-In✓ Auf Lager
$5.45 / Stück
Datenblatt ansehen →PIC24FJ512GL406-E/MR Grenzwerte & elektrische Eigenschaften
| Core Architecture | PIC24F (16-bit Modified Harvard) |
| Maximum CPU Frequency | 32 MHz (16 MIPS) |
| Program Flash Memory | 512 KB (dual-partition, OTA-capable) |
| SRAM | 32 KB |
| EEPROM Emulation | Yes (via Flash dual partition) |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| LCD Controller | Integrated segmented LCD driver (up to ~60 segments) |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| Gehäuse | 64-pin QFN (9x9 mm) |
| Betriebstemperaturbereich | -40 C to +125 C (E = extended) |
| Montageart | Surface Mount |
| Core Independent Peripherals | Yes (CLC, NCO, CRC, configurable) |
| Hardware ECC | Yes (Flash single-bit correction) |
| RoHS-Status | ROHS3 Compliant (per MicrochipUSA listing) |
| AEC-Q100 | AEC-Q100 qualified (per MicrochipUSA series listing) |
PIC24FJ512GL406-E/MR 64-pin qfn (9x9 mm) Pinbelegungsleitfaden
Pinbelegung für PIC24FJ512GL406-E/MR (64-pin qfn (9x9 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC24FJ512GL406-E/MR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC24FJ512GL406-E/MR ist geeignet für 6 Anwendungs: IoT Sensor Nodes with USB Diagnostics, Human-Machine Interface (HMI) Panels, Medical Devices (Glucose Meters, Infusion Pumps), Smart Energy Meters with LCD Readout, Automotive Body Controllers and Clusters, Industrial HMI Terminals.
IoT Sensor Nodes with USB Diagnostics
The PIC24FJ512GL406-E/MR fits USB-connected IoT sensor hubs because of its 32 KB SRAM buffer plus USB 2.0 Full-Speed On-The-Go controller, which lets a node enumerate as a CDC or HID device for diagnostics without an external PHY. The 512 KB dual-partition Flash enables real-time Over-The-Air firmware refresh from a USB host or wireless bridge while keeping the sensor telemetry path live, avoiding field downtime. Active current near 150 uA/MHz keeps battery duty cycle feasible for 2xAA or Li-ion powered sensor packages, while the 64-QFN (9x9) footprint and integrated peripherals trim BOM cost versus a discrete MCU + PHY + external EEPROM design. The PPS pin map also lets designers reassign USB D+/D- if the PCB stackup forces routing changes late in development.
Empfohlen
Human-Machine Interface (HMI) Panels
The PIC24FJ512GL406-E/MR is well suited to mid-range HMI panels because the integrated segmented LCD driver handles up to roughly 60 segments directly, eliminating an external LCD bias generator. The 16 MIPS throughput comfortably drives menu refresh, button debouncing, and USB-side configuration updates concurrently. Dual-partition Flash lets field engineers push new HMI screensets and firmware via USB without removing the unit from the wall. The 64-QFN (9x9) package plus integrated peripherals (12-bit ADC for backlight feedback, CTMU for capacitive touch via firmware) keeps board area minimal, while the -40C to +125C extended temperature grade supports outdoor and industrial enclosure installations. Hardware ECC reduces field-return risk for screens with long lifetime expectations.
Empfohlen
Medical Devices (Glucose Meters, Infusion Pumps)
The PIC24FJ512GL406-E/MR suits regulated medical devices because the hardware Flash ECC engine detects and corrects single-bit memory faults, which reduces field-failure risk for IEC 60601-1 and IEC 62304 profile verification. The integrated USB port supports tethered data upload to a clinician's PC, while the segmented LCD driver powers a high-contrast patient display without extra silicon. The 32 KB SRAM buffers trend history between samples, and the 12-bit ADC reads strip-electrode or sensor signals with adequate resolution for diagnostic accuracy. AEC-Q100 qualification and the -40C to +125C grade additionally support medical environments that require strict thermal envelope validation. Dual-partition OTA enables validated firmware revisions across a hospital fleet without unit downtime.
Empfohlen
Smart Energy Meters with LCD Readout
The PIC24FJ512GL406-E/MR serves single-phase smart meters because the integrated segmented LCD driver renders kWh, voltage, and tariff digits directly, eliminating an external display driver. USB enables technician-side firmware updates and consumption-log dumps at installation time without breaking the meter seal. The hardware ECC reduces meter calibration drift caused by Flash bit-flip over a 15+ year deployment horizon. Low-power sleep modes plus the 32 kHz secondary oscillator let the meter maintain RTC and tariff scheduling while drawing microamp-level quiescent current between mains half-cycles. The 64-QFN (9x9) package and integrated peripherals (CTMU for tamper detection, ADC for current sensing) simplify metrology-BOM to MCU plus a shunt.
Empfohlen
Automotive Body Controllers and Clusters
The PIC24FJ512GL406-E/MR fits automotive body controllers and instrument cluster sub-modules because the AEC-Q100 qualified family rating and -40C to +125C operating range cover under-hood and cabin envelopes. The 16 MIPS throughput handles CAN/LIN comms stacks, body-control timers, and cluster gauge refresh concurrently. The 512 KB dual-partition Flash supports end-of-line firmware personalization and post-production feature unlocks via OTA without taking the vehicle out of service. USB is leveraged during ECU bench programming and dealer diagnostics, while hardware ECC mitigates bit-flip risk in vibration-rich underbody mount locations. Integrated CIPs (CLC, NCO, CRC) offload waveform generation and message checksumming from the CPU, freeing MIPS for HMI logic.
Empfohlen
Industrial HMI Terminals
The PIC24FJ512GL406-E/MR suits industrial HMI terminals because the extended temperature grade, dual-partition OTA Flash, and integrated USB simplify maintenance workflows for plant-floor displays. The 16-bit core plus 32 KB SRAM buffers Modbus/serial polling and local-screen refresh concurrently without jitter. The segmented LCD driver supports legacy 7-segment plus icon readouts that remain common in factory equipment retrofits, while the 12-bit ADC reads potentiometer or analog feedback for HMI scaling. Hardware ECC and CIPs (CLC for glue logic replacement, NCO for buzzer tone generation) reduce BOM and improve MTBF versus discrete logic replacements. PPS pin mapping keeps the same PCB reusable across product variants with different connector pinouts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC24FJ512GL406-E/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC24FJ256GL406-I/MR | PIC24FJ256GL406-E/MR | PIC24FJ128GL306T-I/MR | PIC24FJ128GB606-I/MR | PIC24FJ256GU406-E/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash Memory | 512 KB (dual partition) | 256 KB (-50%) | 256 KB (-50%) | 128 KB (-75%) | 128 KB (-75%) | 256 KB (-50%) |
| USB Controller | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| Integrated LCD Driver | Yes (segmented, ~60 seg) | Yes | Yes | Yes | No (GB family) | Yes (GU4 family) |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) |
| Dual-Partition OTA Flash | Yes | Yes | Yes | Yes | Yes (GB family) | Yes |
Wichtigste Unterscheidungsmerkmale
- Dual-partition Flash with hardware ECC and OTA-capable bootloader (vs. PIC24FJ256GL406-I/MR)
- Integrated segmented LCD controller on-chip (vs. PIC24FJ128GB606-I/MR)
- AEC-Q100 qualified with -40C to +125C extended grade (vs. PIC24FJ128GL306T-I/MR)
- Full-speed USB On-The-Go plus 32 KB SRAM (vs. PIC24FJ256GU406-E/MR)
Designhinweise
Estimated: At 32 MHz active, VDD = 3.3 V and typical 150 uA/MHz active current (per Microchip datasheet), the PIC24FJ512GL406-E/MR draws approximately 4.8 mA core plus USB and ADC contribution. Place a 10 uF tantalum plus 100 nF ceramic within 5 mm of the VDD pins, with the 100 nF closest to the package, plus a separate 100 nF on the AVdd pin when the ADC is enabled. For USB-powered designs, size VBUS bulk capacitance to at least 10 uF per the USB 2.0 inrush specification; bypass with a TVS diode rated for 5 V transient suppression.
Estimated: The 64-QFN (9x9) package with exposed thermal pad (EP) has theta_JA in the 25-30 C/W range on a 4-layer 1-oz PCB with continuous ground pour under the EP. At 4.8 mA active core plus ADC plus USB load (typical 30 mA peak), the total power dissipation is well under 150 mW and the junction-to-ambient temperature rise stays below 4-5 C, so no external heatsink is required. The EP must be soldered to a continuous copper pour with at least 8 thermal vias to the inner ground plane; skip-via EP designs will exceed 60 C/W and risk thermal shutdown during sustained active operation.
Route the 32.768 kHz secondary oscillator traces as short as possible and guard them with a ground ring to keep the RTC stable during USB and LCD switching transitions. The LCD segment traces should be kept away from high-frequency USB D+/D- pairs to avoid injected ripple on the segmented display; route USB as a 90-ohm differential pair per the USB 2.0 specification. Use the peripheral pin select (PPS) feature to remap digital peripherals onto pins adjacent to their external connectors, keeping I/O traces under 50 mm to preserve signal integrity at 32 MHz.
Do not skip the dual-partition bootloader configuration when programming the GL4 family: without the IVT bootloader setup, the OTA swap mechanism does not engage and the second partition becomes inaccessible. Avoid configuring the on-chip LCD charge pump at full bias when VDD is below 2.5 V, as segment contrast drops noticeably. The hardware ECC engine does not correct multi-bit errors; your application must handle ECC double-bit fault interrupts (if enabled) to avoid silent data corruption in long-life deployments.
Compliance-Informationen
ROHS3 Compliant and AEC-Q100 automotive qualified per MicrochipUSA listing. Reach compliance assumed via Microchip corporate statement (not present in verified data: marked unknown for halogen-free).
