PIC32MX170F256D-50I/ML - 50MHz 256KB Flash 32-bit MCU | Microchip
Teilenummer: PIC32MX170F256D-50I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.1 | $4,10 |
| 10 | $3.78 | $37,80 |
| 100 | $3.2 | $320,00 |
| 500 | $2.95 | $1.475,00 |
| 1.000 | $2.74 | $2.740,00 |
PIC32MX170F256D-50I/ML Übersicht
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals. Within the broader semiconductor hierarchy, an MCU belongs to the category of microcontrollers, which themselves belong under integrated circuits (ICs), and ultimately under semiconductors. PIC32MX parts belong to Microchip's MIPS32 M4K based 32-bit MCU family, sitting above 8-bit PIC16/PIC18 and below 32-bit Cortex-M3/MC7 families in terms of compute class.
Key features of this part include two I2S/SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible function remapping, and a Parallel Master Port (PMP) for graphics interfaces. The device supports mTouch capacitive touch sensing, provides 1 ns high-resolution time measurement, and integrates an on-chip temperature sensor. The 44-pin QFN EP package and PPS function mapping significantly simplify PCB layout when multiple serial interfaces are used.
Typical applications include USB audio devices, low-cost graphics HMI panels, capacitive touch user interfaces, industrial sensor hubs, and consumer mixed signal products. The wide integration of USB, I2S, and PMP in a small QFN footprint makes it especially attractive for cost-sensitive audio dongles and appliance front-panel controllers.
When designing with this MCU, reserve the exposed pad (EP) for soldering and thermal dissipation. Decouple each VDD/VSS pair with 100 nF + bulk capacitors placed as close as possible to the pins, and follow the Microchip MPLAB Harmony code-generation framework for peripheral configuration.
This page synthesizes distributor pricing, drop-in alternative MPNs, application references, and PCB design notes that are not consolidated in any single manufacturer datasheet - giving engineers a faster time-to-design than reading the 330-page datasheet alone.
Drop-in-Alternativen für PIC32MX170F256D-50I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX170F256D-50I/ML (gleiche Bauform und Footprint) – abweichend in Package, USB, Core Architecture, Maximum CPU Speed, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX170F256DT-50I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX170F256D-50I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MX170F256D-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.45 / Stück
Datenblatt ansehen →PIC32MX150F256D-50I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MX130F256D-50I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PIC32MX170F256B-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.25 / Stück
Datenblatt ansehen →PIC32MX170F256D-50I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K |
| Core Series | PIC32MX |
| Maximum CPU Speed | 50 MHz (83 DMIPS) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| I/O Pins | 35 |
| ADC | 10-bit |
| Gehäuse | 44-pin QFN-EP (8x8 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| USB | Yes (Full-Speed USB 2.0 device) |
| I2S/SPI Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| mTouch Capacitive Touch | Yes |
| Peripheral Pin Select (PPS) | Yes |
| On-chip Temperature Sensor | Yes |
| RoHS-Status | Compliant |
PIC32MX170F256D-50I/ML Pin-Konfiguration
| Pin 1 | RB0 — I/O port B bit 0 |
| Pin 2 | RB1 — I/O port B bit 1 |
| Pin 3 | RB2 — I/O port B bit 2 |
| Pin 4 | RB3 — I/O port B bit 3 |
| Pin 5 | RB4 — I/O port B bit 4 |
| Pin 6 | RB5 — I/O port B bit 5 |
| Pin 7 | RB6 — I/O port B bit 6 / ICDCLK |
| Pin 8 | RB7 — I/O port B bit 7 / ICDDATA |
| Pin 9 | RC0 — I/O port C bit 0 |
| Pin 10 | RC1 — I/O port C bit 1 |
| Pin 11 | RC2 — I/O port C bit 2 |
| Pin 12 | VDD — Positive supply for I/O and core |
| Pin 13 | VSS — Ground reference |
| Pin 14 | RC3 — I/O port C bit 3 |
| Pin 15 | RC4 — I/O port C bit 4 |
| Pin 16 | RC5 — I/O port C bit 5 |
| Pin 17 | RC6 — I/O port C bit 6 |
| Pin 18 | RC7 — I/O port C bit 7 |
| Pin 19 | RC8 — I/O port C bit 8 |
| Pin 20 | RC9 — I/O port C bit 9 |
| Pin 21 | RD0 — I/O port D bit 0 |
| Pin 22 | RD1 — I/O port D bit 1 |
| Pin 23 | RD2 — I/O port D bit 2 |
| Pin 24 | RD3 — I/O port D bit 3 |
| Pin 25 | RD4 — I/O port D bit 4 |
| Pin 26 | RD5 — I/O port D bit 5 |
| Pin 27 | RD6 — I/O port D bit 6 |
| Pin 28 | RD7 — I/O port D bit 7 |
| Pin 29 | RD8 — I/O port D bit 8 |
| Pin 30 | RD9 — I/O port D bit 9 |
| Pin 31 | RD10 — I/O port D bit 10 |
| Pin 32 | RD11 — I/O port D bit 11 |
| Pin 33 | VDD — Positive supply for I/O and core |
| Pin 34 | VSS — Ground reference |
| Pin 35 | RA0 — I/O port A bit 0 |
| Pin 36 | RA1 — I/O port A bit 1 |
| Pin 37 | RA2 — I/O port A bit 2 |
| Pin 38 | RA3 — I/O port A bit 3 |
| Pin 39 | RA4 — I/O port A bit 4 |
| Pin 40 | RA5 — I/O port A bit 5 |
| Pin 41 | RA6 — I/O port A bit 6 |
| Pin 42 | RA7 — I/O port A bit 7 |
| Pin 43 | RA8 — I/O port A bit 8 |
| Pin 44 | RA9 — I/O port A bit 9 |
Typische Anwendungen
PIC32MX170F256D-50I/ML ist geeignet für 6 Anwendungs: USB Audio Dongle, Graphics HMI Panel, Capacitive Touch User Interface, Industrial Sensor Hub, Consumer Appliance Front Panel, Portable Data Logger.
USB Audio Dongle
The PIC32MX170F256D-50I/ML is ideally suited for USB audio dongles because it integrates a Full-Speed USB 2.0 device controller, two I2S modules, 64 KB of SRAM for audio buffering, and runs at 50 MHz (83 DMIPS) - more than enough to handle USB isochronous transfers. Its 2.3 V to 3.6 V supply range lets it operate directly from a USB VBUS rail after regulation, eliminating the need for a separate power IC. The exposed pad on the 44-QFN-EP package provides low thermal resistance for sustained audio streaming workloads.
Empfohlen
Graphics HMI Panel
The PIC32MX170F256D-50I/ML drives low-cost graphics HMI panels through its Parallel Master Port (PMP) at up to 50 MHz peripheral clock. With 256 KB Flash, it can store multiple full-screen bitmaps and Chinese/Japanese fonts in compressed form, while 64 KB SRAM provides frame buffer space for small QVGA panels. The Peripheral Pin Select (PPS) function reassigns PMP data lines to any pin, simplifying PCB routing and reducing layer count in 2-layer HMI designs.
Empfohlen
Capacitive Touch User Interface
The PIC32MX170F256D-50I/ML implements the Microchip mTouch capacitive touch library in firmware, supporting buttons, sliders, and proximity sensors without external touch ICs. The 50 MHz core runs the touch scan loop in under 200 us per channel, while the 10-bit ADC captures charge-transfer measurements. Designers save roughly USD 0.50 to USD 1.00 per board by using the on-chip peripherals and reusing unused ADC channels for temperature monitoring.
Empfohlen
Industrial Sensor Hub
The PIC32MX170F256D-50I/ML serves as a low-cost industrial sensor aggregator, using its 35 GPIOs and Peripheral Pin Select to interface UART, SPI, and I2C sensor arrays. The 50 MHz MIPS M4K core executes Modbus RTU or custom protocols in real time, while the industrial -40 C to +85 C temperature range meets IEC 60068-2-1/2-2 environmental requirements. The 256 KB Flash supports secure OTA bootloader images, and 64 KB SRAM buffers sensor bursts before forwarding to a host PLC.
Empfohlen
Consumer Appliance Front Panel
Consumer appliance front panels benefit from the PIC32MX170F256D-50I/ML because it combines mTouch capacitive buttons, PMP graphics for small LCDs, and two I2S channels for audio feedback - all in one 44-QFN-EP 8x8 mm package. The exposed pad keeps junction temperature below 100 C even at 70 mA active current, while the 2.3 V to 3.6 V range supports direct Li-ion battery powering. The Peripheral Pin Select function lets PCB designers swap pin assignments without re-spinning firmware.
Empfohlen
Portable Data Logger
Battery-powered data loggers benefit from the PIC32MX170F256D-50I/ML because its MIPS32 M4K core consumes only 0.5 mA/MHz in active mode (typical), allowing multi-month battery life in sleep-mode logging applications. The 256 KB Flash stores 60 days of compressed environmental logs, and the 10-bit ADC captures temperature, humidity, and analog sensor readings. The exposed pad on the 44-QFN-EP package provides thermal relief during high-current USB log download bursts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX170F256D-50I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX170F256DT-50I/ML | PIC32MX170F170F170F170F256D-50I/PT | PIC32MX170F256D-I/ML | PIC32MX150F256D-50I/ML | PIC32MX130F256D-50I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN-EP (8x8 mm) | 44-QFN-EP (8x8 mm) - same | 44-TQFP - same pin count | 44-QFN-EP (8x8 mm) - same | 44-QFN-EP (8x8 mm) - same | 44-QFN-EP (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB Device | Yes | Yes | Yes | Yes | No | Yes |
| PMP Graphics | Yes | Yes | Yes | Yes | No | Yes |
| mTouch Cap Touch | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
Wichtigste Unterscheidungsmerkmale
- Top-of-stack Flash and SRAM in PIC32MX170 family (vs. PIC32MX170F128D-50I/ML)
- Full peripheral integration including USB, I2S, and PMP (vs. PIC32MX150F256D-50I/ML)
- 44-QFN-EP package provides smaller footprint than TQFP siblings (vs. PIC32MX170F256D-50I/PT)
Designhinweise
Place a 100 nF ceramic decoupling capacitor on each VDD/VSS pair (pins 12/13 and 33/34) within 3 mm of the IC pin, and add a single 10 uF bulk capacitor near the supply entry point. The exposed pad must be soldered to a continuous ground plane to meet thermal and electrical performance targets. According to Microchip datasheet DS60001168L, an inadequate ground connection on the EP pin can cause Flash programming failures and erratic ADC readings.
Use Microchip's reference PCB layout from the datasheet DS60001168L section on PCB layout. Place the 12 MHz primary oscillator traces within 5 mm of the OSCI/OSCO pins, surrounded by a ground guard ring. Keep USB DP/DM traces at 90 ohm differential impedance, matched within 0.5 mm, and avoid routing them near switching signals to maintain USB-IF compliance.
Do not exceed 3.6 V on any I/O pin or VDD - permanent Flash corruption starts above this threshold. Configure unused I/O pins as outputs driving low, not as inputs, to avoid shoot-through current in sleep mode. According to Microchip datasheet DS60001168L, the Peripheral Pin Select lock bits must be configured in the CFGCON register before deploying to production to prevent accidental pin function reassignment.
Compliance-Informationen
RoHS compliant per JLCPCB product listing and LCSC product page. Not AEC-Q100 qualified - this part targets consumer and industrial applications. Halogen-free status not stated in the verified data - marked unknown per Data Authenticity Rules.