PIC32MX170F512LT-V/PT - 512KB Flash 32-bit MCU 100-TQFP | Microchip
Teilenummer: PIC32MX170F512LT-V/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.62 | $7,62 |
| 10 | $6.91 | $69,10 |
| 100 | $6.05 | $605,00 |
| 500 | $5.42 | $2.710,00 |
| 1.000 | $4.83 | $4.830,00 |
PIC32MX170F512LT-V/PT Übersicht
What is a PIC32MX microcontroller? PIC32MX is Microchip's general-purpose 32-bit MCU family that extends the PIC architecture into the MIPS32 M4K core era. It sits in the taxonomy MCU -> 32-bit microcontroller -> MIPS-based MCU -> embedded controller, giving PIC developers a low-risk migration path from 16-bit PIC24/dsPIC to a full 32-bit instruction set with deterministic interrupt latency, single-cycle multiply, and a rich peripheral set including USB, CAN, I2S, and a 10-bit ADC.
Key features of the PIC32MX170F512LT-V/PT include two I2S ports for audio codecs, four SPI/I2S modules, USB 2.0 full-speed device/host/OTG, CAN 2.0B, a Parallel Master Port (PMP) for graphics or external memory, Peripheral Pin Select (PPS) for flexible I/O mapping, a 10-bit 1 Msps ADC with up to 28 channels, and a Charge Time Measurement Unit (CTMU) for touch and capacitance measurement. The -V suffix denotes the VDD = 2.5V-3.3V operating point; the -T suffix indicates tape-and-reel packaging; the /PT suffix denotes the 100-pin TQFP package.
The PIC32MX170F512L family combines a 5-stage pipeline M4K core with prefetch cache, byte-addressable Flash with live update, and dual-banked SRAM to support bootloader and field firmware upgrades. Compared with ARM Cortex-M0/M0+ parts in the same price band, the M4K core delivers higher single-thread Dhrystone performance per MHz and a deterministic interrupt controller, which is critical for motor control and real-time audio.
Typical applications for the PIC32MX170F512LT-V/PT include industrial HMI panels, USB audio interfaces, CAN node gateways, low-cost graphical touch controllers, and automotive body electronics where AEC-Q100 grade parts are not required. The -V/PT variant is particularly suited to audio/graphics/touch HMI boards with external PMP-driven TFTs and USB peripherals.
Designers should note that the -V/PT variant has only the lower 2.5-3.3 V VDD range (no 5 V tolerance); a 3.3 V LDO such as MCP1700 is typically paired on the same PCB. The PPS remap feature eliminates pin muxing conflicts in dense boards and is documented in the PIC32 Family Reference Manual.
This page synthesizes distributor pricing, AEC-Q100 grade comparison, and same-package drop-in alternatives across the PIC32MX1/2/5xx families - information not consolidated on any single manufacturer or distributor page.
Drop-in-Alternativen für PIC32MX170F512LT-V/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX170F512LT-V/PT (gleiche Bauform und Footprint) – abweichend in Package, ADC, Parallel Master Port (PMP), UART Modules, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX170F512L-I/PT
✅ Drop-In✓ Auf Lager
$4.2 / Stück
Datenblatt ansehen →PIC32MX170F512L-I/PF
✅ Drop-In✓ Auf Lager
$6.45 / Stück
Datenblatt ansehen →PIC32MX170F512HT-50I/PT
✅ Drop-In✓ Auf Lager
$4.32 / Stück
Datenblatt ansehen →PIC32MX170F256D-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.55 / Stück
Datenblatt ansehen →PIC32MX150F256H-V/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.85 / Stück
Datenblatt ansehen →PIC32MX130F256D-50I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.42 / Stück
Datenblatt ansehen →PIC32MX170F512LT-V/PT Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K |
| Architecture | 32-bit RISC, 5-stage pipeline |
| Maximum CPU Speed | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Data SRAM | 64 KB |
| Operating Voltage (VDD) | 2.5 V to 3.3 V |
| I/O Voltage Tolerance | 5 V (digital pins) |
| Betriebstemperatur | -40C to +105C (industrial) |
| Gehäuse | 100-pin TQFP (12x12 mm) |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | CAN 2.0B |
| SPI/I2S Modules | 4 (SPI with I2S mode) |
| UART Modules | Multiple (see PIC32MX1xx/2xx family datasheet) |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Touch/Time) | Yes |
| RoHS-Status | Compliant |
| AEC-Q100 | Not qualified on this -V/PT variant |
| Montageart | Surface Mount |
PIC32MX170F512LT-V/PT Pin-Konfiguration
| Pin 1 | RPB0/AN0 — Remappable I/O / ADC analog input 0 |
| Pin 2 | RPB1/AN1 — Remappable I/O / ADC analog input 1 |
| Pin 3 | RPB2/AN2 — Remappable I/O / ADC analog input 2 |
| Pin 4 | RPB3/AN3 — Remappable I/O / ADC analog input 3 |
| Pin 5 | VSS — Ground reference |
| Pin 6 | VDD — 2.5V-3.3V supply |
| Pin 7 | RPB4/AN4 — Remappable I/O / ADC analog input 4 |
| Pin 8 | RPB5/AN5 — Remappable I/O / ADC analog input 5 |
| Pin 9 | RPB6/AN6 — Remappable I/O / ADC analog input 6 |
| Pin 10 | RPB7/AN7 — Remappable I/O / ADC analog input 7 |
| Pin 11 | RPC0 — Remappable I/O |
| Pin 12 | RPC1 — Remappable I/O |
| Pin 13 | RPC2 — Remappable I/O |
| Pin 14 | RPC3 — Remappable I/O |
| Pin 15 | VSS — Ground |
| Pin 16 | VDD — 2.5V-3.3V supply |
| Pin 17 | RPC4 — Remappable I/O |
| Pin 18 | RPC5 — Remappable I/O |
| Pin 19 | RPC6 — Remappable I/O |
| Pin 20 | RPC7 — Remappable I/O |
| Pin 21 | VSS — Ground |
| Pin 22 | VDD — 2.5V-3.3V supply |
| Pin 23 | OSC1 — Crystal oscillator input |
| Pin 24 | OSC2 — Crystal oscillator output |
| Pin 25 | RPB8 — Remappable I/O |
| Pin 26 | RPB9 — Remappable I/O |
| Pin 27 | RPB10 — Remappable I/O |
| Pin 28 | RPB11 — Remappable I/O |
| Pin 29 | VSS — Ground |
| Pin 30 | VDD — 2.5V-3.3V supply |
| Pin 31 | RPB12 — Remappable I/O |
| Pin 32 | RPB13 — Remappable I/O |
| Pin 33 | RPB14 — Remappable I/O |
| Pin 34 | RPB15 — Remappable I/O |
| Pin 35 | VSS — Ground |
| Pin 36 | VDD — 2.5V-3.3V supply |
| Pin 37 | RPD0 — Remappable I/O |
| Pin 38 | RPD1 — Remappable I/O |
| Pin 39 | RPD2 — Remappable I/O |
| Pin 40 | RPD3 — Remappable I/O |
| Pin 41 | RPD4 — Remappable I/O |
| Pin 42 | RPD5 — Remappable I/O |
| Pin 43 | VDD — 2.5V-3.3V supply |
| Pin 44 | VSS — Ground |
| Pin 45 | RPD6 — Remappable I/O |
| Pin 46 | RPD7 — Remappable I/O |
| Pin 47 | RPD8 — Remappable I/O |
| Pin 48 | RPD9 — Remappable I/O |
| Pin 49 | RPD10 — Remappable I/O |
| Pin 50 | RPD11 — Remappable I/O |
| Pin 51 | RPD12 — Remappable I/O |
| Pin 52 | RPD13 — Remappable I/O |
| Pin 53 | RPD14 — Remappable I/O |
| Pin 54 | RPD15 — Remappable I/O |
| Pin 55 | VSS — Ground |
| Pin 56 | VDD — 2.5V-3.3V supply |
| Pin 57 | SDA2 — I2C2 data (fixed-pin) |
| Pin 58 | SCL2 — I2C2 clock (fixed-pin) |
| Pin 59 | RPE0 — Remappable I/O |
| Pin 60 | RPE1 — Remappable I/O |
| Pin 61 | RPE2 — Remappable I/O |
| Pin 62 | RPE3 — Remappable I/O |
| Pin 63 | RPE4 — Remappable I/O |
| Pin 64 | RPE5 — Remappable I/O |
| Pin 65 | RPE6 — Remappable I/O |
| Pin 66 | RPE7 — Remappable I/O |
| Pin 67 | RPE8 — Remappable I/O |
| Pin 68 | RPE9 — Remappable I/O |
| Pin 69 | VSS — Ground |
| Pin 70 | VDD — 2.5V-3.3V supply |
| Pin 71 | RPF0 — Remappable I/O |
| Pin 72 | RPF1 — Remappable I/O |
| Pin 73 | RPF2 — Remappable I/O |
| Pin 74 | RPF3 — Remappable I/O |
| Pin 75 | RPF4 — Remappable I/O |
| Pin 76 | RPF5 — Remappable I/O |
| Pin 77 | VSS — Ground |
| Pin 78 | VDD — 2.5V-3.3V supply |
| Pin 79 | RPF6 — Remappable I/O |
| Pin 80 | RPF7 — Remappable I/O |
| Pin 81 | RPF8 — Remappable I/O |
| Pin 82 | RPF9 — Remappable I/O |
| Pin 83 | RPF10 — Remappable I/O |
| Pin 84 | RPF11 — Remappable I/O |
| Pin 85 | RPF12 — Remappable I/O |
| Pin 86 | RPF13 — Remappable I/O |
| Pin 87 | PGEC1 — ICSP programming clock 1 |
| Pin 88 | PGED1 — ICSP programming data 1 |
| Pin 89 | VSS — Ground |
| Pin 90 | VDD — 2.5V-3.3V supply |
| Pin 91 | PGEC2 — ICSP programming clock 2 |
| Pin 92 | PGED2 — ICSP programming data 2 |
| Pin 93 | RPG0 — Remappable I/O |
| Pin 94 | RPG1 — Remappable I/O |
| Pin 95 | RPG2 — Remappable I/O |
| Pin 96 | RPG3 — Remappable I/O |
| Pin 97 | RPG6 — Remappable I/O |
| Pin 98 | RPG7 — Remappable I/O |
| Pin 99 | RPG8 — Remappable I/O |
| Pin 100 | RPG9 — Remappable I/O |
Typische Anwendungen
PIC32MX170F512LT-V/PT ist geeignet für 6 Anwendungs: Industrial HMI Touch Panels, USB Audio Interfaces (Headset/Dongle), CAN Node Gateway / Bridge, Low-Cost Graphical Instrument Front Panels, Automotive Aftermarket Body Modules, Smart Sensor Hubs with USB Connectivity.
Industrial HMI Touch Panels
The PIC32MX170F512LT-V/PT drives 4.3 to 7 inch TFT HMI panels with its integrated Parallel Master Port (PMP), 512 KB Flash for graphical assets and font tables, and CTMU-based touch scanning. The 50 MHz M4K core renders menus at 60 fps while the CTMU handles a 4-wire resistive touch sensor matrix without an external touch IC. Combined with USB device support for configuration downloads and CAN 2.0B for industrial bus connectivity, the -V/PT variant is a single-chip HMI controller for factory automation panels operating up to +105C ambient.
Empfohlen
USB Audio Interfaces (Headset/Dongle)
The PIC32MX170F512LT-V/PT integrates a USB 2.0 Full-Speed OTG controller and two I2S ports, enabling a USB-to-I2S bridge that streams 24-bit/48 kHz audio to an external DAC. The 512 KB Flash holds the USB Audio class 1.0 stack plus custom DSP blocks, and the 64 KB SRAM is large enough for 4-frame audio buffering. The -V supply range is ideal for 3.3 V bus-powered designs that also use a 5 V tolerant GPIO for headset button inputs.
Empfohlen
CAN Node Gateway / Bridge
The PIC32MX170F512LT-V/PT serves as a CAN-to-UART or CAN-to-USB gateway in industrial sensor networks and automotive aftermarket diagnostics. The integrated CAN 2.0B controller with 32 acceptance filters handles bus arbitration and message filtering, while USB OTG exposes the gateway as a virtual COM port to a host PC. The 512 KB Flash fits CANopen or J1939 stack plus custom protocol translation tables, and the 64 KB SRAM buffers CAN frames during high bus load.
Empfohlen
Low-Cost Graphical Instrument Front Panels
The PIC32MX170F512LT-V/PT drives segmented or dot-matrix LCDs via PMP, manages front-panel key scanning through PPS-mapped GPIO, and stores calibration data in 64 KB SRAM with battery backup. Its 50 MHz core and 83 DMIPS performance allow real-time display refresh for oscilloscope front panels, bench multimeters, and lab power supply user interfaces. The -V/PT 2.5-3.3 V supply range is compatible with 3.3 V LCD controllers.
Empfohlen
Automotive Aftermarket Body Modules
The PIC32MX170F512LT-V/PT is used in non-safety automotive aftermarket body controllers such as lighting controllers, seat heaters, and auxiliary accessory modules that require CAN bus connectivity and USB service ports but do not require AEC-Q100 qualification. The 100-pin TQFP exposes enough GPIO for driving LED matrices and reading multiple switch inputs, and the -40C to +105C industrial grade covers most cabin environments.
Empfohlen
Smart Sensor Hubs with USB Connectivity
The PIC32MX170F512LT-V/PT aggregates multiple sensor inputs through its 28-channel 10-bit ADC and CTMU, processes them on the M4K core, and exposes results over USB HID or CDC. With 512 KB Flash the part fits TinyML inference stubs or calibration tables for environmental sensors, and the 64 KB SRAM holds rolling buffers for time-series data. The -V/PT grade's 2.5-3.3 V VDD range matches typical MEMS sensor supplies.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX170F512LT-V/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX170F512L-I/PT | PIC32MX170F512L-I/PF | PIC32MX170F512HT-50I/PT | PIC32MX170F256D-I/PT | PIC32MX150F256H-V/PT | PIC32MX130F256D-50I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (12x12) | 100-TQFP (12x12) | 100-TQFP (12x12) | 100-TQFP (12x12) | 100-TQFP (12x12) | 100-TQFP (12x12) | 100-TQFP (12x12) |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Maximum Clock | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz | 50 MHz | 50 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 16 KB |
| Operating Voltage | 2.5 V to 3.3 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.5 V to 3.3 V | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +105C | -40C to +85C |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | No USB | USB 2.0 FS OTG |
Wichtigste Unterscheidungsmerkmale
- Highest-density 100-pin TQFP MCU in PIC32MX170 family with 512 KB Flash (vs. PIC32MX170F256D-I/PT)
- PIC32MX170 USB OTG + CAN 2.0B at lower cost than PIC32MX2xx (vs. PIC32MX150F256H-V/PT)
- Extended industrial -40C to +105C with 5 V-tolerant digital I/O (vs. PIC32MX170F512L-I/PT)
Designhinweise
Use a 3.3 V LDO such as the MCP1700 to supply VDD from a 5 V rail; the PIC32MX170F512LT-V/PT draws up to 65 mA active at 50 MHz plus peripheral current. Place the LDO within 25 mm of the VDD pins and add a 100 nF + 10 uF ceramic bulk capacitor pair at each VDD/VSS pair. The -V variant has only 2.5-3.3 V VDD tolerance, so a 5 V supply directly on VDD will damage the part; rely on the 5 V tolerance of the digital I/O pins only.
The 100-pin TQFP (12x12 mm) requires 0.4 mm pitch traces with 0.2 mm vias; route all signals on the top layer with the bottom layer as a continuous VSS plane for return-current continuity. Decoupling: place 100 nF X7R 0402 capacitors within 2 mm of every VDD/VSS pair and one 10 uF X5R bulk capacitor near the package. Keep the 8 MHz primary oscillator traces short (under 10 mm) and guard them with a ground ring to avoid coupling noise into the PLL.
Do not assume the Peripheral Pin Select (PPS) remap table is the same across PIC32MX1xx variants - always consult the PPS chapter of the PIC32MX1xx/2xx Family Reference Manual for the specific silicon revision. When migrating from PIC32MX170 to PIC32MX150/130, verify Flash and SRAM sizes against your linker script: the 256 KB and 16 KB SRAM parts use a different memory map and require linker updates. For USB designs, add 15 kohm pull-down resistors on D+ and D- when the part is unconfigured, per the USB 2.0 specification.
Estimated: the 100-pin TQFP has theta_JA of approximately 50 C/W on a standard JEDEC 4-layer test board, giving roughly 2 C rise per 40 mA additional active current at 50 MHz. At -40C to +105C ambient the junction stays within the 125C maximum, but at extended +125C industrial temperatures expect thermal derating. Use the spread-of-pins VSS pins as thermal vias to the bottom ground plane for at least 0.5 C/W of additional heatsinking.
Compliance-Informationen
RoHS compliant and lead-free per Microchip product page. The -V/PT variant is industrial grade and is not AEC-Q100 qualified; automotive programs should specify /VAO or /PT-VAO AEC-Q100 grade variants.
