PIC32MX350F256HT-V/MR - 32-bit MCU, 256KB Flash, 64-VQFN | Microchip
Teilenummer: PIC32MX350F256HT-V/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.82 | $5,82 |
| 10 | $5.24 | $52,40 |
| 100 | $4.66 | $466,00 |
| 500 | $4.12 | $2.060,00 |
| 1.000 | $3.65 | $3.650,00 |
PIC32MX350F256HT-V/MR Übersicht
What is a PIC32MX3xx microcontroller? The PIC32MX3x/4x series from Microchip Technology is a family of MIPS32 M4K-based 32-bit microcontrollers positioned in the broader PIC32 (32-bit MCU) hierarchy, which itself sits inside the microcontroller product tree (microcontroller -> embedded MCU -> semiconductor). The M4K core executes MMIX-compatible MIPS32 instructions at up to 120 MHz with hardware multiply/divide and a 5-stage pipeline, offering roughly 1.5 DMIPS/MHz. The PIC32MX350F256HT-V/MR integrates 256 KB program Flash and 64 KB SRAM on-chip, supporting either 2.5 V or 3.3 V operation. The 'V' suffix denotes -40C to +105C operation, qualifying this part for industrial and AEC-Q100 Grade 2 automotive environments as referenced in the Microchip part ordering nomenclature.
Key features include 256 KB Flash, 64 KB SRAM, 80 MHz core, USB 2.0 Full-Speed device/host/OTG, up to 28 ADC channels at 10-bit resolution, two analog comparators, two SPI/I2S, two I2C, five 16-bit timers, and an RTCC. The MMIX/MIPS32 instruction set is binary-compatible with the broader MIPS32 ecosystem, easing software porting from other PIC32MX devices. Multiple power management modes (Idle, Sleep, Deep Sleep with RTCC and WDT wake-up) reduce average power for IoT-style battery duty cycles.
Typical applications include USB peripherals, industrial control (PLCs, sensor hubs, motor control sub-systems), automotive body and HMI modules operating in -40C to +105C environments, consumer audio processing, and low-power IoT edge nodes. The integrated USB 2.0 Full-Speed controller enables CDC, HID, MSD, and vendor-class designs without an external PHY.
When designing with this device, allocate the 64 KB SRAM carefully - large USB buffers and stacks can consume 30-50% of available RAM. Configure the 10-bit ADC sampling time based on source impedance to avoid degraded linearity.
Drop-in-Alternativen für PIC32MX350F256HT-V/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX350F256HT-V/MR (gleiche Bauform und Footprint) – abweichend in Package, ADC, Operating Temperature, USB, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX350F256H-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX350F256HT-I/MR
✅ Drop-In✓ Auf Lager
$3.55 / Stück
Datenblatt ansehen →PIC32MX340F256H-80V/MR
✅ Drop-In✓ Auf Lager
$5.09 / Stück
Datenblatt ansehen →PIC32MX340F512HT-80V/MR
✅ Drop-In✓ Auf Lager
$4.31 / Stück
Datenblatt ansehen →PIC32MX330F064HT-V/MR
✅ Drop-In✓ Auf Lager
$4.12 / Stück
Datenblatt ansehen →PIC32MX270F512HT-V/MR
✅ Drop-In✓ Auf Lager
$2.53 / Stück
Datenblatt ansehen →PIC32MX350F256HT-V/MR Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K 32-bit |
| CPU Architecture | MIPS / MMIX (MIPS32 ISA) |
| Maximum Core Speed | 120 MHz (150 DMIPS) |
| Program Memory | 256 KB Flash |
| Data Memory | 64 KB SRAM |
| Operating Voltage | 2.5 V / 3.3 V |
| Betriebstemperatur | -40C to +105C (V grade) |
| Gehäuse | 64-VQFN (MR) 9x9 mm |
| Montageart | Surface Mount |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 10-bit, up to 28 channels |
| Analog Comparators | 2 |
| SPI / I2S | 2 |
| I2C | 2 |
| Timers | Five 16-bit Timer/Counter modules |
| Pinout Variant | T = Tape & Reel |
| AEC-Q100 | Grade 2 qualified (automotive V grade) |
| RoHS | Compliant |
PIC32MX350F256HT-V/MR Pin-Konfiguration
| Pin 1 | RB9 — I/O port B, bit 9 / PGREEB |
| Pin 2 | RB10 — I/O port B, bit 10 |
| Pin 3 | RB11 — I/O port B, bit 11 |
| Pin 4 | RB12 — I/O port B, bit 12 |
| Pin 5 | RB13 — I/O port B, bit 13 |
| Pin 6 | VSS — Ground reference |
| Pin 7 | VDD — Positive supply voltage (2.5V/3.3V) |
| Pin 8 | RA0 — I/O port A, bit 0 |
| Pin 9 | RA1 — I/O port A, bit 1 |
| Pin 10 | RA2 — I/O port A, bit 2 |
| Pin 11 | RA3 — I/O port A, bit 3 |
| Pin 12 | RA4 — I/O port A, bit 4 |
| Pin 13 | RA5 — I/O port A, bit 5 |
| Pin 14 | VSS — Ground reference |
| Pin 15 | VDD — Positive supply voltage (2.5V/3.3V) |
| Pin 16 | RA6 — I/O port A, bit 6 |
| Pin 17 | RA7 — I/O port A, bit 7 |
| Pin 18 | RB0 — I/O port B, bit 0 / PGRE0 (programming) |
| Pin 19 | RB1 — I/O port B, bit 1 |
| Pin 20 | RB2 — I/O port B, bit 2 |
| Pin 21 | RB3 — I/O port B, bit 3 |
| Pin 22 | RB4 — I/O port B, bit 4 |
| Pin 23 | RB5 — I/O port B, bit 5 |
| Pin 24 | RB6 — I/O port B, bit 6 / PGRE6 (programming) |
| Pin 25 | RB7 — I/O port B, bit 7 |
| Pin 26 | RB8 — I/O port B, bit 8 |
| Pin 27 | VSS — Ground reference |
| Pin 28 | VDD — Positive supply voltage (2.5V/3.3V) |
| Pin 29 | RC0 — I/O port C, bit 0 |
| Pin 30 | RC1 — I/O port C, bit 1 |
| Pin 31 | RC2 — I/O port C, bit 2 |
| Pin 32 | RC3 — I/O port C, bit 3 |
| Pin 33 | RC4 — I/O port C, bit 4 |
| Pin 34 | RC5 — I/O port C, bit 5 |
| Pin 35 | RC6 — I/O port C, bit 6 |
| Pin 36 | RC7 — I/O port C, bit 7 |
| Pin 37 | RC8 — I/O port C, bit 8 |
| Pin 38 | RC9 — I/O port C, bit 9 |
| Pin 39 | VSS — Ground reference |
| Pin 40 | VDD — Positive supply voltage (2.5V/3.3V) |
| Pin 41 | RD0 — I/O port D, bit 0 |
| Pin 42 | RD1 — I/O port D, bit 1 |
| Pin 43 | RD2 — I/O port D, bit 2 |
| Pin 44 | RD3 — I/O port D, bit 3 |
| Pin 45 | RD4 — I/O port D, bit 4 |
| Pin 46 | RD5 — I/O port D, bit 5 |
| Pin 47 | RD6 — I/O port D, bit 6 |
| Pin 48 | RD7 — I/O port D, bit 7 |
| Pin 49 | RD8 — I/O port D, bit 8 |
| Pin 50 | RD9 — I/O port D, bit 9 |
| Pin 51 | RD10 — I/O port D, bit 10 |
| Pin 52 | RD11 — I/O port D, bit 11 |
| Pin 53 | RD12 — I/O port D, bit 12 |
| Pin 54 | RD13 — I/O port D, bit 13 |
| Pin 55 | RD14 — I/O port D, bit 14 |
| Pin 56 | RD15 — I/O port D, bit 15 |
| Pin 57 | VSS — Ground reference |
| Pin 58 | VDD — Positive supply voltage (2.5V/3.3V) |
| Pin 59 | RF0 — I/O port F, bit 0 |
| Pin 60 | RF1 — I/O port F, bit 1 |
| Pin 61 | RF2 — I/O port F, bit 2 |
| Pin 62 | RF3 — I/O port F, bit 3 |
| Pin 63 | RF4 — I/O port F, bit 4 |
| Pin 64 | RF5 — I/O port F, bit 5 / USB D- |
| Pin EP | EP — Exposed thermal pad (must be soldered to PCB ground) |
Typische Anwendungen
PIC32MX350F256HT-V/MR ist geeignet für 7 Anwendungs: USB Human Interface Device (HID) Peripherals, Industrial Sensor Hubs and PLCs, Automotive Body Electronics and HMI, Consumer Audio and DSP Front-End, Low-Power IoT Edge Nodes, USB-to-UART / Virtual COM Port Bridges, Motor Control Sub-Systems.
USB Human Interface Device (HID) Peripherals
The PIC32MX350F256HT-V/MR integrates a USB 2.0 Full-Speed controller with on-chip transceiver supporting Device, Host, and OTG modes, eliminating the need for an external PHY. With 256 KB Flash, the part comfortably fits full USB HID stacks (bootloader + application + HID report descriptors), while 64 KB SRAM provides ample buffer space for HID reports and ring buffers. The 120 MHz MIPS M4K core executes HID class handlers in microseconds, well below the USB 1 ms polling interval. Operate from 3.3 V USB VBUS-derived supply; place a 1 uF ceramic decoupling cap within 5 mm of each VDD/VSS pair.
Empfohlen
Industrial Sensor Hubs and PLCs
The PIC32MX350F256HT-V/MR delivers 120 MHz MIPS M4K performance with 5-stage pipeline, executing PLC scan loops in under 1 ms even with full peripheral servicing. The 28-channel 10-bit ADC supports multi-sensor aggregation for industrial sensor hubs (temperature, pressure, flow) with simultaneous sampling on shared ADC channels. The 2 analog comparators enable hardware over-current/over-voltage protection independent of CPU. The 2 SPI/I2S ports allow direct connection to industrial DACs and ADCs. Operate from 2.5 V or 3.3 V; the -40C to +105C V grade covers industrial cabinet environments.
Empfohlen
Automotive Body Electronics and HMI
The PIC32MX350F256HT-V/MR is AEC-Q100 Grade 2 qualified (-40C to +105C) per the V temperature suffix, making it suitable for automotive body and HMI modules including HVAC control panels, instrument cluster sub-displays, and lighting controllers. The 256 KB Flash accommodates CAN-compatible J1939 or vendor-proprietary stacks plus HMI graphics drivers; 64 KB SRAM supports double-buffered display rendering. The 2 SPI/I2S ports interface directly to automotive audio DACs for chimes/announcements. Use automotive-grade bypass capacitors (AEC-Q200) and a robust power supply with reverse-battery and load-dump protection.
Empfohlen
Consumer Audio and DSP Front-End
The PIC32MX350F256HT-V/MR's 2 SPI/I2S ports enable direct interfacing with audio CODECs and DACs, supporting stereo 16/24-bit audio at 48 kHz with DSP pre-processing (EQ, dynamics, mixing) executed on the 120 MHz MIPS M4K core. The 256 KB Flash fits lightweight audio effects libraries, and 64 KB SRAM supports 5-10 ms audio buffer latency at 48 kHz stereo (3840 bytes per 10 ms at 16-bit). The 5-stage pipeline delivers 150 DMIPS, sufficient for moderate DSP workloads. The integrated USB 2.0 Full-Speed port enables USB Audio Class 1.0 device implementations (speaker/microphone).
Empfohlen
Low-Power IoT Edge Nodes
The PIC32MX350F256HT-V/MR offers multiple low-power modes including Idle, Sleep, and Deep Sleep with RTCC and WDT wake-up, enabling battery-powered IoT edge nodes with multi-year coin-cell lifetimes at duty cycles under 1%. The 64 KB SRAM allows larger packet buffers for LoRa/Sigfox/Thread edge protocols before wake-up processing. The integrated 10-bit ADC supports direct battery voltage monitoring and sensor interfaces. The 2 I2C ports interface with low-power digital sensors. Operate from 2.5 V for primary battery chemistries; leverage Deep Sleep with RTCC for sub-10 uA average current at 0.1% duty cycle.
Empfohlen
USB-to-UART / Virtual COM Port Bridges
The PIC32MX350F256HT-V/MR's integrated USB 2.0 Full-Speed controller with 2 UART peripherals makes it ideal for USB-to-UART bridge designs (CDC virtual COM port). The 256 KB Flash accommodates the USB CDC stack plus custom vendor protocols, and 64 KB SRAM supports buffering for high baud rates up to 921600 bps without flow control. The 120 MHz core executes USB protocol overhead in minimal CPU cycles, freeing resources for user-defined behavior. Operate from USB VBUS-derived 3.3 V; add 4.7 uF bulk cap on USB VBUS for hot-plug inrush support.
Empfohlen
Motor Control Sub-Systems
The PIC32MX350F256HT-V/MR with 120 MHz MIPS M4K core, 5 16-bit timers (with input capture and PWM output), 2 analog comparators, and 28-channel 10-bit ADC provides a foundation for BLDC, PMSM, and stepper motor control sub-systems. The Output Compare/PWM modules generate complementary PWM with dead-time insertion for 3-phase inverters at up to 100 kHz switching frequency. The 256 KB Flash accommodates sensorless FOC algorithm libraries plus CAN-based command interfaces. The -40C to +105C V grade handles industrial motor ambient environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX350F256HT-V/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX350F256H-I/MR | PIC32MX350F256HT-I/MR | PIC32MX340F256H-80V/MR | PIC32MX340F512HT-80V/MR | PIC32MX330F064HT-V/MR | PIC32MX270F512HT-V/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same | 64-VQFN (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 M4K, 120 MHz | MIPS32 M4K, 120 MHz | MIPS32 M4K, 120 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 120 MHz | MIPS32 M4K, 50 MHz/120 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB (+100%) | 64 KB (-75%) | 512 KB (+100%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 8 KB (-87.5%) | 64 KB |
| Operating Temperature | -40C to +105C (V grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +105C (V grade) |
| USB | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG |
| AEC-Q100 | AEC-Q100 Grade 2 | Not qualified (industrial only) | Not qualified (industrial only) | AEC-Q100 Grade 2 | AEC-Q100 Grade 2 | AEC-Q100 Grade 2 | AEC-Q100 Grade 2 |
| Sub-Family | PIC32MX350 | PIC32MX350 | PIC32MX350 | PIC32MX340 | PIC32MX340 | PIC32MX330 | PIC32MX270 |
Wichtigste Unterscheidungsmerkmale
- USB 2.0 Full-Speed on-chip PHY and 256 KB Flash in 64-VQFN (vs. PIC32MX330F064HT-V/MR)
- AEC-Q100 Grade 2 qualification with 256 KB Flash (vs. PIC32MX350F256H-I/MR)
- 120 MHz core speed with 256 KB Flash (vs. PIC32MX340F256H-80V/MR)
- Latest PIC32MX3xx sub-family peripherals (vs. PIC32MX270F512HT-V/MR)
Designhinweise
Estimated: at full USB activity with all peripherals active at 120 MHz CPU and 60 MHz USB clock, the PIC32MX350F256HT-V/MR core draws approximately 70-90 mA from a 3.3 V supply. Place a 4.7 uF bulk capacitor and 100 nF decoupling capacitor within 5 mm of each VDD/VSS pair (the part has 5 VDD/VSS pairs spread around the 64-VQFN). For USB bus-powered designs, derive VBUS through a 1.5 kΩ pull-up to D+ only after stable 3.3 V is achieved. The exposed thermal pad must be soldered to a continuous ground copper pour of at least 100 mm² to keep junction rise below 20 C at full load.
The 64-VQFN (MR) package uses a 9x9 mm body with 0.5 mm lead pitch and a 7x7 mm exposed thermal pad (EP) at the bottom-center. Per IPC-27 or JEDEC MO-220 package guidelines, the PCB land pattern should use NSMD (non-solder mask defined) pads for better solder joint reliability under thermal cycling. Maintain a continuous ground copper pour beneath the package to support the EP. Keep analog signals (ADC inputs, comparator inputs) physically separated from digital switching signals (PWM outputs, USB data lines) on different regions of the layout, and provide separate analog and digital ground domains joined at the VDEC.
The PIC32MX350F256HT-V/MR requires configuration bits to be set correctly for brown-out reset (BOR), watchdog timer (WDT), and JTAG/ICSP disable for production. Forgetting to disable JTAG can leave PGECx/PGEDx pins unavailable for GPIO. The 64 KB SRAM must be partitioned between application RAM, USB endpoint buffers (each endpoint pair consumes ~1500 bytes), and the heap/stack; overflowing the heap into USB buffer space causes intermittent CDC disconnects. The internal 8 MHz FRC has ±20% accuracy - USB mode requires the primary oscillator or 48 MHz USB PLL for USB Full-Speed compliance.
The USB D+/D- lines require 27Ω to 33Ω series termination resistors placed within 5 mm of the MCU; the differential impedance must be 90Ω ±15% per USB 2.0 specification. For ADC sampling at 500 ksps or higher, route analog inputs away from PWM outputs and digital clocks; use ground guards around analog pins. The SPI/I2S data lines can run up to 25 MHz at 120 MHz peripheral bus clock - keep traces under 50 mm and use series termination for longer runs. For I2C bus runs over 100 mm, add 4.7 kΩ pull-ups to 3.3 V and consider a buffer.
