PIC32MX350F256HT-I/MR - 80MHz 32-bit MCU 256KB Flash | Microchip
MPN: PIC32MX350F256HT-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.16 | $6.16 |
| 10 | $5.78 | $57.80 |
| 100 | $5.05 | $505.00 |
| 500 | $4.45 | $2,225.00 |
| 1,000 | $3.92 | $3,920.00 |
| 3,300 | $3.55 | $11,715.00 |
PIC32MX350F256HT-I/MR Overview
A 32-bit microcontroller (MCU) is a single-chip computer integrating a high-performance CPU core, Flash program memory, RAM, and peripheral blocks such as ADC, timers, and communication controllers. Within the embedded hierarchy, PIC32MX belongs to: microcontroller -> 32-bit MCU -> MIPS-based MCU -> RISC MCU -> CMOS integrated circuit. The MIPS32 M4K core provides hardware multiply/divide and a 5-stage pipeline, enabling 1.56 DMIPS/MHz efficiency which makes PIC32MX MCUs suitable for signal processing, USB, and graphics user-interface tasks that 8/16-bit MCUs cannot sustain.
Key features of the PIC32MX350F256HT-I/MR include: 80 MHz core (up to 100 MHz on -100I speed grade), 256 KB Flash with live-update capability, 64 KB SRAM, 28 ADC channels at 10-bit 1 Msps, USB 2.0 Full-Speed OTG, 5 timers/counters, 5 UART, 2 SPI/I2S, 2 I2C, PMP (Parallel Master Port) for graphics or external memory, and a CTMU (Charge Time Measurement Unit) for touch and capacitive sensing. Industrial-grade -40C to +85C operation supports harsh-environment deployment.
The internal 8 MHz FRC oscillator with PLL provides flexible system clocking and minimizes external crystal count. Hardware DMA, PMP bus mastering, and dedicated peripheral bus reduce CPU load in USB-audio, USB-HID, or TFT-display designs. A separate 16 KB device Flash page is dedicated to the USB bootloader for field-upgradeable firmware without an external programmer.
Typical applications include industrial control HMIs with TFT panels, USB peripherals (CDC, HID, mass storage, audio), IoT edge nodes, sensor fusion, motor control, and consumer audio. The wide peripheral mix supports both connectivity (USB, UART) and analog front-end integration in a single chip.
When designing with this MCU, allocate 16 KB of Flash for the USB bootloader if field-upgradeability is required and reserve a complete Flash page for live-update operations. Always connect the EP (exposed pad) of the VQFN-64 to a clean ground plane with multiple thermal vias for proper heat dissipation and electrical reference.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from the PIC32MX3xx family datasheet and Microchip reference designs - information not consolidated on any single distributor page.
Drop-in alternatives for PIC32MX350F256HT-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX350F256HT-I/MR (same form factor and footprint) — differing in ADC, Package, Operating Temperature, Timers, DMA Channels.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX350F256H-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX350F256H-V/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX350F256HT-100I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX350F256HT-120I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX250F256HT-I/MR
✅ Drop-In✓ In Stock
$3.35 / Unit
View Datasheet →PIC32MX270F512HT-50I/MR
✅ Drop-In✓ In Stock
$4.74 / Unit
View Datasheet →PIC32MX340F512HT-80I/MR
✅ Drop-In✓ In Stock
$4.36 / Unit
View Datasheet →PIC32MX450F256HT-I/MR
✅ Drop-In✓ In Stock
$4.2 / Unit
View Datasheet →PIC32MX350F256HT-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Data Bus Width | 32-bit |
| Maximum CPU Frequency | 80 MHz (100 MHz on -100I grade) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage | 2.5 V / 3.3 V |
| Supply Voltage Range | 2.3 V to 3.6 V |
| ADC | 10-bit, up to 28 channels, 1 Msps |
| DAC | None |
| Timers | 5 x 16-bit |
| UART | 5 |
| SPI / I2S | 2 |
| I2C | 2 |
| USB | USB 2.0 Full-Speed OTG |
| Parallel Master Port (PMP) | Yes |
| CTMU (Capacitive Touch) | Yes |
| DMA Channels | Yes (hardware DMA) |
| Operating Temperature | -40C to +85C (Industrial -I) |
| Package | 64-pin VQFN (9x9 mm) with EP |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
PIC32MX350F256HT-I/MR Pin Configuration
| Pin 1 | RA0 — Port A bit 0 / AN0 / VREF- |
| Pin 2 | RA1 — Port A bit 1 / AN1 / VREF+ |
| Pin 3 | RA2 — Port A bit 2 / AN2 |
| Pin 4 | RA3 — Port A bit 3 / AN3 |
| Pin 5 | RA4 — Port A bit 4 / AN4 |
| Pin 6 | RA5 — Port A bit 5 / AN5 |
| Pin 7 | RA6 — Port A bit 6 / AN6 / TRCLK |
| Pin 8 | RA7 — Port A bit 7 / AN7 |
| Pin 9 | RB0 — Port B bit 0 / PGED1 |
| Pin 10 | RB1 — Port B bit 1 / PGEC1 |
| Pin 11 | RB2 — Port B bit 2 / AN8 |
| Pin 12 | RB3 — Port B bit 3 / AN9 |
| Pin 13 | RB4 — Port B bit 4 / AN10 |
| Pin 14 | RB5 — Port B bit 5 / AN11 |
| Pin 15 | RB6 — Port B bit 6 / AN12 |
| Pin 16 | RB7 — Port B bit 7 / AN13 |
| Pin 17 | RB8 — Port B bit 8 / AN14 |
| Pin 18 | RB9 — Port B bit 9 / AN15 |
| Pin 19 | RB10 — Port B bit 10 |
| Pin 20 | RB11 — Port B bit 11 |
| Pin 21 | RB12 — Port B bit 12 |
| Pin 22 | RB13 — Port B bit 13 |
| Pin 23 | RB14 — Port B bit 14 |
| Pin 24 | RB15 — Port B bit 15 |
| Pin 25 | RC0 — Port C bit 0 |
| Pin 26 | RC1 — Port C bit 1 |
| Pin 27 | RC2 — Port C bit 2 |
| Pin 28 | RC3 — Port C bit 3 |
| Pin 29 | RC4 — Port C bit 4 |
| Pin 30 | RC5 — Port C bit 5 |
| Pin 31 | RC6 — Port C bit 6 |
| Pin 32 | RC7 — Port C bit 7 |
| Pin 33 | RC8 — Port C bit 8 |
| Pin 34 | RC9 — Port C bit 9 |
| Pin 35 | RC10 — Port C bit 10 |
| Pin 36 | RC11 — Port C bit 11 |
| Pin 37 | RC12 — Port C bit 12 |
| Pin 38 | RC13 — Port C bit 13 |
| Pin 39 | RC14 — Port C bit 14 |
| Pin 40 | RC15 — Port C bit 15 |
| Pin 41 | RD0 — Port D bit 0 |
| Pin 42 | RD1 — Port D bit 1 |
| Pin 43 | RD2 — Port D bit 2 |
| Pin 44 | RD3 — Port D bit 3 |
| Pin 45 | RD4 — Port D bit 4 |
| Pin 46 | RD5 — Port D bit 5 |
| Pin 47 | RD6 — Port D bit 6 |
| Pin 48 | RD7 — Port D bit 7 |
| Pin 49 | RD8 — Port D bit 8 |
| Pin 50 | RD9 — Port D bit 9 |
| Pin 51 | RD10 — Port D bit 10 |
| Pin 52 | RD11 — Port D bit 11 |
| Pin 53 | RD12 — Port D bit 12 |
| Pin 54 | RD13 — Port D bit 13 |
| Pin 55 | RD14 — Port D bit 14 |
| Pin 56 | RD15 — Port D bit 15 |
| Pin 57 | VDD — Power supply (3.3V) |
| Pin 58 | VSS — Ground |
| Pin 59 | VUSB — USB voltage regulator input |
| Pin 60 | VBUS — USB VBUS detect |
| Pin 61 | D+ — USB D+ data line |
| Pin 62 | D- — USB D- data line |
| Pin 63 | OSC1 — Crystal oscillator input |
| Pin 64 | OSC2 — Crystal oscillator output |
Typical Applications
PIC32MX350F256HT-I/MR is suitable for 7 applications: Industrial HMI with TFT Display, USB Peripherals (HID / CDC / Mass Storage), IoT Sensor Hub / Edge Node, Capacitive Touch Control Panel, Consumer Audio / USB Audio Device, Motor Control and BLDC Driver, Data Logger / Sensor Recorder.
Industrial HMI with TFT Display
The PIC32MX350F256HT-I/MR drives industrial TFT panels through its integrated Parallel Master Port (PMP), eliminating the need for an external graphics controller in small to mid-size displays. With 64 KB of SRAM and the MIPS M4K core running at 80 MHz (or 100 MHz on the -100I speed grade), this part sustains GUI render loops at 30 fps for panels up to 320x240 pixels. The two SPI/I2S blocks can run as display backlight and touch-controller interfaces simultaneously. Use PIC32MX350F256HT-I/MR between the main power rail (3.3V) and the display driver; the exposed pad must be soldered to ground with at least four thermal vias to dissipate the 150 mA peak current at full CPU load.
Recommended
USB Peripherals (HID / CDC / Mass Storage)
PIC32MX350F256HT-I/MR integrates a USB 2.0 Full-Speed OTG controller with 12 Mbps Device, Host, and On-The-Go modes, enabling single-chip USB keyboards, CDC serial adapters, and mass-storage devices without external PHY. The dedicated 16 KB USB bootloader Flash region supports field-upgradeable firmware through USB mass storage, a key requirement for in-the-field provisioning. Place a 1uF X7R bypass capacitor within 5 mm of VUSB, and follow the USB-IF schematic and layout checklist (90-ohm differential impedance) for reliable 12 Mbps operation. This is more cost-effective than STM32F0 + external USB transceiver designs for cost-sensitive USB HID products.
Recommended
IoT Sensor Hub / Edge Node
PIC32MX350F256HT-I/MR integrates 256 KB Flash and 64 KB SRAM, which is sufficient for TCP/IP stacks (Microchip Harmony) and sensor-fusion algorithms on local I2C/SPI sensors. The 10-bit ADC with 28 channels supports direct connection of analog sensor arrays, eliminating external ADC ICs and BOM cost. Operating at -40C to +85C industrial range, the part withstands outdoor edge deployments. Use PIC32MX350F256HT-I/MR between the 3.3V LDO and downstream UART/Wi-Fi modules; the DMA engine offloads UART and ADC buffering from the CPU, leaving MIPS budget for application logic.
Recommended
Capacitive Touch Control Panel
PIC32MX350F256HT-I/MR integrates the CTMU (Charge Time Measurement Unit) which is Microchip's dedicated hardware peripheral for capacitive touch buttons, sliders, and proximity sensors. The CTMU combines with the ADC to measure capacitance changes with sub-pF resolution, supporting reliable touch interfaces through up to 5 mm of plastic overlay. The industrial-grade -40C to +85C temperature range suits kitchen appliances and industrial equipment. Use PIC32MX350F256HT-I/MR between the touch PCB and the host MCU; the exposed pad serves both as thermal relief and as a low-impedance ground reference for noise-sensitive analog charge measurements.
Recommended
Consumer Audio / USB Audio Device
PIC32MX350F256HT-I/MR implements USB Audio class 1.0 devices through its USB OTG controller and two I2S ports, supporting sample rates up to 48 kHz at 16-bit resolution. The two dedicated I2S peripherals connect to external DACs and ADCs without consuming SPI bandwidth. The 5-stage MIPS pipeline sustains software-based sample-rate conversion and mixing at modest DSP overhead. Place PIC32MX350F256HT-I/MR between the 3.3V LDO and the USB connector with proper 90-ohm USB differential routing; USB audio streams add no switching noise to the audio path because the USB clock is independent of the I2S clock.
Recommended
Motor Control and BLDC Driver
PIC32MX350F256HT-I/MR drives 3-phase brushless DC motors using its 5 x 16-bit timers, PWM outputs, and ADC triggering for back-EMF sensing. The MIPS M4K core computes FOC (field-oriented control) loops at 80 MHz with sample-to-update latency below 2 us. The 28-channel ADC simultaneously samples phase currents and bus voltage. Use PIC32MX350F256HT-I/MR between the 3.3V logic supply and the gate-driver stage; the exposed pad must be soldered to a continuous ground plane with thermal vias to dissipate up to 600 mW under full computational load.
Recommended
Data Logger / Sensor Recorder
PIC32MX350F256HT-I/MR combines 256 KB Flash for compressed data storage and 64 KB SRAM for streaming logs to external SD cards via SPI. The 10-bit ADC sampling at 1 Msps captures fast transients from current shunts or strain gauges. The 5 UART peripherals support simultaneous GPS, cellular modem, and diagnostic interfaces. Place PIC32MX350F256HT-I/MR between the 3.3V LDO and the SD-card socket; the DMA engine offloads SPI byte transfers so the CPU can manage filesystem tasks and time-stamping without throughput bottlenecks.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX350F256HT-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX350F256H-I/MR | PIC32MX350F256HT-100I/MR | PIC32MX270F512HT-50I/MR | PIC32MX450F256HT-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9 mm) EP | VQFN-64 (9x9 mm) EP - same | VQFN-64 (9x9 mm) EP - same | VQFN-64 (9x9 mm) EP - same | VQFN-64 (9x9 mm) EP - same |
| Max CPU Frequency | 80 MHz | 80 MHz | 100 MHz | 50 MHz | 80 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB OTG | Yes | Yes | Yes | Yes | Yes |
| PMP | Yes (8-bit) | Yes (8-bit) | Yes (8-bit) | Yes (8-bit) | Yes (16-bit) |
| CTMU (Cap Touch) | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx Unit Price (1-pc) | $6.16 | Similar | Higher (~+20%) | Lower (~-15%) | Higher (~+10%) |
Key Differentiators
- Integrated USB OTG with bootloader Flash (vs PIC32MX270F512HT-50I/MR)
- CTMU hardware capacitive touch support (vs PIC32MX340F512HT-80I/MR)
- 256 KB Flash at 80 MHz with 64 KB RAM (vs PIC32MX250F256HT-I/MR)
Design Notes
PIC32MX350F256HT-I/MR operates from 2.3V to 3.6V (datasheet DS60001185K). Place a 1uF X7R ceramic decoupling capacitor within 5 mm of the VDD pin (pin 57) and a second 100 nF ceramic directly on the VDD-VSS pair. For USB applications, route VUSB through an LC filter and place a 1uF bulk cap on the USB regulator output. Use a 4.7uF to 10uF bulk capacitor near the VBUS pin for OTG current transients. Estimated: total 3.3V current consumption peaks at 150 mA with CPU + USB active, so the upstream LDO must supply at least 200 mA with adequate thermal margin.
The VQFN-64 package has a thermal pad (EP) on pin 65 that must be soldered to a ground plane with at least 4 thermal vias (0.3 mm drill, 0.6 mm pad) for heat dissipation. Without proper EP soldering, junction temperature rises 30-40C above ambient and may trigger thermal-reset at 85C ambient. Estimated: at 80 MHz CPU + USB + ADC active, total power dissipation is approximately 360 mW (3.3V x 110 mA); with theta_JA of 28 C/W on a 4-layer PCB, junction rises about 10C above ambient. For industrial -I grade parts operating at +85C, this leaves no margin - confirm with on-board measurement.
For USB Full-Speed designs, route the D+ and D+ lines as a 90-ohm differential pair with continuous ground reference on the layer below. Match trace lengths to within 150 mil. Per Microchip TB055 reference design, USB certification requires a 2-4 layer PCB with controlled impedance. The exposed pad must connect to the same ground plane as the D+/D- return path. Avoid routing any switching signals parallel to the USB differential pair within 50 mil clearance. Do not use ferrite beads inline with the USB data lines.
Common design pitfalls: (1) Forgetting to solder the exposed pad (EP), which causes thermal shutdown and unreliable ADC readings. (2) Using a 32.768 kHz crystal on SOSC0/SOSC1 instead of the primary 8 MHz POSCIN/POSCOUT oscillator pins (63, 64) - the primary oscillator requires an 8-25 MHz crystal for PLL operation. (3) Driving an I2C bus without external pull-up resistors - PIC32MX I/Os are open-drain only on the I2C pins; 4.7 kohm to 10 kohm pull-ups are mandatory. (4) Programming pins PGED1/PGEC1 (RB0/RB1) used as I/O - they must be reconfigured after ICSP programming to avoid bus contention. (5) Forgetting to configure the ADC channel-prescan registers before triggering scans, leading to multi-channel sampling order mismatch with DMA buffer expectations.
Place the 8 MHz primary oscillator crystal as close as possible to the OSC1/OSC2 pins (63, 64), with short symmetric traces and a guard ring tied to analog ground. Keep high-speed digital signals (PWM, SPI) away from the oscillator and from the ADC analog pins. Per Microchip TB085 reference design, the analog supply (AVDD) should be filtered separately from VDD through a ferrite bead. The CTMU charge-routing tracks should be of equal length for balanced touch measurements. Route USB differential pairs on the top layer with continuous ground below for optimal 90-ohm impedance.
Compliance Information
RoHS and REACH compliant per Microchip product page DS60001185K datasheet. Not AEC-Q100 qualified; for automotive applications choose -V grade variants such as PIC32MX350F256H-V/MR (not validated against AEC-Q100 in the verified data).
