PIC32MX270F512HT-V/MR - 32-bit MCU 512KB Flash USB | Microchip
MPN: PIC32MX270F512HT-V/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.84 | $5.84 |
| 10 | $5.2 | $52.00 |
| 100 | $4.62 | $462.00 |
| 500 | $3.95 | $1,975.00 |
| 1,000 | $3.42 | $3,420.00 |
| 3,000 | $2.53 | $7,590.00 |
PIC32MX270F512HT-V/MR Overview
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit processor core, program memory, data memory, and configurable peripherals on a single die. In the embedded hierarchy, the PIC32MX sits within Microchip's PIC32 family of MIPS-based microcontrollers, which target mid-range applications requiring more performance than 8-bit/16-bit PIC MCUs but with simpler development flow than Cortex-M parts. The PIC32MX1XX/2XX/5XX 64/100-pin family specifically targets Audio/Graphics/Touch HMI, USB, CAN, and Advanced Analog applications.
Key features of the PIC32MX270F512HT-V/MR include up to 50 MHz operation (40 MHz for the -V speed grade), 512 KB Flash and 64 KB SRAM, USB 2.0 Full-Speed On-The-Go with integrated transceiver, three I2S/SPI modules, four SPI (two I2S + four SPI total mentioned in family doc), Peripheral Pin Select for flexible peripheral routing, and an Analog block with 10-bit ADC, CTMU for capacitive touch, and comparators. The 'V' speed grade operates from -40C to +105C and the 'T' suffix indicates Tape and Reel.
Typical applications include USB peripherals, audio/HMI front panels with graphics, capacitive-touch interfaces, industrial control, and CAN-connected nodes. The QFN-64 9x9 mm footprint enables compact designs with good thermal dissipation through the exposed pad. The integrated USB OTG controller eliminates external PHY requirements for device and host modes.
When designing with this MCU, ensure proper decoupling (100 nF + bulk caps near each VDD pin), connect the exposed pad to a solid ground plane for thermal/electrical performance, and follow Microchip's PIC32 family reference manual for clock, JTAG, and PPS configuration. Programming is supported via MPLAB X IDE and XC32 compiler.
This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MX270F512HT-V/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX270F512HT-V/MR (same form factor and footprint) — differing in ADC, Package, Timers, USB, Operating Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX270F512HT-50I/MR
✅ Drop-In✓ In Stock
$4.74 / Unit
View Datasheet →PIC32MX270F512HT-50I/PT
✅ Drop-In✓ In Stock
$4.2 / Unit
View Datasheet →PIC32MX250F256H-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.12 / Unit
View Datasheet →PIC32MX230F256D-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MX170F512H-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.65 / Unit
View Datasheet →PIC32MX270F512HT-V/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K (32-bit RISC) |
| Maximum Clock Frequency | 50 MHz (-V speed grade operates up to 40 MHz core / 50 MHz peripheral) |
| DMIPS Performance | 83 DMIPS |
| Program Flash Memory | 512 KB |
| SRAM | 64 KB |
| Package | 64-pin QFN (9x9 mm) with exposed thermal pad |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Operating Temperature Range | -40 C to +105 C (V grade) |
| USB Controller | USB 2.0 Full-Speed On-The-Go (Device/Host) |
| I2S Modules | 2 (Three I2S/SPI shared modules total) |
| SPI Modules | 4 (Two I2S + Four SPI shared modules) |
| Peripheral Pin Select (PPS) | Yes - flexible peripheral pin mapping |
| Parallel Master Port (PMP) | Yes - dual read/write buffers for graphics |
| ADC | 10-bit 1 Msps, up to 48 channels |
| Comparators | Yes (3) |
| CTMU (Capacitive Touch) | Yes |
| RTCC (Real-Time Clock/Calendar) | Yes |
| CAN | Yes (CAN 2.0B) |
| Mounting Type | Surface Mount (QFN) |
| RoHS Status | Compliant |
PIC32MX270F512HT-V/MR 64-pin qfn (9x9 mm) with exposed thermal pad Pin Configuration Guide
Pin configuration for PIC32MX270F512HT-V/MR (64-pin qfn (9x9 mm) with exposed thermal pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX270F512HT-V/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX270F512HT-V/MR is suitable for 6 applications: USB Audio/HMI Front Panel, Capacitive Touch Control Panel, Industrial CAN Node, Graphics Display Controller (PMP), Automotive Body Electronics Module, USB Host Data Logger.
USB Audio/HMI Front Panel
The PIC32MX270F512HT-V/MR's integrated USB 2.0 Full-Speed OTG controller with on-chip PHY eliminates external transceiver cost and board space for USB audio interfaces such as USB headsets, USB DACs, and USB-to-I2S bridges. With 512 KB Flash it stores USB audio class drivers plus DSP filtering, while the two I2S modules feed external codecs at 44.1 kHz to 96 kHz. The three comparators and 10-bit ADC handle front-panel button/slider scanning via CTMU capacitive touch.
Recommended
Capacitive Touch Control Panel
The PIC32MX270F512HT-V/MR's CTMU (Charge Time Measurement Unit) provides hardware-accelerated capacitive touch sensing for up to 48 channels, enabling 5-inch touch panels or 64-button keypads without an external touch controller. Combined with Peripheral Pin Select, each touch electrode can be remapped to any GPIO without rewiring, accelerating PCB revisions. The 83 DMIPS MIPS32 M4K core handles gesture recognition and slider algorithms in firmware.
Recommended
Industrial CAN Node
The PIC32MX270F512HT-V/MR's integrated CAN 2.0B controller with hardware acceptance filters enables it to act as a slave node on industrial CANopen or DeviceNet networks at 1 Mbps, with up to 50 MHz peripheral clock for time-stamped message handling. The 'V' temperature grade (-40C to +105C) supports cabinet-side installations, while the 64 KB SRAM buffers incoming protocol payloads. The RTCC provides time-stamped event logging compliant with industrial automation protocols.
Recommended
Graphics Display Controller (PMP)
The PIC32MX270F512HT-V/MR's Parallel Master Port with dual read/write buffers drives 3.5-inch to 4.3-inch QVGA TFT displays without an external graphics controller, reducing BOM cost. The 83 DMIPS MIPS core renders bitmaps and fonts directly to the display, while the SPI/I2S modules handle touchscreen SPI read-back. With 512 KB Flash, the device stores multiple font tables and bitmap assets for menus and HMI screens.
Recommended
Automotive Body Electronics Module
The PIC32MX270F512HT-V/MR's AEC-Q100 qualification and -40C to +105C temperature range suit it for body-control modules, HVAC panels, and ambient lighting controllers. The 50 MHz MIPS32 M4K core handles LIN/CAN stack plus PWM generation for LED drivers. The exposed thermal pad on the QFN-64 package ensures reliable operation at elevated ambient temperatures in cabin or under-dash enclosures.
Recommended
USB Host Data Logger
The PIC32MX270F512HT-V/MR's USB OTG Host capability enables direct attachment of USB flash drives for portable data loggers used in field-instrumentation or medical monitoring. The 64 KB SRAM buffers measurement data during write cycles, while the RTCC timestamps entries. With 512 KB Flash, the device stores an embedded FAT32 stack plus user application firmware, eliminating the need for an external memory card interface IC.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX270F512HT-V/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX270F512HT-50I/MR | PIC32MX270F512HT-50I/PT | PIC32MX250F256H-I/MR | PIC32MX230F256D-I/MR | PIC32MX170F512H-I/MR |
|---|---|---|---|---|---|---|
| Package | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Clock | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz |
| Operating Temperature | -40C to +105C (V) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| USB Controller | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
Key Differentiators
- Higher temperature grade (-40C to +105C) with AEC-Q100 automotive qualification (vs PIC32MX270F512HT-50I/MR)
- Same QFN-64 9x9 mm footprint allows PCB reuse across I/V grades (vs PIC32MX270F512HT-50I/PT)
- Larger 512 KB Flash supports USB Host stacks with embedded FAT32 (vs PIC32MX250F256H-I/MR)
Design Notes
The 64-pin QFN package has an exposed thermal pad (e-pin) on the underside that MUST be soldered to a continuous ground plane for proper heat dissipation and electrical reference. Missing this connection can cause erratic ADC readings and JTAG programming failures. Estimated: at 50 MHz with all peripherals active, typical power consumption is 50-70 mA; the QFN-64 thermal resistance theta_JA is approximately 28 C/W on a 4-layer JEDEC PCB.
Place 100 nF decoupling capacitors as close as possible to every VDD pin and one bulk 4.7 uF tantalum or ceramic near the main VDD pin. The PIC32MX270 internal 3.3V LDO requires a 10 uF low-ESR capacitor on the VCORE pin (pin 56 on QFN-64) for stability. Do not use the internal LDO if VDD drops below 2.7V as the USB PHY requires 3.3V; in low-voltage designs, bypass the LDO and power VCORE directly from an external 1.8V regulator.
Route the USB DP/DM traces as a 90 ohm differential pair with matching length (delta less than 150 mil) and keep them isolated from noisy digital lines. Place the USB connector's ESD protection (e.g. USBLC6-2) within 5 mm of the connector. The exposed pad should have at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) connecting it to inner ground planes for low-impedance thermal/electrical connection.
PPS (Peripheral Pin Select) input mapping must be unlocked with the IOLOCK bit cleared, and unlocked/relocked using SYSKEY sequence per the family reference manual. Failing to lock PPS after configuration can cause accidental peripheral remapping during runtime glitches. Also ensure the JTAG TMS pin is pulled high during reset; otherwise the device enters a debug-only state.
Compliance Information
AEC-Q100 qualification per GlobalSpec listing for -V grade variant. RoHS compliant per DigiKey product listing. Lead-free (matte tin finish) per Microchip package specification.
