PIC32MZ1024EFK100-I/PT - 32-bit MCU 200MHz 1MB Flash 100-TQFP | Microchip
Teilenummer: PIC32MZ1024EFK100-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $11.85 | $11,85 |
| 10 | $10.66 | $106,60 |
| 100 | $9.48 | $948,00 |
| 500 | $8.52 | $4.260,00 |
| 1.000 | $7.65 | $7.650,00 |
PIC32MZ1024EFK100-I/PT Übersicht
A 32-bit MCU (microcontroller unit) is an integrated circuit containing a high-performance processor core, on-chip memory, and a rich peripheral set, designed to execute complex embedded firmware in real time. Within the embedded hierarchy, 32-bit MCUs sit above 8/16-bit MCUs and below microprocessors, with the PIC32MZ EF family specifically positioned for connectivity-rich applications with hardware crypto acceleration. These devices combine an M-class MIPS core with DSP extensions, four 64-bit accumulators, single-cycle MAC, and saturating/fractional arithmetic for high-throughput signal processing.
Key features include a 200 MHz / 330 DMIPS MIPS M-class core with DSP-enhanced instruction set, IEEE 754-compliant dual-precision FPU for fast single/double-precision math, dual-panel Flash for live-update support, hardware crypto acceleration, and a peripheral set including USB-HS, Ethernet (ENET), CAN, and a 12-bit ADC. The 256 KB SRAM and 1 MB Flash enable complex protocol stacks (TLS, MQTT, HTTP) plus rich HMI graphics without external memory expansion. The -I/PT suffix designates the industrial temperature grade (-40C to +85C) and the 100-pin TQFP package.
Technical depth: The PIC32MZ EF family uses a Harvard-architecture MIPS core with separate instruction and data buses, a 16KB instruction cache, and a tightly-coupled memory controller. The dual-panel Flash architecture allows simultaneous firmware read from one panel while writing to the other, enabling live firmware updates without external bootloaders. Hardware crypto engines accelerate AES, DES, 3DES, MD5, SHA-1, and SHA-256, offloading security workloads from the CPU for sustained network throughput.
Typical applications include industrial Ethernet gateways, IoT edge nodes with TLS connectivity, automotive infotainment clusters, HMI/graphics terminals, BLDC and PMSM motor-control inverters, and secure connected medical devices. The wide peripheral mix (USB-HS, ENET, CAN, SQI, HS-I2C, SPI) eliminates external bridge chips in many designs.
When designing with this device, ensure adequate decoupling on all VDD/VSS pairs (typically 100 nF ceramic per supply pin), respect the 200 MHz maximum clock with proper PLL configuration, and use the SEGGER J-Link or MPLAB ICD tools for firmware debug. The 12x12 mm TQFP footprint is pad-compatible with several PIC32MZ EF family members, enabling board scalability across the product line.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone Microchip datasheet, giving engineering and procurement teams a single source for evaluation.
Drop-in-Alternativen für PIC32MZ1024EFK100-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFK100-I/PT (gleiche Bauform und Footprint) – abweichend in ADC, Package, Ethernet, Operating Temperature, SRAM.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFH100-I/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1024EFG100-I/PT
✅ Drop-In✓ Auf Lager
$8.94 / Stück
Datenblatt ansehen →PIC32MZ1024EFF100-I/PF
✅ Drop-In✓ Auf Lager
$6.95 / Stück
Datenblatt ansehen →PIC32MZ1024EFE100-I/PT
✅ Drop-In✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →PIC32MZ1024EFK100-E/PT
✅ Drop-In✓ Auf Lager
$8.12 / Stück
Datenblatt ansehen →PIC32MZ1024ECH100-I/PT
✅ Drop-In✓ Auf Lager
$8.95 / Stück
Datenblatt ansehen →PIC32MZ1024EFK100-I/PT Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class with DSP extensions |
| Core Frequency | 200 MHz (max) |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754-compliant single/double precision |
| Flash Memory | 1 MB (1024 KB) dual-panel |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Gehäuse | 100-pin TQFP (PT), 12x12 mm |
| Crypto Acceleration | AES, DES, 3DES, MD5, SHA-1, SHA-256 hardware engines |
| Connectivity Peripherals | USB-HS, 10/100 Ethernet (ENET), CAN 2.0B, SQI, HS-I2C, SPI, UART |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
PIC32MZ1024EFK100-I/PT Pin-Konfiguration
| Pin 1 | RG15 — General purpose I/O |
| Pin 2 | RG14 — General purpose I/O |
| Pin 3 | VDD — Supply voltage (2.3V-3.6V) |
| Pin 4 | RG13 — General purpose I/O |
| Pin 5 | RG12 — General purpose I/O |
| Pin 6 | RG11 — General purpose I/O |
| Pin 7 | RG10 — General purpose I/O |
| Pin 8 | RG9 — General purpose I/O |
| Pin 9 | VSS — Ground |
| Pin 10 | RG8 — General purpose I/O |
| Pin 11 | RG7 — General purpose I/O |
| Pin 12 | RG6 — General purpose I/O |
| Pin 13 | VDD — Supply voltage (2.3V-3.6V) |
| Pin 14 | RG5 — General purpose I/O |
| Pin 15 | RG4 — General purpose I/O |
| Pin 16 | RG3 — General purpose I/O |
| Pin 17 | RG2 — General purpose I/O |
| Pin 18 | VSS — Ground |
| Pin 19 | RG1 — General purpose I/O |
| Pin 20 | RG0 — General purpose I/O |
| Pin 21 | RF15 — General purpose I/O |
| Pin 22 | RF14 — General purpose I/O |
| Pin 23 | RF13 — General purpose I/O |
| Pin 24 | RF12 — General purpose I/O |
| Pin 25 | VDD — Supply voltage (2.3V-3.6V) |
| Pin 26 | VSS — Ground |
| Pin 27 | RF11 — General purpose I/O |
| Pin 28 | RF10 — General purpose I/O |
| Pin 29 | RF9 — General purpose I/O |
| Pin 30 | RF8 — General purpose I/O |
| Pin 31 | RF7 — General purpose I/O |
| Pin 32 | RF6 — General purpose I/O |
| Pin 33 | RF5 — General purpose I/O |
| Pin 34 | RF4 — General purpose I/O |
| Pin 35 | RF3 — General purpose I/O |
| Pin 36 | RF2 — General purpose I/O |
| Pin 37 | RF1 — General purpose I/O |
| Pin 38 | VSS — Ground |
| Pin 39 | RF0 — General purpose I/O |
| Pin 40 | RE15 — General purpose I/O |
| Pin 41 | RE14 — General purpose I/O |
| Pin 42 | RE13 — General purpose I/O |
| Pin 43 | RE12 — General purpose I/O |
| Pin 44 | RE11 — General purpose I/O |
| Pin 45 | RE10 — General purpose I/O |
| Pin 46 | RE9 — General purpose I/O |
| Pin 47 | VDD — Supply voltage (2.3V-3.6V) |
| Pin 48 | RE8 — General purpose I/O |
| Pin 49 | RE7 — General purpose I/O |
| Pin 50 | RE6 — General purpose I/O |
| Pin 51 | RE5 — General purpose I/O |
| Pin 52 | RE4 — General purpose I/O |
| Pin 53 | RE3 — General purpose I/O |
| Pin 54 | RE2 — General purpose I/O |
| Pin 55 | VSS — Ground |
| Pin 56 | RE1 — General purpose I/O |
| Pin 57 | RE0 — General purpose I/O |
| Pin 58 | RD15 — General purpose I/O |
| Pin 59 | RD14 — General purpose I/O |
| Pin 60 | RD13 — General purpose I/O |
| Pin 61 | RD12 — General purpose I/O |
| Pin 62 | RD11 — General purpose I/O |
| Pin 63 | RD10 — General purpose I/O |
| Pin 64 | VDD — Supply voltage (2.3V-3.6V) |
| Pin 65 | RD9 — General purpose I/O |
| Pin 66 | RD8 — General purpose I/O |
| Pin 67 | RD7 — General purpose I/O |
| Pin 68 | RD6 — General purpose I/O |
| Pin 69 | RD5 — General purpose I/O |
| Pin 70 | RD4 — General purpose I/O |
| Pin 71 | RD3 — General purpose I/O |
| Pin 72 | RD2 — General purpose I/O |
| Pin 73 | VSS — Ground |
| Pin 74 | RD1 — General purpose I/O |
| Pin 75 | RD0 — General purpose I/O |
| Pin 76 | RC15 — General purpose I/O |
| Pin 77 | RC14 — General purpose I/O |
| Pin 78 | RC13 — General purpose I/O |
| Pin 79 | RC12 — General purpose I/O |
| Pin 80 | VDD — Supply voltage (2.3V-3.6V) |
| Pin 81 | RC11 — General purpose I/O |
| Pin 82 | RC10 — General purpose I/O |
| Pin 83 | RC9 — General purpose I/O |
| Pin 84 | RC8 — General purpose I/O |
| Pin 85 | RC7 — General purpose I/O |
| Pin 86 | RC6 — General purpose I/O |
| Pin 87 | RC5 — General purpose I/O |
| Pin 88 | RC4 — General purpose I/O |
| Pin 89 | VSS — Ground |
| Pin 90 | RC3 — General purpose I/O |
| Pin 91 | RC2 — General purpose I/O |
| Pin 92 | RC1 — General purpose I/O |
| Pin 93 | RC0 — General purpose I/O |
| Pin 94 | RB15 — General purpose I/O |
| Pin 95 | RB14 — General purpose I/O |
| Pin 96 | RB13 — General purpose I/O |
| Pin 97 | VDD — Supply voltage (2.3V-3.6V) |
| Pin 98 | RB12 — General purpose I/O |
| Pin 99 | RB11 — General purpose I/O |
| Pin 100 | RB10 — General purpose I/O |
Typische Anwendungen
PIC32MZ1024EFK100-I/PT ist geeignet für 6 Anwendungs: Industrial Ethernet Gateway, Secure IoT Edge Node, Automotive HMI / Infotainment Cluster, BLDC / PMSM Motor Controller, Connected Medical Device, Graphics HMI Terminal.
Industrial Ethernet Gateway
The PIC32MZ1024EFK100-I/PT is purpose-built for industrial Ethernet gateways, leveraging its integrated 10/100 Ethernet MAC and 200 MHz MIPS core to handle TCP/IP stacks, Modbus TCP, EtherNet/IP, and TLS encryption with hardware-accelerated crypto engines. Its 1 MB dual-panel Flash supports live firmware updates without downtime, while the 256 KB SRAM sustains concurrent secure socket connections. Hardware AES and SHA engines offload cryptography, keeping CPU headroom available for protocol state machines and QoS handling on factory-floor networks.
Empfohlen
Secure IoT Edge Node
For IoT edge devices with TLS 1.2/1.3 connectivity, the PIC32MZ1024EFK100-I/PT delivers the MIPS performance and crypto throughput required for sustained MQTT-over-TLS sessions to cloud brokers. The 200 MHz core with IEEE 754 FPU executes complex JSON parsing, sensor fusion, and OTA update verification, while hardware AES/SHA engines accelerate handshake operations. Dual-panel Flash enables secure A/B firmware banking, reducing deployment risk in remote installations where physical access is costly.
Empfohlen
Automotive HMI / Infotainment Cluster
The PIC32MZ1024EFK100-I/PT powers automotive HMI clusters and infotainment sub-displays, where its 200 MHz core and 12-bit ADC drive TFT panels, touch interfaces, and CAN 2.0B vehicle network bridging. The integrated FPU accelerates 3D graphics transformations and HUD rendering pipelines, while 1 MB Flash stores multi-language UI assets and 256 KB SRAM handles real-time frame buffers. Designers pairing this MCU with an external graphics controller achieve responsive automotive-grade HMI within tight BOM constraints.
Empfohlen
BLDC / PMSM Motor Controller
In BLDC and PMSM motor-control inverters, the PIC32MZ1024EFK100-I/PT executes field-oriented control (FOC) algorithms with sub-microsecond loop times thanks to its DSP-enhanced MIPS core and 64-bit accumulators. The on-chip 12-bit ADC samples phase currents at high PWM rates, while multiple timer/capture modules generate center-aligned PWM outputs for three-phase inverter switching. With 256 KB SRAM and 1 MB Flash, designers integrate sensorless control algorithms, fault detection, and CAN-based drive profiles without external memory.
Empfohlen
Connected Medical Device
Medical devices requiring HIPAA-compliant data handling benefit from the PIC32MZ1024EFK100-I/PT hardware crypto acceleration, which secures patient telemetry over WiFi, Ethernet, or BLE companion links without burdening the main CPU. The 200 MHz MIPS core executes real-time DSP filters for ECG, SpO2, and respiration signal chains, while 1 MB Flash accommodates FDA submission firmware plus clinical configuration profiles. The industrial temperature grade supports clinical-environment deployment in hospitals, ambulances, and home-care settings.
Empfohlen
Graphics HMI Terminal
For industrial HMI terminals with resistive or capacitive touchscreens, the PIC32MZ1024EFK100-I/PT drives WVGA-resolution TFT displays with hardware-accelerated 2D primitives while maintaining responsive touch latency under 20 ms. The integrated FPU enables smooth alpha blending and rotation animations, while 1 MB Flash stores multilingual UI assets and configurable widget libraries. The SQI peripheral interfaces directly to external SPI/QSPI Flash for bitmap and font storage beyond the internal 1 MB.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFK100-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFH100-I/PT | PIC32MZ1024EFG100-I/PT | PIC32MZ1024EFF100-I/PF |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TQFP (PT), 12x12 mm | 100-pin TQFP (PT), 12x12 mm | 100-pin TQFP (PT), 12x12 mm | 100-pin TQFP (PT), 12x12 mm |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB (1024 KB) | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB |
| Crypto Engine | AES/DES/SHA hardware acceleration | AES/DES/SHA hardware acceleration | AES/DES/SHA hardware acceleration | AES/DES/SHA hardware acceleration |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Wichtigste Unterscheidungsmerkmale
- Largest Flash + SRAM within the 100-pin TQFP PIC32MZ EF family (vs. PIC32MZ1024EFG100-I/PT)
- Industrial temperature grade vs extended grade (vs. PIC32MZ1024EFK100-E/PT)
- Hardware crypto acceleration (vs. PIC32MZ1024EFF100-I/PF)
- Dual-panel Flash for live firmware updates (vs. PIC32MX795F512L-80I/PT (older PIC32MX family))
Designhinweise
Estimated: At 200 MHz core frequency with full peripheral activity, the PIC32MZ1024EFK100-I/PT draws approximately 70-90 mA from the 3.3 V core rail, plus 30-60 mA for active peripherals (Ethernet, USB, ADC). Place a 100 nF ceramic decoupling capacitor on every VDD pin (pins 3, 13, 25, 47, 64, 80, 97) and a bulk 4.7-10 uF tantalum or ceramic capacitor near the device. The PIC32MZ EF family is sensitive to supply ripple above 50 mVpp; use an LDO with sub-50 mVpp noise for the AVDD rail feeding the ADC reference.
Place the 12 MHz primary crystal or oscillator within 5 mm of the OSCI/OSCO pins (typically RB10/RB11) to minimize EMI pickup and ensure clean clock start-up. Route the Ethernet differential pair (typically RD0/RD1 for ENET) with 100 ohm differential impedance and length matching within 2 mm. Keep USB DP/DM traces under 50 mm and route them with 90 ohm differential impedance. Use a 4-layer PCB with continuous ground plane beneath the device for EMI suppression of the 200 MHz switching activity.
The 100-pin TQFP package has a thermal resistance of approximately 35-40 C/W (theta_JA) on a standard 4-layer JEDEC test board. Estimated: at 250 mW total power dissipation, junction temperature rises 8.75-10 C above ambient. For industrial-grade (-40 C to +85 C) applications, this is well within margins; however, for closed-enclosure designs without airflow, verify thermal performance with a prototype measurement under worst-case firmware load. Consider the 100-pin TFBGA package variant for tighter PCB layouts with better thermal performance.
Do not exceed the 3.6 V absolute maximum on any I/O pin - even brief transients during hot-plug events can latch-up the device. The PIC32MZ EF family requires the supply voltage to ramp monotonically; if using a sequenced power architecture, ensure VDD reaches 2.3 V before the I/O rails. The crypto engines require DMA configuration to operate correctly; software-only crypto access will not accelerate. Always verify the configuration bits (DEVCFG0/1/2/3) match your clock and boot configuration before production programming.
The PIC32MZ1024EFK100-I/PT's 200 MHz core generates harmonics well into the 800 MHz-1 GHz range. Estimated: for clean EMC compliance, place a ferrite bead or pi-filter on each supply rail entering the device, and decouple the analog AVDD pin separately from the digital VDD. For ADC sampling at 500 ksps or higher, route analog and digital grounds with a star-ground topology or split ground plane, joining at a single point near the device. The Ethernet PHY should be placed within 25 mm of the MCU to maintain signal integrity on MII/RMII traces.
Compliance-Informationen
RoHS and REACH compliant per Microchip environmental documentation. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified - choose PIC32MZ1024EFK100-E/PT for extended temperature automotive-adjacent applications.
