PIC32MZ1024EFK100-I/PT - 32-bit MCU 200MHz 1MB Flash 100-TQFP | Microchip
Référence : PIC32MZ1024EFK100-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.85 | $11,85 |
| 10 | $10.66 | $106,60 |
| 100 | $9.48 | $948,00 |
| 500 | $8.52 | $4 260,00 |
| 1 000 | $7.65 | $7 650,00 |
PIC32MZ1024EFK100-I/PT Présentation
A 32-bit MCU (microcontroller unit) is an integrated circuit containing a high-performance processor core, on-chip memory, and a rich peripheral set, designed to execute complex embedded firmware in real time. Within the embedded hierarchy, 32-bit MCUs sit above 8/16-bit MCUs and below microprocessors, with the PIC32MZ EF family specifically positioned for connectivity-rich applications with hardware crypto acceleration. These devices combine an M-class MIPS core with DSP extensions, four 64-bit accumulators, single-cycle MAC, and saturating/fractional arithmetic for high-throughput signal processing.
Key features include a 200 MHz / 330 DMIPS MIPS M-class core with DSP-enhanced instruction set, IEEE 754-compliant dual-precision FPU for fast single/double-precision math, dual-panel Flash for live-update support, hardware crypto acceleration, and a peripheral set including USB-HS, Ethernet (ENET), CAN, and a 12-bit ADC. The 256 KB SRAM and 1 MB Flash enable complex protocol stacks (TLS, MQTT, HTTP) plus rich HMI graphics without external memory expansion. The -I/PT suffix designates the industrial temperature grade (-40C to +85C) and the 100-pin TQFP package.
Technical depth: The PIC32MZ EF family uses a Harvard-architecture MIPS core with separate instruction and data buses, a 16KB instruction cache, and a tightly-coupled memory controller. The dual-panel Flash architecture allows simultaneous firmware read from one panel while writing to the other, enabling live firmware updates without external bootloaders. Hardware crypto engines accelerate AES, DES, 3DES, MD5, SHA-1, and SHA-256, offloading security workloads from the CPU for sustained network throughput.
Typical applications include industrial Ethernet gateways, IoT edge nodes with TLS connectivity, automotive infotainment clusters, HMI/graphics terminals, BLDC and PMSM motor-control inverters, and secure connected medical devices. The wide peripheral mix (USB-HS, ENET, CAN, SQI, HS-I2C, SPI) eliminates external bridge chips in many designs.
When designing with this device, ensure adequate decoupling on all VDD/VSS pairs (typically 100 nF ceramic per supply pin), respect the 200 MHz maximum clock with proper PLL configuration, and use the SEGGER J-Link or MPLAB ICD tools for firmware debug. The 12x12 mm TQFP footprint is pad-compatible with several PIC32MZ EF family members, enabling board scalability across the product line.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone Microchip datasheet, giving engineering and procurement teams a single source for evaluation.
Alternatives de remplacement direct pour PIC32MZ1024EFK100-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFK100-I/PT (même facteur de forme et même empreinte) — différant par ADC, Package, Ethernet, Operating Temperature, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFH100-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFG100-I/PT
✅ Remplacement direct✓ En stock
$8.94 / unité
Voir la fiche technique →PIC32MZ1024EFF100-I/PF
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC32MZ1024EFE100-I/PT
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →PIC32MZ1024EFK100-E/PT
✅ Remplacement direct✓ En stock
$8.12 / unité
Voir la fiche technique →PIC32MZ1024ECH100-I/PT
✅ Remplacement direct✓ En stock
$8.95 / unité
Voir la fiche technique →PIC32MZ1024EFK100-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class with DSP extensions |
| Core Frequency | 200 MHz (max) |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754-compliant single/double precision |
| Flash Memory | 1 MB (1024 KB) dual-panel |
| SRAM | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Boîtier | 100-pin TQFP (PT), 12x12 mm |
| Crypto Acceleration | AES, DES, 3DES, MD5, SHA-1, SHA-256 hardware engines |
| Connectivity Peripherals | USB-HS, 10/100 Ethernet (ENET), CAN 2.0B, SQI, HS-I2C, SPI, UART |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFK100-I/PT
| Broche 1 | RG15 — General purpose I/O |
| Broche 2 | RG14 — General purpose I/O |
| Broche 3 | VDD — Supply voltage (2.3V-3.6V) |
| Broche 4 | RG13 — General purpose I/O |
| Broche 5 | RG12 — General purpose I/O |
| Broche 6 | RG11 — General purpose I/O |
| Broche 7 | RG10 — General purpose I/O |
| Broche 8 | RG9 — General purpose I/O |
| Broche 9 | VSS — Ground |
| Broche 10 | RG8 — General purpose I/O |
| Broche 11 | RG7 — General purpose I/O |
| Broche 12 | RG6 — General purpose I/O |
| Broche 13 | VDD — Supply voltage (2.3V-3.6V) |
| Broche 14 | RG5 — General purpose I/O |
| Broche 15 | RG4 — General purpose I/O |
| Broche 16 | RG3 — General purpose I/O |
| Broche 17 | RG2 — General purpose I/O |
| Broche 18 | VSS — Ground |
| Broche 19 | RG1 — General purpose I/O |
| Broche 20 | RG0 — General purpose I/O |
| Broche 21 | RF15 — General purpose I/O |
| Broche 22 | RF14 — General purpose I/O |
| Broche 23 | RF13 — General purpose I/O |
| Broche 24 | RF12 — General purpose I/O |
| Broche 25 | VDD — Supply voltage (2.3V-3.6V) |
| Broche 26 | VSS — Ground |
| Broche 27 | RF11 — General purpose I/O |
| Broche 28 | RF10 — General purpose I/O |
| Broche 29 | RF9 — General purpose I/O |
| Broche 30 | RF8 — General purpose I/O |
| Broche 31 | RF7 — General purpose I/O |
| Broche 32 | RF6 — General purpose I/O |
| Broche 33 | RF5 — General purpose I/O |
| Broche 34 | RF4 — General purpose I/O |
| Broche 35 | RF3 — General purpose I/O |
| Broche 36 | RF2 — General purpose I/O |
| Broche 37 | RF1 — General purpose I/O |
| Broche 38 | VSS — Ground |
| Broche 39 | RF0 — General purpose I/O |
| Broche 40 | RE15 — General purpose I/O |
| Broche 41 | RE14 — General purpose I/O |
| Broche 42 | RE13 — General purpose I/O |
| Broche 43 | RE12 — General purpose I/O |
| Broche 44 | RE11 — General purpose I/O |
| Broche 45 | RE10 — General purpose I/O |
| Broche 46 | RE9 — General purpose I/O |
| Broche 47 | VDD — Supply voltage (2.3V-3.6V) |
| Broche 48 | RE8 — General purpose I/O |
| Broche 49 | RE7 — General purpose I/O |
| Broche 50 | RE6 — General purpose I/O |
| Broche 51 | RE5 — General purpose I/O |
| Broche 52 | RE4 — General purpose I/O |
| Broche 53 | RE3 — General purpose I/O |
| Broche 54 | RE2 — General purpose I/O |
| Broche 55 | VSS — Ground |
| Broche 56 | RE1 — General purpose I/O |
| Broche 57 | RE0 — General purpose I/O |
| Broche 58 | RD15 — General purpose I/O |
| Broche 59 | RD14 — General purpose I/O |
| Broche 60 | RD13 — General purpose I/O |
| Broche 61 | RD12 — General purpose I/O |
| Broche 62 | RD11 — General purpose I/O |
| Broche 63 | RD10 — General purpose I/O |
| Broche 64 | VDD — Supply voltage (2.3V-3.6V) |
| Broche 65 | RD9 — General purpose I/O |
| Broche 66 | RD8 — General purpose I/O |
| Broche 67 | RD7 — General purpose I/O |
| Broche 68 | RD6 — General purpose I/O |
| Broche 69 | RD5 — General purpose I/O |
| Broche 70 | RD4 — General purpose I/O |
| Broche 71 | RD3 — General purpose I/O |
| Broche 72 | RD2 — General purpose I/O |
| Broche 73 | VSS — Ground |
| Broche 74 | RD1 — General purpose I/O |
| Broche 75 | RD0 — General purpose I/O |
| Broche 76 | RC15 — General purpose I/O |
| Broche 77 | RC14 — General purpose I/O |
| Broche 78 | RC13 — General purpose I/O |
| Broche 79 | RC12 — General purpose I/O |
| Broche 80 | VDD — Supply voltage (2.3V-3.6V) |
| Broche 81 | RC11 — General purpose I/O |
| Broche 82 | RC10 — General purpose I/O |
| Broche 83 | RC9 — General purpose I/O |
| Broche 84 | RC8 — General purpose I/O |
| Broche 85 | RC7 — General purpose I/O |
| Broche 86 | RC6 — General purpose I/O |
| Broche 87 | RC5 — General purpose I/O |
| Broche 88 | RC4 — General purpose I/O |
| Broche 89 | VSS — Ground |
| Broche 90 | RC3 — General purpose I/O |
| Broche 91 | RC2 — General purpose I/O |
| Broche 92 | RC1 — General purpose I/O |
| Broche 93 | RC0 — General purpose I/O |
| Broche 94 | RB15 — General purpose I/O |
| Broche 95 | RB14 — General purpose I/O |
| Broche 96 | RB13 — General purpose I/O |
| Broche 97 | VDD — Supply voltage (2.3V-3.6V) |
| Broche 98 | RB12 — General purpose I/O |
| Broche 99 | RB11 — General purpose I/O |
| Broche 100 | RB10 — General purpose I/O |
Applications typiques
PIC32MZ1024EFK100-I/PT convient pour 6 applications: Industrial Ethernet Gateway, Secure IoT Edge Node, Automotive HMI / Infotainment Cluster, BLDC / PMSM Motor Controller, Connected Medical Device, Graphics HMI Terminal.
Industrial Ethernet Gateway
The PIC32MZ1024EFK100-I/PT is purpose-built for industrial Ethernet gateways, leveraging its integrated 10/100 Ethernet MAC and 200 MHz MIPS core to handle TCP/IP stacks, Modbus TCP, EtherNet/IP, and TLS encryption with hardware-accelerated crypto engines. Its 1 MB dual-panel Flash supports live firmware updates without downtime, while the 256 KB SRAM sustains concurrent secure socket connections. Hardware AES and SHA engines offload cryptography, keeping CPU headroom available for protocol state machines and QoS handling on factory-floor networks.
Recommandé
Secure IoT Edge Node
For IoT edge devices with TLS 1.2/1.3 connectivity, the PIC32MZ1024EFK100-I/PT delivers the MIPS performance and crypto throughput required for sustained MQTT-over-TLS sessions to cloud brokers. The 200 MHz core with IEEE 754 FPU executes complex JSON parsing, sensor fusion, and OTA update verification, while hardware AES/SHA engines accelerate handshake operations. Dual-panel Flash enables secure A/B firmware banking, reducing deployment risk in remote installations where physical access is costly.
Recommandé
Automotive HMI / Infotainment Cluster
The PIC32MZ1024EFK100-I/PT powers automotive HMI clusters and infotainment sub-displays, where its 200 MHz core and 12-bit ADC drive TFT panels, touch interfaces, and CAN 2.0B vehicle network bridging. The integrated FPU accelerates 3D graphics transformations and HUD rendering pipelines, while 1 MB Flash stores multi-language UI assets and 256 KB SRAM handles real-time frame buffers. Designers pairing this MCU with an external graphics controller achieve responsive automotive-grade HMI within tight BOM constraints.
Recommandé
BLDC / PMSM Motor Controller
In BLDC and PMSM motor-control inverters, the PIC32MZ1024EFK100-I/PT executes field-oriented control (FOC) algorithms with sub-microsecond loop times thanks to its DSP-enhanced MIPS core and 64-bit accumulators. The on-chip 12-bit ADC samples phase currents at high PWM rates, while multiple timer/capture modules generate center-aligned PWM outputs for three-phase inverter switching. With 256 KB SRAM and 1 MB Flash, designers integrate sensorless control algorithms, fault detection, and CAN-based drive profiles without external memory.
Recommandé
Connected Medical Device
Medical devices requiring HIPAA-compliant data handling benefit from the PIC32MZ1024EFK100-I/PT hardware crypto acceleration, which secures patient telemetry over WiFi, Ethernet, or BLE companion links without burdening the main CPU. The 200 MHz MIPS core executes real-time DSP filters for ECG, SpO2, and respiration signal chains, while 1 MB Flash accommodates FDA submission firmware plus clinical configuration profiles. The industrial temperature grade supports clinical-environment deployment in hospitals, ambulances, and home-care settings.
Recommandé
Graphics HMI Terminal
For industrial HMI terminals with resistive or capacitive touchscreens, the PIC32MZ1024EFK100-I/PT drives WVGA-resolution TFT displays with hardware-accelerated 2D primitives while maintaining responsive touch latency under 20 ms. The integrated FPU enables smooth alpha blending and rotation animations, while 1 MB Flash stores multilingual UI assets and configurable widget libraries. The SQI peripheral interfaces directly to external SPI/QSPI Flash for bitmap and font storage beyond the internal 1 MB.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFK100-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFH100-I/PT | PIC32MZ1024EFG100-I/PT | PIC32MZ1024EFF100-I/PF |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TQFP (PT), 12x12 mm | 100-pin TQFP (PT), 12x12 mm | 100-pin TQFP (PT), 12x12 mm | 100-pin TQFP (PT), 12x12 mm |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB (1024 KB) | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB |
| Crypto Engine | AES/DES/SHA hardware acceleration | AES/DES/SHA hardware acceleration | AES/DES/SHA hardware acceleration | AES/DES/SHA hardware acceleration |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- Largest Flash + SRAM within the 100-pin TQFP PIC32MZ EF family (vs PIC32MZ1024EFG100-I/PT)
- Industrial temperature grade vs extended grade (vs PIC32MZ1024EFK100-E/PT)
- Hardware crypto acceleration (vs PIC32MZ1024EFF100-I/PF)
- Dual-panel Flash for live firmware updates (vs PIC32MX795F512L-80I/PT (older PIC32MX family))
Notes de conception
Estimated: At 200 MHz core frequency with full peripheral activity, the PIC32MZ1024EFK100-I/PT draws approximately 70-90 mA from the 3.3 V core rail, plus 30-60 mA for active peripherals (Ethernet, USB, ADC). Place a 100 nF ceramic decoupling capacitor on every VDD pin (pins 3, 13, 25, 47, 64, 80, 97) and a bulk 4.7-10 uF tantalum or ceramic capacitor near the device. The PIC32MZ EF family is sensitive to supply ripple above 50 mVpp; use an LDO with sub-50 mVpp noise for the AVDD rail feeding the ADC reference.
Place the 12 MHz primary crystal or oscillator within 5 mm of the OSCI/OSCO pins (typically RB10/RB11) to minimize EMI pickup and ensure clean clock start-up. Route the Ethernet differential pair (typically RD0/RD1 for ENET) with 100 ohm differential impedance and length matching within 2 mm. Keep USB DP/DM traces under 50 mm and route them with 90 ohm differential impedance. Use a 4-layer PCB with continuous ground plane beneath the device for EMI suppression of the 200 MHz switching activity.
The 100-pin TQFP package has a thermal resistance of approximately 35-40 C/W (theta_JA) on a standard 4-layer JEDEC test board. Estimated: at 250 mW total power dissipation, junction temperature rises 8.75-10 C above ambient. For industrial-grade (-40 C to +85 C) applications, this is well within margins; however, for closed-enclosure designs without airflow, verify thermal performance with a prototype measurement under worst-case firmware load. Consider the 100-pin TFBGA package variant for tighter PCB layouts with better thermal performance.
Do not exceed the 3.6 V absolute maximum on any I/O pin - even brief transients during hot-plug events can latch-up the device. The PIC32MZ EF family requires the supply voltage to ramp monotonically; if using a sequenced power architecture, ensure VDD reaches 2.3 V before the I/O rails. The crypto engines require DMA configuration to operate correctly; software-only crypto access will not accelerate. Always verify the configuration bits (DEVCFG0/1/2/3) match your clock and boot configuration before production programming.
The PIC32MZ1024EFK100-I/PT's 200 MHz core generates harmonics well into the 800 MHz-1 GHz range. Estimated: for clean EMC compliance, place a ferrite bead or pi-filter on each supply rail entering the device, and decouple the analog AVDD pin separately from the digital VDD. For ADC sampling at 500 ksps or higher, route analog and digital grounds with a star-ground topology or split ground plane, joining at a single point near the device. The Ethernet PHY should be placed within 25 mm of the MCU to maintain signal integrity on MII/RMII traces.
Informations de conformité
RoHS and REACH compliant per Microchip environmental documentation. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified - choose PIC32MZ1024EFK100-E/PT for extended temperature automotive-adjacent applications.
