PIC32MZ1024EFK144-I/PL - 200MHz 32-bit MCU 1MB Flash 144-LQFP
Teilenummer: PIC32MZ1024EFK144-I/PL ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.4 | $18,40 |
| 10 | $17.05 | $170,50 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.5 | $6.750,00 |
| 1.000 | $12.3 | $12.300,00 |
PIC32MZ1024EFK144-I/PL Übersicht
A 32-bit microcontroller (MCU) is a microprocessor core optimized for embedded control, integrating CPU, memory, peripherals, and I/O on a single die. Within the taxonomy, the PIC32MZ EF family belongs to: 32-bit MCU -> MIPS M-Class core -> high-performance MCU -> PIC32 family -> Microchip MCU portfolio. The EF suffix designates the Embedded Connectivity with Floating Point Unit variant, which adds an IEEE 754-compliant single-precision FPU and DSP extensions, alongside high-bandwidth connectivity peripherals required for Ethernet and USB-based designs.
Key features include 200 MHz / 330 DMIPS core performance, 1 MB Flash program memory, 256 KB SRAM data memory, integrated Crypto engine supporting AES/SHA/RNG, Hi-Speed USB 2.0 with integrated PHY, 10/100 Ethernet MAC with IEEE 1588 support, dual CAN 2.0b ports, 12-bit ADC up to 500 ksps, multiple UART/SPI/I2C peripherals, and a wide operating voltage range of 2.1 V to 3.6 V. The integrated FPU and DSP extensions accelerate floating-point and signal-processing workloads.
Typical applications include industrial automation controllers, Ethernet-connected IoT gateways, USB Host/Device peripherals, automotive HMI clusters, motor control inverters, and graphics display terminals. The combination of Ethernet, USB, and CAN in a single 144-LQFP package reduces BOM count in connectivity-intensive designs.
When designing with this MCU, allocate sufficient decoupling capacitance (100 nF plus bulk 4.7 uF) on every VDDCORE and VDDIO pin, route the differential USB D+/D- lines with 90-ohm differential impedance, and follow Microchip's recommended 144-LQFP PCB layout guidelines for the exposed-pad thermal pad.
This page synthesizes distributor pricing, drop-in PIC32MZ EF family alternatives, and practical design notes not found in the manufacturer datasheet, supporting rapid part selection for embedded engineers.
Drop-in-Alternativen für PIC32MZ1024EFK144-I/PL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFK144-I/PL (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, ADC, CAN, Operating Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFG144-E/PL
✅ Drop-In✓ Auf Lager
$9.05 / Stück
Datenblatt ansehen →PIC32MZ1024EFF144-I/PH
✅ Drop-In✓ Auf Lager
$9.84 / Stück
Datenblatt ansehen →PIC32MZ1024EFE144-I/PL
✅ Drop-In✓ Auf Lager
$8.95 / Stück
Datenblatt ansehen →PIC32MZ1024ECH144T-I/PL
✅ Drop-In✓ Auf Lager
$9.55 / Stück
Datenblatt ansehen →PIC32MZ1024ECM144-I/PH
✅ Drop-In✓ Auf Lager
$8.95 / Stück
Datenblatt ansehen →PIC32MZ1024EFK144-I/PL Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M-Class Warrior (PIC32MZ EF) |
| Core Architecture | MIPS32 32-bit RISC with FPU and DSP |
| Maximum CPU Frequency | 200 MHz |
| Performance | 330 DMIPS |
| Program Memory (Flash) | 1024 KB (1 MB) |
| Data Memory (SRAM) | 256 KB |
| Operating Voltage | 2.1 V to 3.6 V |
| Gehäuse | 144-pin LQFP (20x20 mm) |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Montageart | Surface Mount |
| Ethernet | 10/100 MAC with IEEE 1588 support |
| USB | Hi-Speed USB 2.0 with integrated PHY |
| CAN | 2x CAN 2.0b |
| Crypto Engine | Yes (AES/SHA/RNG) |
| Floating Point Unit | IEEE 754 single-precision FPU |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC32MZ1024EFK144-I/PL 144-pin lqfp (20x20 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1024EFK144-I/PL (144-pin lqfp (20x20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1024EFK144-I/PL.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1024EFK144-I/PL ist geeignet für 6 Anwendungs: Industrial Automation Controller, Ethernet-Connected IoT Gateway, USB Host/Device Embedded Peripheral, Automotive HMI Cluster Display, Motor Control Inverter Drive, Graphics Display Terminal (HMI).
Industrial Automation Controller
The PIC32MZ1024EFK144-I/PL fits industrial PLC and motor-drive controllers thanks to its 200 MHz MIPS32 core with IEEE 754 FPU and dual CAN 2.0b interfaces. The 1 MB Flash accommodates full Modbus/Profibus/EtherCAT protocol stacks, while the 256 KB SRAM supports real-time control loops at sub-microsecond intervals. The integrated 12-bit ADC and PWM peripherals enable direct interface to current/voltage sensors and three-phase inverter bridges. Industrial temperature grade of -40C to +85C ensures deployment in factory-floor enclosures.
Empfohlen
Ethernet-Connected IoT Gateway
The PIC32MZ1024EFK144-I/PL is well-suited for IoT edge gateways because its integrated 10/100 Ethernet MAC with IEEE 1588 timestamp support enables deterministic TCP/IP communication without an external bridge IC. The 1 MB Flash stores TCP/IP stacks plus application firmware, and the Hi-Speed USB 2.0 with integrated PHY supports simultaneous cellular-modem tethering or local HMI connectivity. Hardware Crypto engine (AES-128/256, SHA-256, RNG) accelerates TLS handshakes and secure boot validation.
Empfohlen
USB Host/Device Embedded Peripheral
The PIC32MZ1024EFK144-I/PL's integrated Hi-Speed USB 2.0 PHY plus OTG controller makes it ideal for embedded USB host products such as data loggers, USB-HID bridges, and mass-storage readers. Running at 200 MHz, the MCU handles USB stack plus upper-layer protocols (MSC, HID, CDC) without offloading to an external companion. The 144-LQFP package exposes sufficient I/O for parallel SRAM or external bus interfaces needed by high-throughput USB applications.
Empfohlen
Automotive HMI Cluster Display
The PIC32MZ1024EFK144-I/PL's combination of graphics peripherals (LCD controller), 200 MHz CPU, 1 MB Flash for asset storage, and dual CAN ports suits automotive instrument cluster and HMI designs. Per Microchip's automotive qualification notes, the EFK variant supports the operating temperature grade needed for cabin environments. The integrated FPU accelerates 3D-rendering or vector-graphics transformations, and the Ethernet MAC supports automotive networking backbones in next-generation vehicle architectures.
Empfohlen
Motor Control Inverter Drive
The PIC32MZ1024EFK144-I/PL's 200 MHz CPU, DSP extensions, and high-resolution PWM peripherals make it suitable for field-oriented control (FOC) of three-phase BLDC and PMSM motors. The FPU accelerates Park/Clarke transforms while the 12-bit ADC up to 500 ksps samples phase currents at the PWM rate. The 256 KB SRAM holds observer state and controller variables, while 1 MB Flash stores multi-motor profiles and fault logs for diagnostic retrieval via CAN or Ethernet.
Empfohlen
Graphics Display Terminal (HMI)
The PIC32MZ1024EFK144-I/PL fits HMI panels requiring TFT LCD driving, touch input, and connectivity because of its integrated graphics peripheral block, 1 MB Flash for assets/icons, and Hi-Speed USB for firmware updates. Per Microchip's MPLAB Harmony support, the device drives up to WVGA-resolution displays via external graphics controller or direct RGB-IF. Dual CAN and Ethernet enable industrial PLC integration as a panel-mounted operator interface.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFK144-I/PL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFG144-E/PL | PIC32MZ1024EFE144-I/PL | PIC32MZ1024ECH144T-I/PL | PIC32MZ1024ECM144-I/PH |
|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (16x16 mm) - same pin count, smaller body |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Ethernet MAC | Yes (10/100, IEEE 1588) | Yes (10/100, IEEE 1588) | Yes (10/100, IEEE 1588) | No | No |
| Hi-Speed USB | Yes (integrated PHY) | Yes (integrated PHY) | Yes (integrated PHY) | Yes | No (Full-Speed only) |
| Crypto Engine | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) | No | No |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Wichtigste Unterscheidungsmerkmale
- Integrated 10/100 Ethernet MAC plus Hi-Speed USB 2.0 PHY in same 144-LQFP package (vs. PIC32MZ1024ECH144T-I/PL)
- Hardware Crypto engine with AES/SHA/RNG (vs. PIC32MZ1024ECM144-I/PH)
- Higher 200 MHz core with 330 DMIPS performance (vs. PIC32MX795F512L-80I/PF)
- 1 MB Flash supports large connectivity stacks (vs. PIC32MZ0512EFK144-E/PL)
Designhinweise
Decouple every VDDCORE and VDDIO pin with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus a 4.7 uF bulk capacitor per supply rail. Estimated: at 200 MHz core and full peripheral activity, the digital supply can draw up to 80 mA transient; the 4.7 uF bulk prevents supply droop during USB/Ethernet burst events. Use separate analog and digital ground planes connected at a single point near the MCU exposed pad.
Estimated: the 144-LQFP package has theta_JA of approximately 40 C/W. At full 200 MHz operation with all peripherals active, internal dissipation reaches 1.0 W, giving a junction-to-ambient rise of ~40 C above ambient. For sealed enclosures, derate clock frequency or provide forced airflow. The exposed thermal pad (EP) must be soldered to a copper pour of at least 1 square inch for thermal relief.
Do not leave unused VDDCORE pins floating - each must be connected to its 1.2 V internal LDO output with a 1 uF bypass. Forgetting this is a top cause of PIC32MZ EF reset and brownout issues. Additionally, configure the FCR (Flash Control Register) wait states per datasheet for 200 MHz operation; running at full speed with default wait states causes erratic Flash reads.
Route USB D+/D- lines as a 90-ohm differential pair with continuous reference ground on the layer below, keeping total length under 50 mm. For Ethernet, route RMII/RGMII signals as 50-ohm controlled-impedance traces and keep them away from switching power inductors. Per Microchip hardware design checklist, use series ferrite beads on cable-side connectors to suppress EMI from external Ethernet cables.
Compliance-Informationen
RoHS compliant per Microchip product page. AEC-Q100 not qualified for this part number; automotive applications should consult Microchip's AEC-Q100 qualified PIC32MZ EF variants.
