PIC32MZ2025DAH176-I/2J - 200MHz 32-bit MCU with 2MB Flash | Microchip
Teilenummer: PIC32MZ2025DAH176-I/2J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.33 | $7,33 |
| 10 | $6.59 | $65,90 |
| 100 | $5.92 | $592,00 |
| 500 | $5.34 | $2.670,00 |
| 1.000 | $4.83 | $4.830,00 |
PIC32MZ2025DAH176-I/2J Übersicht
A 32-bit microcontroller (MCU) is a single-chip computer whose CPU datapath, registers, and ALU are 32 bits wide, enabling high code density, large linear address spaces, and single-instruction throughput closer to that of a microprocessor than legacy 8- or 16-bit MCUs. Within the broader taxonomy, this part sits in the PIC32 family (32-bit MCU) under Microcontrollers (Integrated Circuits), and the PIC32MZ DA sub-family adds an integrated 2D graphics engine and stacked DDR2 DRAM controller so that the device can drive TFT LCD panels without an external graphics ASIC or memory.
Key features include 200 MHz CPU core, 2 MB Flash, 256 KB SRAM, integrated DDR2 controller and Graphics Processor, 12-bit ADC at 18 MSPS, HS USB 2.0 OTG, dual CAN, 10/100 Ethernet MAC, up to 45 analog inputs, and 120 GPIO. The 176-LQFP exposed pad gives an industrial-grade thermal path for sustained graphics workloads.
Architecturally, the PIC32MZ DA uses a 5-stage MIPS32 microAptiv pipeline with single-cycle MAC, hardware multiply/divide, and a dedicated GPU block that offloads primitives and fills so the CPU is free to run application logic and the RTOS.
Typical applications include HMI/GUI with TFT LCD, industrial control panels, automotive infotainment, smart appliances, and medical patient-interface displays. Choose this device when you need MCU simplicity with MPU-class graphics and multimedia throughput.
For design, place at least one 0.1 µF decoupling cap per VDD pin, keep DDR2 traces length-matched per the DDR2 layout guide, and use the exposed pad with a continuous ground copper pour to meet thermal targets.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone Microchip datasheet.
Drop-in-Alternativen für PIC32MZ2025DAH176-I/2J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2025DAH176-I/2J (gleiche Bauform und Footprint) – abweichend in Graphics Controller, CAN, USB, Package, External Memory Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2025DAH176T-I/2J
✅ Drop-In✓ Auf Lager
$6.35 / Stück
Datenblatt ansehen →PIC32MZ2025DAG176-I/2J
✅ Drop-In✓ Auf Lager
$11.2 / Stück
Datenblatt ansehen →PIC32MZ2064DAH176-I/2J
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11.3 / Stück
Datenblatt ansehen →PIC32MZ2064DAH176T-I/2J
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$15.51 / Stück
Datenblatt ansehen →PIC32MZ2025DAB176T-I/2J
✅ Drop-In✓ Auf Lager
$12.4 / Stück
Datenblatt ansehen →PIC32MZ2025DAA176T-I/2J
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.83 / Stück
Datenblatt ansehen →PIC32MZ2025DAH176-I/2J Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Core Series | PIC32MZ DA (Graphics Family) |
| Maximum CPU Frequency | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 256 KB |
| External DRAM Interface | On-chip 32 MB or external 128 MB DDR2 |
| Graphics Controller | Integrated 2D GPU + Graphics Processor |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Versorgungsspannung | 2.2 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (industrial) |
| GPIO Count | 120 I/O |
| USB | HS USB 2.0 OTG |
| CAN | 2x CAN |
| Ethernet | 10/100 MAC |
| Other Connectivity | I2C, I2S, SPI, UART |
| Gehäuse | 176-LQFP Exposed Pad (20x20 mm) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
PIC32MZ2025DAH176-I/2J Pin-Konfiguration
| Pin 1 | OSC1/RC13 — External oscillator input / GPIO RC13 |
| Pin 2 | OSC2/RC15 — External oscillator output / GPIO RC15 |
| Pin 3 | VDD — Supply voltage 2.2-3.6V |
| Pin 4 | VSS — Ground reference |
| Pin 5 | RA0 — GPIO PORTA bit 0 |
| Pin 6 | RA1 — GPIO PORTA bit 1 |
| Pin 7 | RA2 — GPIO PORTA bit 2 |
| Pin 8 | RA3 — GPIO PORTA bit 3 |
| Pin 9 | RA4 — GPIO PORTA bit 4 |
| Pin 10 | RA5 — GPIO PORTA bit 5 |
| Pin 11 | VDD — Supply voltage |
| Pin 12 | VSS — Ground |
| Pin 13 | RB0 — GPIO PORTB bit 0 / PGED1 |
| Pin 14 | RB1 — GPIO PORTB bit 1 / PGEC1 |
| Pin 15 | RB2 — GPIO PORTB bit 2 |
| Pin 16 | RB3 — GPIO PORTB bit 3 |
| Pin 17 | RB4 — GPIO PORTB bit 4 |
| Pin 18 | RB5 — GPIO PORTB bit 5 |
| Pin 19 | RB6 — GPIO PORTB bit 6 |
| Pin 20 | RB7 — GPIO PORTB bit 7 |
| Pin 21 | VDD — Supply voltage |
| Pin 22 | VSS — Ground |
| Pin 23 | RC0 — GPIO PORTC bit 0 |
| Pin 24 | RC1 — GPIO PORTC bit 1 |
| Pin 25 | RC2 — GPIO PORTC bit 2 |
| Pin 26 | RC3 — GPIO PORTC bit 3 |
| Pin 27 | RC4 — GPIO PORTC bit 4 |
| Pin 28 | RC5 — GPIO PORTC bit 5 |
| Pin 29 | RC6 — GPIO PORTC bit 6 |
| Pin 30 | RC7 — GPIO PORTC bit 7 |
| Pin 31 | VDD — Supply voltage |
| Pin 32 | VSS — Ground |
| Pin 33 | RD0 — GPIO PORTD bit 0 |
| Pin 34 | RD1 — GPIO PORTD bit 1 |
| Pin 35 | RD2 — GPIO PORTD bit 2 |
| Pin 36 | RD3 — GPIO PORTD bit 3 |
| Pin 37 | RD4 — GPIO PORTD bit 4 |
| Pin 38 | RD5 — GPIO PORTD bit 5 |
| Pin 39 | RD6 — GPIO PORTD bit 6 |
| Pin 40 | RD7 — GPIO PORTD bit 7 |
| Pin 41 | VDD — Supply voltage |
| Pin 42 | VSS — Ground |
| Pin 43 | RE0 — GPIO PORTE bit 0 |
| Pin 44 | RE1 — GPIO PORTE bit 1 |
| Pin 45 | RE2 — GPIO PORTE bit 2 |
| Pin 46 | RE3 — GPIO PORTE bit 3 |
| Pin 47 | RE4 — GPIO PORTE bit 4 |
| Pin 48 | RE5 — GPIO PORTE bit 5 |
| Pin 49 | RE6 — GPIO PORTE bit 6 |
| Pin 50 | RE7 — GPIO PORTE bit 7 |
| Pin 51 | VDD — Supply voltage |
| Pin 52 | VSS — Ground |
| Pin 53 | RF0 — GPIO PORTF bit 0 |
| Pin 54 | RF1 — GPIO PORTF bit 1 |
| Pin 55 | RF2 — GPIO PORTF bit 2 |
| Pin 56 | RF3 — GPIO PORTF bit 3 |
| Pin 57 | RF4 — GPIO PORTF bit 4 |
| Pin 58 | RF5 — GPIO PORTF bit 5 |
| Pin 59 | RF6 — GPIO PORTF bit 6 |
| Pin 60 | RF7 — GPIO PORTF bit 7 |
| Pin 61 | VDD — Supply voltage |
| Pin 62 | VSS — Ground |
| Pin 63 | RG0 — GPIO PORTG bit 0 |
| Pin 64 | RG1 — GPIO PORTG bit 1 |
| Pin 65 | RG2 — GPIO PORTG bit 2 |
| Pin 66 | RG3 — GPIO PORTG bit 3 |
| Pin 67 | RG6 — GPIO PORTG bit 6 |
| Pin 68 | RG7 — GPIO PORTG bit 7 |
| Pin 69 | RG8 — GPIO PORTG bit 8 |
| Pin 70 | RG9 — GPIO PORTG bit 9 |
| Pin 71 | VDD — Supply voltage |
| Pin 72 | VSS — Ground |
| Pin 73 | RH0 — GPIO PORTH bit 0 |
| Pin 74 | RH1 — GPIO PORTH bit 1 |
| Pin 75 | RH2 — GPIO PORTH bit 2 |
| Pin 76 | RH3 — GPIO PORTH bit 3 |
| Pin 77 | RH4 — GPIO PORTH bit 4 |
| Pin 78 | RH5 — GPIO PORTH bit 5 |
| Pin 79 | RH6 — GPIO PORTH bit 6 |
| Pin 80 | RH7 — GPIO PORTH bit 7 |
| Pin 81 | VDD — Supply voltage |
| Pin 82 | VSS — Ground |
| Pin 83 | RJ0 — GPIO PORTJ bit 0 |
| Pin 84 | RJ1 — GPIO PORTJ bit 1 |
| Pin 85 | RJ2 — GPIO PORTJ bit 2 |
| Pin 86 | RJ3 — GPIO PORTJ bit 3 |
| Pin 87 | RJ4 — GPIO PORTJ bit 4 |
| Pin 88 | RJ5 — GPIO PORTJ bit 5 |
| Pin 89 | RJ6 — GPIO PORTJ bit 6 |
| Pin 90 | RJ7 — GPIO PORTJ bit 7 |
| Pin 91 | VDD — Supply voltage |
| Pin 92 | VSS — Ground |
| Pin 93 | RK0 — GPIO PORTK bit 0 |
| Pin 94 | RK1 — GPIO PORTK bit 1 |
| Pin 95 | RK2 — GPIO PORTK bit 2 |
| Pin 96 | RK3 — GPIO PORTK bit 3 |
| Pin 97 | RK4 — GPIO PORTK bit 4 |
| Pin 98 | RK5 — GPIO PORTK bit 5 |
| Pin 99 | RK6 — GPIO PORTK bit 6 |
| Pin 100 | RK7 — GPIO PORTK bit 7 |
| Pin 101 | VDD — Supply voltage |
| Pin 102 | VSS — Ground |
| Pin 103 | RL0 — GPIO PORTL bit 0 |
| Pin 104 | RL1 — GPIO PORTL bit 1 |
| Pin 105 | RL2 — GPIO PORTL bit 2 |
| Pin 106 | RL3 — GPIO PORTL bit 3 |
| Pin 107 | RL4 — GPIO PORTL bit 4 |
| Pin 108 | RL5 — GPIO PORTL bit 5 |
| Pin 109 | RL6 — GPIO PORTL bit 6 |
| Pin 110 | RL7 — GPIO PORTL bit 7 |
| Pin 111 | VDD — Supply voltage |
| Pin 112 | VSS — Ground |
| Pin 113 | DAC1/A0 — DAC output or analog input |
| Pin 114 | A1 — Analog input 1 |
| Pin 115 | A2 — Analog input 2 |
| Pin 116 | A3 — Analog input 3 |
| Pin 117 | A4 — Analog input 4 |
| Pin 118 | A5 — Analog input 5 |
| Pin 119 | A6 — Analog input 6 |
| Pin 120 | A7 — Analog input 7 |
| Pin 121 | VDD — Supply voltage |
| Pin 122 | VSS — Ground |
| Pin 123 | A8 — Analog input 8 |
| Pin 124 | A9 — Analog input 9 |
| Pin 125 | A10 — Analog input 10 |
| Pin 126 | A11 — Analog input 11 |
| Pin 127 | A12 — Analog input 12 |
| Pin 128 | A13 — Analog input 13 |
| Pin 129 | A14 — Analog input 14 |
| Pin 130 | A15 — Analog input 15 |
| Pin 131 | VDD — Supply voltage |
| Pin 132 | VSS — Ground |
| Pin 133 | DDR_DQ0 — DDR2 data bit 0 (or stacked DRAM IO) |
| Pin 134 | DDR_DQ1 — DDR2 data bit 1 (or stacked DRAM IO) |
| Pin 135 | DDR_DQ2 — DDR2 data bit 2 (or stacked DRAM IO) |
| Pin 136 | DDR_DQ3 — DDR2 data bit 3 (or stacked DRAM IO) |
| Pin 137 | DDR_DQ4 — DDR2 data bit 4 (or stacked DRAM IO) |
| Pin 138 | DDR_DQ5 — DDR2 data bit 5 (or stacked DRAM IO) |
| Pin 139 | DDR_DQ6 — DDR2 data bit 6 (or stacked DRAM IO) |
| Pin 140 | DDR_DQ7 — DDR2 data bit 7 (or stacked DRAM IO) |
| Pin 141 | VDD — Supply voltage |
| Pin 142 | VSS — Ground |
| Pin 143 | DDR_DQS — DDR2 data strobe (or stacked DRAM IO) |
| Pin 144 | DDR_CK — DDR2 clock (or stacked DRAM IO) |
| Pin 145 | DDR_CKE — DDR2 clock enable (or stacked DRAM IO) |
| Pin 146 | DDR_CS — DDR2 chip select (or stacked DRAM IO) |
| Pin 147 | DDR_RAS — DDR2 row address strobe (or stacked DRAM IO) |
| Pin 148 | DDR_CAS — DDR2 column address strobe (or stacked DRAM IO) |
| Pin 149 | DDR_WE — DDR2 write enable (or stacked DRAM IO) |
| Pin 150 | DDR_BA0 — DDR2 bank address 0 (or stacked DRAM IO) |
| Pin 151 | VDD — Supply voltage |
| Pin 152 | VSS — Ground |
| Pin 153 | DDR_A0 — DDR2 address bit 0 (or stacked DRAM IO) |
| Pin 154 | DDR_A1 — DDR2 address bit 1 (or stacked DRAM IO) |
| Pin 155 | DDR_A2 — DDR2 address bit 2 (or stacked DRAM IO) |
| Pin 156 | DDR_A3 — DDR2 address bit 3 (or stacked DRAM IO) |
| Pin 157 | DDR_A4 — DDR2 address bit 4 (or stacked DRAM IO) |
| Pin 158 | DDR_A5 — DDR2 address bit 5 (or stacked DRAM IO) |
| Pin 159 | DDR_A6 — DDR2 address bit 6 (or stacked DRAM IO) |
| Pin 160 | DDR_A7 — DDR2 address bit 7 (or stacked DRAM IO) |
| Pin 161 | VDD — Supply voltage |
| Pin 162 | VSS — Ground |
| Pin 163 | DDR_A8 — DDR2 address bit 8 (or stacked DRAM IO) |
| Pin 164 | DDR_A9 — DDR2 address bit 9 (or stacked DRAM IO) |
| Pin 165 | DDR_A10 — DDR2 address bit 10 (or stacked DRAM IO) |
| Pin 166 | DDR_A11 — DDR2 address bit 11 (or stacked DRAM IO) |
| Pin 167 | DDR_A12 — DDR2 address bit 12 (or stacked DRAM IO) |
| Pin 168 | USB_DP — HS USB D+ (or stacked DRAM IO) |
| Pin 169 | USB_DM — HS USB D- (or stacked DRAM IO) |
| Pin 170 | VBUS — HS USB VBUS detect (or stacked DRAM IO) |
| Pin 171 | VDD_USB — HS USB transceiver supply (or stacked DRAM IO) |
| Pin 172 | VSS — Ground |
| Pin 173 | TCK — JTAG test clock |
| Pin 174 | TMS — JTAG test mode select |
| Pin 175 | TDI — JTAG test data in |
| Pin 176 | TDO — JTAG test data out |
Typische Anwendungen
PIC32MZ2025DAH176-I/2J ist geeignet für 6 Anwendungs: Industrial HMI with TFT LCD, Automotive Infotainment Sub-Display, Smart Appliance Control Panel, Medical Patient-Interface Display, Building Automation Touch Panels, Point-of-Sale Terminal with Color Display.
Industrial HMI with TFT LCD
The PIC32MZ2025DAH176-I/2J is purpose-built for industrial HMI panels driving TFT LCDs up to WVGA resolution. Its integrated 2D Graphics Processor offloads primitives, line draws, blits, and color fills from the CPU, allowing the MIPS32 microAptiv core to run the application logic and RTOS concurrently. The on-chip 32 MB stacked DDR2 provides ample frame buffer for multi-layer GUIs without an external SDRAM chip, simplifying PCB layout. With 120 GPIO, multiple SPI ports for display and touch controllers, and 12-bit 18 MSPS ADC for sensor input, this MCU replaces an MPU+external-GPU+external-SDRAM stack with a single chip. Compared to adding a discrete GPU ASIC, integrating the graphics block reduces BOM cost, PCB area, and firmware complexity while still delivering smooth 60 fps UI updates.
Empfohlen
Automotive Infotainment Sub-Display
The PIC32MZ2025DAH176-I/2J suits automotive infotainment sub-displays such as HVAC panels, rear-seat entertainment touch screens, and instrument-cluster secondary zones. Its 200 MHz MIPS32 core runs real-time UI code while the integrated GPU renders gauge graphics, and HS USB 2.0 OTG provides connectivity to the head unit. Dual CAN interfaces integrate with vehicle CAN-FD networks, while 12-bit ADC inputs handle analog sensor signals. The -40C to +85C industrial temperature range covers cabin electronics. Compared to discrete MPU designs, integrating DDR2 controller and GPU cuts PCB area, BOM count, and EMI complexity. The 176-LQFP exposed pad simplifies thermal management in enclosed automotive enclosures.
Empfohlen
Smart Appliance Control Panel
The PIC32MZ2025DAH176-I/2J powers the touch-screen control panel on premium smart appliances: washing machines, ovens, refrigerators, and robotic vacuums. The integrated graphics engine drives the user-facing TFT LCD at 60 fps with animated icons and progress indicators, while the MIPS32 core handles the appliance state machine, motor control loop, and Wi-Fi/BLE co-processor management via UART/SPI. The 120 GPIO count allows direct interface with capacitive touch controllers, segment drivers, and discrete indicators without external I/O expanders. Its 2 MB Flash supports full HMI firmware stacks including asset libraries, multilingual resources, and OTA update slots. Compared to discrete MCU plus external LCD controller, the integrated solution reduces BOM and accelerates time to market.
Empfohlen
Medical Patient-Interface Display
The PIC32MZ2025DAH176-I/2J is appropriate for medical patient-interface displays such as infusion pump screens, patient monitor secondary displays, and diagnostic device control panels. Its 12-bit 18 MSPS ADC with up to 45 analog inputs provides precise digitization of sensor signals, while the integrated GPU renders smooth trend graphs and waveform visualizations. The MIPS32 core handles the safety-critical logic while the GPU refreshes the display in parallel. With HS USB and Ethernet, the device connects to hospital networks and bedside monitoring systems. The 2 MB Flash supports full IEC 62304-compliant firmware with bootloader and self-test routines. Compared to discrete MPU designs, the integrated graphics and DDR2 controller reduce PCB complexity and improve reliability.
Empfohlen
Building Automation Touch Panels
The PIC32MZ2025DAH176-I/2J integrates the requirements of building automation touch panels: a graphical UI for floor plans, lighting scenes, and HVAC control; Ethernet connectivity for BACnet/Modbus-TCP networks; and CAN/RS-485 for fieldbus integration. The integrated GPU renders floor plans and lighting animations smoothly, while the MIPS32 core handles the building automation protocol stack and logic. With 2 MB Flash, the device stores full floor plans, multilingual strings, and OTA update slots. Compared to running a Linux MPU, the PIC32MZ2025DAH176-I/2J boots in under 100 ms, supports deterministic real-time response, and avoids the security maintenance burden of an OS.
Empfohlen
Point-of-Sale Terminal with Color Display
The PIC32MZ2025DAH176-I/2J powers compact point-of-sale terminals that need a color TFT for menu display, signature capture, and QR code rendering. The integrated 2D GPU accelerates QR/barcode generation and screen transitions, while the MIPS32 core handles payment processing, encryption, and USB peripherals. HS USB 2.0 OTG connects to fiscal printers and external barcode scanners; Ethernet provides cloud payment gateway connectivity. With 256 KB SRAM, transaction buffers and cryptographic state fit comfortably. Compared to MPU-based POS designs, the integrated solution reduces BOM cost and enables fanless, compact enclosures with longer MTBF.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2025DAH176-I/2J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2025DAH176T-I/2J | PIC32MZ2025DAG176-I/2J | PIC32MZ2064DAH176-I/2J | PIC32MZ2064DAH176T-I/2J | PIC32MZ2025DAB176T-I/2J | PIC32MZ2025DAA176T-I/2J |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) Exposed Pad | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 640 KB | 640 KB | 256 KB | 256 KB |
| Stacked DRAM | 32 MB on-chip (H suffix) | 32 MB on-chip (H) | Smaller G designator DRAM | 32 MB on-chip (H) | 32 MB on-chip (H) | Different B designator DRAM | Different A designator DRAM |
| GPU | Yes (integrated 2D) | Yes (integrated 2D) | Yes (integrated 2D) | Yes (integrated 2D) | Yes (integrated 2D) | Yes (integrated 2D) | Yes (integrated 2D) |
| Packaging | Tray | Tape & Reel | Tray | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- Highest on-chip stacked DRAM density in family (vs. PIC32MZ2025DAG176-I/2J)
- Identical footprint with 2.5x SRAM upgrade available (vs. PIC32MZ2064DAH176-I/2J)
- Tape-and-reel variant for high-volume SMT (vs. PIC32MZ2025DAH176T-I/2J)
Designhinweise
Estimated: the PIC32MZ2025DAH176-I/2J can draw 100-300 mA at 200 MHz with full DDR2 and GPU utilization. Place one 0.1 µF + one 4.7 µF ceramic capacitor within 5 mm of every VDD/VSS pin pair, and use a 4-layer PCB with a dedicated ground plane. The on-chip DDR2 LDO requires its own 1 µF bypass cap at the VDDR_CAP pin per Microchip's DDR2 routing guide.
DDR2 signals (DQ, DQS, CK, CKE, CS, RAS, CAS, WE, BA, A) require length-matched routing: data group ±25 mils, address/control ±50 mils, with proper series termination. Use fly-by topology if external DDR2 is fitted; the on-chip stacked DRAM routes internally and does not require external length matching. Maintain 50 ohm controlled impedance on all DDR2 nets.
Estimated: at full CPU+GPU load, the die dissipates ~0.8-1.2 W. The 176-LQFP exposed pad must be soldered to a copper pour of at least 1 square inch connected to ground. Without the exposed pad, junction temperature may exceed 125 C at industrial ambient. Use thermal vias under the pad to inner ground planes.
Do not skip configuring the FBS bits to enable the I/O port multiplexing needed for HS USB or Ethernet - leaving pins in default analog state will cause peripherals to fail. Also, the JTAG pins TCK/TMS/TDI/TDO must be left disconnected or pulled appropriately in production to avoid debug intrusion.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - select AEC-Q100 qualified PIC32 variants for automotive safety-critical applications. Conflict minerals declaration per Microchip corporate policy.
