PIC32MZ2025DAG176-I/2J - 200MHz 32-bit Graphics MCU, 2MB Flash | Microchip
MPN: PIC32MZ2025DAG176-I/2J ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.5 | $17.50 |
| 10 | $15.75 | $157.50 |
| 100 | $14 | $1,400.00 |
| 500 | $12.5 | $6,250.00 |
| 1,000 | $11.2 | $11,200.00 |
PIC32MZ2025DAG176-I/2J Overview
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit processor core, program memory (Flash), working memory (SRAM), and a rich set of peripherals on one die. The PIC32MZ DA family sits at the high end of the MCU hierarchy - above 8-bit and 16-bit microcontrollers, below application processors (MPUs). Within the power management hierarchy of an embedded system, the MCU acts as the system-on-chip orchestrator that controls power sequencing, graphics rendering, communication interfaces, and user interaction in graphical HMI applications.
Key features include 2 MB Live Update Flash for dual-image firmware upgrades, 640 KB SRAM, integrated DDR2 controller supporting up to 128 MB external addressable memory, 12-bit ADC modules with up to 18 Msps sampling rate, 200 MHz operation across -40C to +85C industrial temperature range, and a 6-channel hardware Graphics Processor that offloads draw operations from the CPU. The device supports VDDIO from 2.2V to 3.6V and VDDCORE from 1.7V to 1.9V, with extensive connectivity including USB, CAN, Ethernet, and multiple UART/SPI/I2C peripherals.
Architecturally, the PIC32MZ2025DAG176-I/2J uses the MIPS32 microAptiv core with a 16 KB I-cache and 4 KB D-cache, a memory management unit, and a tightly coupled DDR2 interface. The integrated Graphics Controller includes hardware acceleration for line draw, block transfer, and alpha blending, allowing rich GUIs on TFT LCDs at low CPU overhead. A dedicated JPEG decoder and crypto engine (AES, SHA) are also present in the silicon.
Typical applications include industrial HMI panels, medical patient monitors, automotive infotainment displays, point-of-sale terminals, home automation touch panels, and any GUI-driven embedded product that needs MPU-like graphics performance without the OS complexity of a Linux MPU.
When designing with this MCU, allocate adequate PCB area for the DDR2 routing (controlled impedance, matched length pairs), provide robust decoupling on all VDDIO/VDDCORE pins, and use the Harmony 3 software framework and MPLAB Harmony Graphics Suite to accelerate firmware development. The Live Update Flash feature requires careful linker script configuration to manage dual-image A/B partitions.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the PIC32MZ2025DAG176-I/2J for new designs and identify pin-compatible replacements.
Drop-in alternatives for PIC32MZ2025DAG176-I/2J — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ2025DAG176-I/2J (same form factor and footprint) — differing in Graphics Controller, CAN, Package, USB, Operating Temperature.
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View Datasheet →PIC32MZ2025DAG176-I/2J Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Integrated DDR2 Controller | 32 MB on-chip addressable, up to 128 MB external |
| Graphics Controller | Yes (integrated, 6-channel hardware accelerator) |
| Graphics Processor | Yes (hardware line draw, BLIT, alpha blend) |
| ADC Resolution | 12-bit |
| ADC Sampling Rate | Up to 18 Msps |
| Number of ADC Modules | Up to 6 (5 dedicated, 1 shared) |
| Number of I/Os | 120 |
| Supply Voltage VDDIO | 2.2 V to 3.6 V |
| Supply Voltage VDDCORE | 1.7 V to 1.9 V |
| Operating Temperature | -40C to +85C |
| Package | 176-LQFP Exposed Pad (20x20 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead Free | Yes |
PIC32MZ2025DAG176-I/2J 176-lqfp exposed pad (20x20 mm) Pin Configuration Guide
Pin configuration for PIC32MZ2025DAG176-I/2J (176-lqfp exposed pad (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ2025DAG176-I/2J.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ2025DAG176-I/2J is suitable for 6 applications: Industrial HMI Control Panels, Medical Patient Monitoring Displays, Automotive Infotainment and Cluster Displays, Point-of-Sale Terminals, Home Automation Touch Panels, IoT Gateways with Local Display.
Industrial HMI Control Panels
The PIC32MZ2025DAG176-I/2J is well-suited for industrial human-machine interface (HMI) panels driving 4.3-inch to 7-inch WVGA TFT-LCDs with full-color GUIs. Its integrated Graphics Controller with 6-layer hardware acceleration offloads line draw, block transfer, and alpha blending from the 200 MHz MIPS32 microAptiv core, freeing the CPU for control-loop tasks. The 2 MB Live Update Flash enables safe dual-image firmware upgrades in factory-floor installations where downtime is unacceptable. The -40C to +85C industrial temperature range tolerates cabinet ambient temperatures up to 70C without derating.
Recommended
Medical Patient Monitoring Displays
The PIC32MZ2025DAG176-I/2J fits medical patient monitor display modules that require real-time waveform rendering, multi-parameter visualization, and IEC 60601-1-compliant reliability. The hardware Graphics Processor renders ECG/SpO2/IBP waveforms at sustained frame rates without CPU intervention, while the 640 KB SRAM accommodates double-buffered frame buffers for flicker-free updates. The integrated 12-bit ADC with 18 Msps sampling supports direct interface to analog front-end signals, reducing external component count. Designers should validate IEC 60601-1 EMI/EMC margins specific to their end-device enclosure.
Recommended
Automotive Infotainment and Cluster Displays
For automotive center-stack and instrument cluster prototypes, the PIC32MZ2025DAG176-I/2J delivers MPU-class rendering at MCU footprint cost. The integrated DDR2 controller supports direct connection to a 32 MB or 128 MB external DDR2 chip, providing the bandwidth needed for 800x480 WVGA displays with partial-screen refresh. The 200 MHz MIPS32 core executes CAN-FD and Automotive Ethernet stacks concurrently with graphics tasks. Note that production automotive designs should consider AEC-Q100-qualified PIC32 variants in the same 176-LQFP footprint for full automotive qualification.
Recommended
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2025DAG176-I/2J's integrated graphics controller and high-speed USB 2.0 High-Speed with on-chip PHY, eliminating the need for an external graphics chip or USB PHY. The hardware JPEG decoder accelerates receipt printer bitmap generation and barcode scanner image processing, while the integrated AES/SHA crypto engine secures PIN-pad transactions. The 176-LQFP package's exposed pad provides adequate thermal dissipation for the 200 MHz operation at 1.8V VDDCORE under continuous transaction throughput.
Recommended
Home Automation Touch Panels
Smart home wall-mounted touch panels use the PIC32MZ2025DAG176-I/2J to drive capacitive-touch 5-inch WVGA displays showing lighting, HVAC, and security status with smooth animations. The 2 MB Flash stores the full GUI framework plus application firmware without external memory, while the 640 KB SRAM supports multiple screen layers with alpha blending for glass-effect UI design. Wi-Fi connectivity is achieved via SPI-attached modules (e.g., MRF24WN0MA or ATWINC1500), keeping the main MCU dedicated to graphics rendering.
Recommended
IoT Gateways with Local Display
Industrial IoT gateways with local HMI displays for at-a-glance status monitoring leverage the PIC32MZ2025DAG176-I/2J's Ethernet MAC and dual CAN interfaces alongside the integrated graphics. The 200 MHz MIPS32 core runs TLS 1.2/1.3 stacks for secure cloud connectivity, while the Graphics Controller drives a 4.3-inch color TFT showing network topology and sensor data without taxing the CPU. The 2 MB Flash holds OTA update images in dual partitions, enabling field-proven firmware upgrade workflows over Ethernet.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ2025DAG176-I/2J — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1064DAG176T-I/2J | PIC32MZ2025DAL176-I/2J | PIC32MZ2025DAK176-I/2J | PIC32MZ2025DAB176T-I/2J | PIC32MZ1025DAL176-I/2J |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) with exposed pad | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 2 MB | 1 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 256 KB | 256 KB |
| Max CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Integrated DDR2 Controller | Yes (32 MB / 128 MB) | Yes | Yes | Yes | Yes | Yes |
| Graphics Controller | Yes (integrated) | Yes | Yes | Yes | Yes | Yes |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Highest Flash density in the DA family at 176-pin LQFP (vs PIC32MZ1064DAG176T-I/2J)
- Full 640 KB SRAM for multi-layer frame buffers (vs PIC32MZ2025DAB176T-I/2J)
- Same hardware graphics accelerator across all DA variants (vs PIC32MX795F512L)
Design Notes
The DDR2 interface requires strict PCB layout discipline: route DQ, DQS, and CLK as 50-ohm controlled-impedance microstrips with matched lengths within +/-25 mil. Place the DDR2 chip on the same layer as the MCU, no via transitions on the data byte lanes, and provide a continuous ground reference plane underneath the DDR2 routing region. The exposed thermal pad must be soldered to a continuous ground copper pour with at least 8 thermal vias for heat dissipation.
Use a dedicated LDO or DC-DC regulator for VDDCORE (1.7-1.9V) with tight +/-3% tolerance. The core current can reach 200 mA at 200 MHz operation with the Graphics Processor active. Decouple each VDDIO pin with 100 nF ceramic + 4.7 uF bulk capacitor placed within 5 mm of the pin. Add a ferrite bead between VDDIO and VDDCORE domains to reduce switching noise coupling into the analog ADC reference.
At 200 MHz with the Graphics Controller running continuously, the PIC32MZ2025DAG176-I/2J junction temperature can rise 20-30C above ambient. The 176-LQFP exposed pad provides a thermal path; for forced-air or sealed-enclosure designs, ensure adequate copper thermal vias under the pad (at least 9 x 0.3 mm thermal vias). Derate maximum clock to 180 MHz if junction temperature exceeds 100C in your thermal characterization.
The Live Update Flash feature requires careful linker script configuration to allocate A and B image partitions at fixed flash addresses - failure to do so causes OTA updates to overwrite the running bootloader. Do not skip the MPLAB Harmony 3 BSP configuration for the graphics controller: the HX8238, ILI9488, and other common TFT drivers require a separate MHC component installation. Always set the watchdog timer (WDT) in production firmware; uncoupled code paths in a 200 MHz MCU can hang within milliseconds.
Compliance Information
RoHS and REACH compliant per Microchip product page; not AEC-Q100 qualified - this is the industrial-grade (-40C to +85C) variant. AEC-Q100 automotive versions may exist with different ordering codes.