PIC32MZ2025DAK169T-V/HF - 200MHz MCU 2MB Flash 169-LFBGA | Microchip
Teilenummer: PIC32MZ2025DAK169T-V/HF ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16.18 | $16,18 |
| 10 | $14.56 | $145,60 |
| 100 | $13.02 | $1.302,00 |
| 500 | $11.73 | $5.865,00 |
| 1.000 | $10.45 | $10.450,00 |
PIC32MZ2025DAK169T-V/HF Übersicht
A 32-bit microcontroller (MCU) is an embedded processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single die. Within the embedded hierarchy, an MCU sits below an MPU (which lacks on-chip Flash and typically requires external memory), and high-end graphical MCUs like the PIC32MZ DA series blur that line by adding external DDR2 memory interfaces, dedicated 2D graphics hardware, and TFT/LCD controllers, enabling direct driving of human-machine interface (HMI) panels without a separate graphics chip.
Key differentiating features include a 12-bit ADC running at 18 MSPS with up to 45 analog inputs, integrated CAN and Hi-Speed USB (HS USB), and the V-temp operating range of -40C to +105C, which extends the industrial envelope for harsh environments. The 2 MB Flash and 640 KB SRAM allow large graphics framebuffers and rich application code to coexist on-chip, while the MIPS32 microAptiv core at 200 MHz delivers ample headroom for real-time GUI workloads.
Architecturally, the PIC32MZ DAK combines a single-core MIPS32 microAptiv processor with a separate Graphics Processor block and DDR2 memory controller, offloading 2D rendering from the main CPU. This dual-engine approach is more efficient than running the GUI on the main core alone and reduces latency for animation-heavy HMI applications. The integrated TFT/LCD controller supports direct connection to common display resolutions, eliminating the need for an external graphics bridge.
Typical applications include industrial HMI panels, automotive infotainment clusters, medical patient monitors, point-of-sale terminals, and home-automation touch panels where the 2 MB Flash, 640 KB SRAM, and 45 analog inputs can simultaneously drive a graphical display and interface with sensors.
When designing with this device, allocate sufficient PCB area for the 169-ball LFBGA (11x11 mm) - it requires a 4-layer or higher stack-up with microvia fan-out for reliable assembly. Plan DDR2 routing first per the DDR2 design checklist in the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in PIC32MZ DA family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für PIC32MZ2025DAK169T-V/HF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2025DAK169T-V/HF (gleiche Bauform und Footprint) – abweichend in USB, CAN, Graphics Controller, Operating Temperature, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2025DAK169T-I/HF
✅ Drop-In✓ Auf Lager
$10.65 / Stück
Datenblatt ansehen →PIC32MZ2025DAK169-I/HF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.86 / Stück
Datenblatt ansehen →PIC32MZ2025DAG169T-I/6J
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →PIC32MZ2025DAH169T-I/6J
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →PIC32MZ1064DAB169T-I/HF
✅ Drop-In✓ Auf Lager
$4.52 / Stück
Datenblatt ansehen →PIC32MZ1025DAK169-I/HF
✅ Drop-In✓ Auf Lager
$10.95 / Stück
Datenblatt ansehen →PIC32MZ2025DAK169T-V/HF Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ DAK (Graphics Integrated) |
| Core Count | Single-core |
| Maximum CPU Speed | 200 MHz |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM, 32 MB or 128 MB addressable |
| Integrated Graphics Controller | Yes (TFT/LCD) |
| Integrated Graphics Processor | Yes (2D GPU) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB (HS USB) |
| CAN | Yes (integrated) |
| Operating Temperature Grade | V-temp (-40C to +105C) |
| Gehäuse | 169-LFBGA (11x11 mm) |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
PIC32MZ2025DAK169T-V/HF 169-lfbga (11x11 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ2025DAK169T-V/HF (169-lfbga (11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ2025DAK169T-V/HF.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ2025DAK169T-V/HF ist geeignet für 6 Anwendungs: Industrial HMI Touch Panels, Automotive Infotainment Clusters, Medical Patient Monitors, Point-of-Sale Terminals, Home Automation Touch Panels, Building Automation Control Boards.
Industrial HMI Touch Panels
The PIC32MZ2025DAK169T-V/HF is well-suited for industrial HMI panels driving 4.3" to 7" TFT displays. Its integrated 2D Graphics Processor offloads draw routines from the 200 MHz MIPS32 core, the DDR2 interface supports large framebuffers for smooth animations, and the 12-bit 18 MSPS ADC with up to 45 analog inputs reads backlight, temperature, and touch-sensor channels simultaneously. Placed as the sole master on the panel PCB, it replaces an MCU-plus-discrete-gpu architecture.
Empfohlen
Automotive Infotainment Clusters
In automotive infotainment clusters, the PIC32MZ2025DAK169T-V/HF's V-temp rating to +105C and integrated graphics simplify instrument-cluster and center-stack designs. The CAN interface connects to vehicle networks, HS USB enables smartphone projection, and the 2 MB Flash stores large gauge and icon assets. The integrated TFT controller drives WVGA panels directly. Engineers should validate AEC-Q100 qualification status against the specific automotive part number before deploying.
Empfohlen
Medical Patient Monitors
The 12-bit 18 MSPS ADC with up to 45 analog inputs makes the PIC32MZ2025DAK169T-V/HF a candidate for multi-parameter patient monitors reading ECG, SpO2, temperature, and respiration channels simultaneously. The 640 KB SRAM buffers waveform data, while the integrated TFT controller drives the bedside display. The V-temp range supports the warm enclosure environments of clinical settings.
Empfohlen
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2025DAK169T-V/HF's integrated HS USB for peripherals, integrated graphics for menu rendering, and CAN for connecting to terminal backbones. The 200 MHz MIPS32 core processes encryption and payment stacks without external MPU help. The 2 MB Flash holds localized UI assets and security libraries; the 169-LFBGA package keeps the BOM compact in slim terminal form factors.
Empfohlen
Home Automation Touch Panels
Smart-home wall-mount touch panels leverage the PIC32MZ2025DAK169T-V/HF's integrated TFT controller for the main LCD, the 2 MB Flash for storing room-control UI assets, and the 45 analog-input ADC for backlight and capacitive-button sensing. The HS USB port supports firmware updates, while CAN or serial interfaces connect to HVAC and lighting buses. The DDR2 controller handles smooth animation transitions.
Empfohlen
Building Automation Control Boards
The PIC32MZ2025DAK169T-V/HF's combination of CAN, HS USB, 45 analog inputs, and integrated graphics fits centralized building-automation controllers that aggregate HVAC, lighting, and security subsystems. The 640 KB SRAM supports concurrent protocol stacks (BACnet, Modbus, CAN), and the 169-LFBGA package fits standard 4-layer industrial control boards.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2025DAK169T-V/HF – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2025DAK169T-I/HF | PIC32MZ2025DAG169T-I/6J | PIC32MZ2025DAH169T-I/6J | PIC32MZ1064DAB169T-I/HF | PIC32MZ1025DAK169-I/HF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core Architecture | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 256 KB |
| Integrated Graphics Processor | Yes (2D) | Yes (2D) | Yes (2D) | Yes (2D) | No | Yes (2D) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| External Memory Interface | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB |
Wichtigste Unterscheidungsmerkmale
- V-temp grade extends operating envelope to +105C (vs. PIC32MZ2025DAK169T-I/HF)
- Same 2 MB Flash + 640 KB SRAM as the 'K' suffix baseline (vs. PIC32MZ1064DAB169T-I/HF)
- Full peripheral integration in single 169-LFBGA package (vs. PIC32MZ2025DAK169-I/HF (tray vs T&R))
Designhinweise
The 169-LFBGA (11x11 mm) requires a 4-layer or higher PCB stack-up with microvia fan-out for reliable assembly. Place all decoupling capacitors within 2 mm of their respective power pins. Follow the Microchip DDR2 design checklist for trace length matching: data lines matched within 25 mil, address/control within 100 mil. Use a ground reference plane on layer 2 directly under the BGA for signal return paths.
At 200 MHz with DDR2 active and graphics rendering, the PIC32MZ2025DAK169T-V/HF can dissipate up to 1.5 W. With a 169-LFBGA package thermal resistance (theta_JA) of approximately 25-30 C/W on a JEDEC 4-layer test board, junction temperature rise is roughly 45 C. In enclosed HMI enclosures with limited airflow, derate clock speed or add thermal vias under the center BGA balls to stay within the +105C V-temp limit.
Estimated: at 200 MHz with 1.5 W dissipation and theta_JA ~28 C/W, junction rises ~42 C above ambient. Do not assume the V-temp grade permits operation in sealed enclosures without thermal validation. Always prototype with thermocouples on the BGA top center. For BGA rework, use a BGA-specific rework station with profile matching the MSL-3 moisture sensitivity rating; otherwise the part may popcorn during reflow.
DDR2 signals are the most critical nets on the PCB. Route the DDR2 byte lanes on the top layer with a continuous ground reference plane, keep vias to a minimum, and length-match within 25 mil for DQ/DQS pairs. Enable on-die termination (ODT) and use the Microchip DDR2 initialization code templates. The DDR2 clock must be length-matched to the byte-lane strobe with controlled impedance (50 ohm single-ended).
Use a low-noise LDO for the 1.2V core rail (estimated load: 200-400 mA peak during graphics rendering); a switching regulator introduces ripple that can couple into the ADC readings and corrupt TFT pixel data. Place bulk capacitors (10 uF ceramic + 100 uF tantalum) at the BGA power-ball entry points. Sequence power rails: 3.3V I/O first, then 1.8V DDR2, then 1.2V core last to prevent latch-up.
Compliance-Informationen
RoHS and lead-free confirmed via Microchip product page. V-temp grade is -40C to +105C but this part is NOT AEC-Q100 qualified; for automotive applications requiring AEC-Q100, contact Microchip for the specific automotive part number. REACH and halogen-free status not stated in verified web data.