PIC32MZ2025DAG169T-I/6J - 32-bit 200MHz MCU, 2MB Flash | Microchip
MPN: PIC32MZ2025DAG169T-I/6J ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $17.1 | $171.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.85 | $11,850.00 |
PIC32MZ2025DAG169T-I/6J Overview
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on one die. The PIC32MZ DA family in particular extends the MCU concept toward MPU-like capability by integrating a graphics controller, a graphics processor, dual display interfaces, and a DDR2 memory controller, placing it in the hierarchy: PIC32MZ DA -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. This positioning lets engineers build graphical HMI products on a single MCU without a separate application processor.
Key features of the PIC32MZ2025DAG169T-I/6J include a 12-bit 18 MSPS ADC with up to 45 analog inputs, a high-speed USB 2.0 OTG controller, two CAN modules, an integrated graphics controller with dedicated GPU for TFT displays, support for WQVGA/QVGA LCD panels, up to 120 general-purpose I/O pins, and a 10/100 Ethernet MAC. The DDR2 controller and large on-chip memory make it a strong fit for buffer-rich GUI workloads where DDR memory is too costly or power-hungry to add externally.
The 169-LFBGA package provides 120 GPIO pins and short on-die traces for the parallel RGB display interface, minimizing EMI and timing skew on the data bus. Industrial-grade screening (-40C to +85C) plus the DDR2 PHY support lets engineers deploy the part in factory-floor HMIs, building-automation touch panels, and other noisy environments that would defeat commercial-grade MCUs.
Typical applications for this part include graphical human-machine interfaces (HMI) on industrial equipment, point-of-sale terminals, automotive infotainment prototypes, medical patient monitors, and smart-home control panels. Designers pick this specific 169-ball LFBGA -I/6J variant when the display bus must be routed on a compact PCB and when industrial temperature screening is required.
When designing with this part, plan PCB fan-out for the 11x11 mm BGA carefully: route the DDR2 byte groups with matched-length traces and provide a 4-layer stack-up with continuous ground on layer 2 below the DDR signals. Also reserve boot-mode and JTAG pins correctly to enter the ICD3/ICD4 programming mode on first power-up.
This page synthesizes distributor pricing, drop-in PIC32MZ DA alternatives from the same family, and practical PCB layout guidance not found in the manufacturer datasheet alone, helping engineers compare footprint-compatible options before committing to a BGA layout.
Drop-in alternatives for PIC32MZ2025DAG169T-I/6J — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ2025DAG169T-I/6J (same form factor and footprint) — differing in Graphics Controller, Operating Temperature, CAN, USB, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1064DAG169T-I/2J
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1025DAR169T-I/6J
✅ Drop-In✓ In Stock
$11.88 / Unit
View Datasheet →PIC32MZ2025DAB169T-I/HF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$12.62 / Unit
View Datasheet →PIC32MZ2025DAA169-I/HF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$12.8 / Unit
View Datasheet →PIC32MZ1064DAB169T-I/HF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.52 / Unit
View Datasheet →PIC32MZ1064DAB169-I/HF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$12.4 / Unit
View Datasheet →PIC32MZ2025DAG169T-I/6J Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DA) |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data Memory (SRAM) | 640 KB (per family datasheet) |
| External Memory Support | 32 MB or 128 MB addressable DDR2 DRAM |
| Supply Voltage (VDD) | 1.7 V to 3.6 V |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated with dedicated 2D GPU |
| USB | Hi-Speed USB 2.0 OTG |
| CAN | 2x CAN modules |
| Ethernet | 10/100 MAC |
| I/O Pins | Up to 120 |
| Package | 169-ball LFBGA (11x11 mm) |
| Operating Temperature | -40C to +85C (industrial, -I suffix) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MZ2025DAG169T-I/6J 169-ball lfbga (11x11 mm) Pin Configuration Guide
Pin configuration for PIC32MZ2025DAG169T-I/6J (169-ball lfbga (11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ2025DAG169T-I/6J.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ2025DAG169T-I/6J is suitable for 6 applications: Industrial HMI Touch Panel, Point-of-Sale Terminal, Building Automation Control Display, Medical Patient Monitor (Prototype), Smart Home Control Panel, Automotive Infotainment Prototype.
Industrial HMI Touch Panel
The PIC32MZ2025DAG169T-I/6J is purpose-built for industrial graphical HMI panels at 3.5 to 5.0 inch WQVGA resolution. Its integrated graphics controller and dedicated 2D GPU offload frame-buffer compositing, freeing the MIPS32 microAptiv core for application logic. The 12-bit 18 MSPS ADC with up to 45 inputs supports multi-channel sensor reading (temperature, pressure, flow) alongside touch sensing. The 169-ball LFBGA lets the parallel RGB display bus be routed with matched-length traces on a compact 4-layer PCB. Industrial -40C to +85C screening plus the DDR2 controller delivering up to 128 MB of frame-buffer memory make this part ideal for factory-floor HMIs where commercial-grade MCUs would fail.
Recommended
Point-of-Sale Terminal
POS terminals need a 32-bit MCU with strong graphics, USB device connectivity, and secure Flash for payment workflows. The PIC32MZ2025DAG169T-I/6J delivers the Hi-Speed USB 2.0 OTG controller for barcode scanners and printers, the integrated graphics engine for the operator-facing display, and 2 MB Flash to host an embedded Linux-like RTOS plus payment application stack. The DDR2 controller (up to 128 MB) supports smooth UI transitions and encrypted receipt image buffering. The 169-ball LFBGA package fits inside the compact enclosures common to retail POS hardware. The MCU's 2x CAN modules are also valuable for future peripheral integration (cash drawer sensors, scales).
Recommended
Building Automation Control Display
Building automation controllers integrate HVAC schedules, lighting scenes, and security status into a wall-mounted touch display. The PIC32MZ2025DAG169T-I/6J serves as both the HMI renderer and the protocol hub: the 2x CAN modules handle BACnet or CAN-based HVAC peripherals, the 10/100 Ethernet MAC connects to the building backbone, and the integrated graphics engine renders schedules and floor plans on a 4.3 to 7.0 inch LCD. The 12-bit ADC with up to 45 channels accepts analog sensors (temperature, humidity, light, occupancy) without a separate ADC. The 640 KB SRAM supports OTA firmware staging buffers, and the DDR2 interface allows large icon and font libraries to be cached for fast UI refresh.
Recommended
Medical Patient Monitor (Prototype)
For pre-production medical patient monitor prototypes, the PIC32MZ2025DAG169T-I/6J offers the graphics performance to render multi-trace waveforms and numerical vital-sign readouts on a 5-inch or 7-inch TFT. The 12-bit 18 MSPS ADC handles ECG and pulse-oximetry front-end sampling with adequate dynamic range, while the MIPS32 microAptiv core at 200 MHz runs the vital-sign DSP algorithms. The Hi-Speed USB device port streams data to a host PC for development. Engineers targeting clinical production should review IEC 60601-1 compliance separately - the part itself is industrial-grade, not medical-grade. The 169-ball LFBGA package keeps the BOM small enough for handheld bedside prototypes.
Recommended
Smart Home Control Panel
Wall-mounted smart-home hubs need a graphical MCU that can drive a touch panel, aggregate multiple radios, and present a responsive scene-control dashboard. The PIC32MZ2025DAG169T-I/6J integrates the graphics controller and 2D GPU needed for smooth tile-based UI transitions, plus the USB 2.0, Ethernet, and CAN peripherals to bridge to Zigbee/Wi-Fi gateways. The 2 MB Flash hosts the entire scene-control and energy-management firmware, and the 640 KB SRAM keeps the UI latency low. The 169-ball LFBGA is well-suited to thin-wall-mount enclosures. The industrial temperature grade prevents touch-panel glitches in unheated hallways or sun-exposed facades.
Recommended
Automotive Infotainment Prototype
Pre-production automotive infotainment HMIs can use the PIC32MZ2025DAG169T-I/6J as a prototype-grade graphics engine for the driver's cluster and HVAC/radio display. The integrated graphics controller with 2D GPU handles the icons, gauges, and menu transitions, while the 2x CAN modules connect to the vehicle CAN bus. The HS USB OTG port supports media playback and smartphone mirroring. Note: this part is industrial-grade (-40C to +85C), not AEC-Q100 automotive-qualified, so it is not appropriate for production automotive deployment - use only for prototyping, lab cars, or pre-compliance engineering builds. The 169-ball LFBGA fits the compact form factor of a modern radio head unit.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ2025DAG169T-I/6J — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1064DAG169T-I/2J | PIC32MZ1025DAR169T-I/6J | PIC32MZ2025DAB169T-I/HF | PIC32MZ2025DAA169-I/HF | PIC32MZ1064DAB169T-I/HF |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA - same | 169-LFBGA - same | 169-ball LFBGA (HF) - same family | 169-ball LFBGA (HF) - same family | 169-ball LFBGA (HF) - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Core | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Flash | 2 MB | Larger 1064 tier memory | 1 MB (1025 tier) | 2 MB | 2 MB | Larger 1064 tier memory |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Supply Voltage | 1.7 V to 3.6 V | 1.7 V to 3.6 V | 1.7 V to 3.6 V | 1.7 V to 3.6 V | 1.7 V to 3.6 V | 1.7 V to 3.6 V |
| USB | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Full-Speed USB (reduced) | Hi-Speed USB 2.0 OTG |
| Drop-in Tier | Reference (2025, G-suffix) | Higher memory, same footprint | Lower memory, same footprint | Same memory, packaging variant | Same memory, reduced peripherals | Higher memory, packaging variant |
Key Differentiators
- Same-family drop-in upgrade path with larger memory on the identical 169-LFBGA footprint (vs PIC32MZ1064DAG169T-I/2J)
- Integrated 2D GPU + graphics controller on a 32-bit MCU (vs PIC32MX795F512LT-80I/PT)
- Industrial temperature screening on a graphics MCU (vs Generic commercial-grade 169-LFBGA MCUs)
Design Notes
The 169-ball LFBGA at 11x11 mm has a 0.8 mm ball pitch. Use a 4-layer PCB stack-up with a continuous ground plane on layer 2 directly below the BGA to control impedance on the DDR2 byte groups and the parallel RGB display bus. Estimated: matched-length traces within 50 mil tolerance on the DDR2 byte lanes typically yield timing closure at 200 MHz DDR2 without additional series resistors; verify with the Microchip DDR2 PHY appnote for your specific DDR2 device.
Estimate: the PIC32MZ DA family running at 200 MHz with DDR2 active draws approximately 200 to 300 mA core current plus DDR2 termination current. Use a switching regulator (e.g. a TPS54360 or equivalent) for the 1.8 V DDR2 rail and a dedicated LDO for the 1.2 V core rail. Provide at least 10 uF + 100 nF decoupling at every VDD ball pair of the BGA, placed as close as the routing allows.
Do not forget to strap the boot-mode pins correctly on first power-up: TMS, TCK, TDI, TDO must be pulled to the right levels to enter the ICD3/ICD4 programming mode. Also, leaving unused GPIO floating can inject noise into the ADC readings - either configure as outputs low or enable the internal pull-downs. Finally, the DDR2 controller requires a specific PHY calibration sequence on boot; do not skip it or you will see intermittent bit errors under temperature cycling.
Estimate: at 200 MHz with DDR2 active, the die dissipation of the PIC32MZ2025DAG169T-I/6J can exceed 1 W, which is significant for an 11x11 mm BGA. Place thermal via arrays directly under the BGA thermal balls and stitch ground vias around the escape channels. The LFBGA thermal pad must be soldered to the PCB thermal copper pour for spec-compliant theta_JA performance.
Compliance Information
Industrial temperature grade -40C to +85C per -I suffix. Not AEC-Q100 qualified; this part is not intended for automotive production deployment. RoHS and REACH compliance declared on Microchip product page.
