PIC32MZ2025DAK169-I/HF - 200MHz 32-bit MCU, 2MB Flash, 169-LFBGA | Microchip
Teilenummer: PIC32MZ2025DAK169-I/HF ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.85 | $685,00 |
| 500 | $6.21 | $3.105,00 |
| 1.000 | $5.86 | $5.860,00 |
PIC32MZ2025DAK169-I/HF Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and programmable peripherals into one package. The PIC32MZ DAK family sits in the high-end graphics tier of Microchip's 32-bit portfolio, positioned between general-purpose MCUs and microprocessors (MPUs). It is purpose-built for embedded HMI designs that need rich graphics without the complexity of running a full Linux stack on an MPU.
Key features of the PIC32MZ2025DAK169-I/HF include: 32 KB instruction cache and 32 KB data cache for predictable real-time performance, a 200 MHz core with 330 DMIPS throughput, a TFT LCD controller with dedicated DMA for low-CPU-overhead display refresh, and a 32-bit external DDR2 memory interface for large frame buffers. The integrated graphics processor accelerates primitives, alpha blending, color conversion, and image scaling, offloading tasks that would otherwise consume significant MIPS.
Architecturally, the part uses the MIPS32 microAptiv core with DSP and microMIPS support, giving designers an instruction-efficient RISC pipeline. The combination of hardware graphics acceleration, large on-chip memory, and high-speed connectivity (HS USB, Ethernet, CAN) makes it a strong fit for self-contained industrial and consumer HMIs.
Typical applications include industrial control HMI panels, home appliance graphical interfaces, automotive instrument clusters, medical device UIs, and IoT gateways with local displays. It is also suitable for building automation touch panels and point-of-sale terminals.
When designing with this MCU, pay careful attention to PCB layout for the 169-ball BGA - via-in-pad is typically required and DDR2 routing must follow matched-length rules. Power sequencing for the 1.8V core rail and DDR2 termination must follow the datasheet guidelines to avoid POR issues. Programming is supported by MPLAB X IDE with the Harmony v3 framework.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers and procurement teams with a single source for engineering decisions on the PIC32MZ2025DAK169-I/HF.
Drop-in-Alternativen für PIC32MZ2025DAK169-I/HF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ2025DAK169-I/HF (gleiche Bauform und Footprint) – abweichend in USB, Graphics Controller, CAN, Core Architecture, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ2025DAK169T-I/HF
✅ Drop-In✓ Auf Lager
$10.65 / Stück
Datenblatt ansehen →PIC32MZ2025DAK169-V/HF
✅ Drop-In✓ Auf Lager
$7.94 / Stück
Datenblatt ansehen →PIC32MZ1025DAK169-I/HF
✅ Drop-In✓ Auf Lager
$10.95 / Stück
Datenblatt ansehen →PIC32MZ2025DAB169T-I/HF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12.62 / Stück
Datenblatt ansehen →PIC32MZ2025DAA169-I/HF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12.8 / Stück
Datenblatt ansehen →PIC32MZ1064DAB169-I/HF
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12.4 / Stück
Datenblatt ansehen →PIC32MZ2025DAK169-I/HF Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 microAptiv with microMIPS and DSP extensions |
| Core Frequency | 200 MHz |
| DMIPS | 330 DMIPS |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| Operating Voltage | 1.8V nominal (core) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated TFT LCD controller + graphics processor |
| External Memory Interface | DDR2 controller, 32-bit, up to 128 MB addressable |
| USB | Hi-Speed USB 2.0 (host/device/OTG) |
| Ethernet | 10/100 Mbps MAC |
| CAN | CAN 2.0B controller |
| Gehäuse | 169-LFBGA (11x11 mm) |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +85C (Industrial) |
| RoHS-Status | Compliant |
| Programming | MPLAB X IDE, MPLAB Harmony v3 |
PIC32MZ2025DAK169-I/HF 169-lfbga (11x11 mm) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ2025DAK169-I/HF (169-lfbga (11x11 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ2025DAK169-I/HF.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ2025DAK169-I/HF ist geeignet für 6 Anwendungs: Industrial HMI Control Panel, Home Appliance Graphical Interface, Automotive Instrument Cluster Display, Medical Device User Interface, Building Automation Touch Panel, Point-of-Sale Terminal Display.
Industrial HMI Control Panel
The PIC32MZ2025DAK169-I/HF is ideal for industrial HMI control panels because its integrated TFT LCD controller and dedicated graphics processor offload rendering of buttons, gauges, and trend graphs from the CPU, leaving the 200 MHz MIPS core available for Modbus/TCP, EtherNet/IP, and real-time control loops. With 2 MB Flash and 640 KB SRAM, the device stores multilingual UI assets, custom fonts, and bitmaps without external memory, while the 32-bit DDR2 controller (up to 128 MB addressable) enables smooth full-screen animations at 24-bit color depth. The 12-bit 18 MSPS ADC handles analog sensor inputs from temperature, pressure, and flow transducers. Designers typically pair this MCU with a 4.3- to 7-inch WVGA TFT display.
Empfohlen
Home Appliance Graphical Interface
For high-end home appliances such as smart ovens, washing machines, and induction cooktops, the PIC32MZ2025DAK169-I/HF delivers the graphics performance required for animated cooking profiles, recipe animations, and capacitive-touch knob indicators. The hardware graphics processor accelerates alpha-blended icons and color conversion, enabling smooth 60 fps UI updates without burdening the main CPU. The HS USB 2.0 interface supports firmware updates from a USB stick, while Ethernet enables IoT cloud connectivity. Its industrial temperature rating (-40C to +85C) handles the thermal environment of appliance enclosures, and 2 MB Flash stores complex multilingual firmware.
Empfohlen
Automotive Instrument Cluster Display
The PIC32MZ2025DAK169-I/HF is suited for two-wheeler, agricultural, and recreational vehicle instrument clusters where its integrated graphics controller drives a TFT panel showing speedometer, tachometer, fuel level, and warning indicators with smooth needle animations. The dedicated graphics processor accelerates primitive rendering and alpha blending, freeing the 200 MHz core for CAN bus message handling, sensor fusion, and indicator logic. The 12-bit 18 MSPS ADC samples up to 45 analog inputs simultaneously, supporting multiple analog sensors. DDR2 memory (up to 128 MB externally addressable) enables cinematic startup animations and detailed map backgrounds. Designers should consider the -V/HF variant for harsher automotive thermal profiles.
Empfohlen
Medical Device User Interface
Medical devices such as infusion pumps, patient monitors, and diagnostic analyzers benefit from the PIC32MZ2025DAK169-I/HF's deterministic 200 MHz MIPS core and integrated graphics for clear, real-time waveform and numeric displays. The hardware graphics processor accelerates trend graphs and alarm indicators without CPU overhead, critical for medical-grade latency requirements. With 2 MB Flash, firmware can store calibration tables, patient profiles, and multi-language UI strings on-chip. The 12-bit 18 MSPS ADC digitizes sensor signals with adequate resolution for vital-sign monitoring. Ethernet and HS USB enable integration with hospital information systems and bedside connectivity modules.
Empfohlen
Building Automation Touch Panel
For building automation touch panels controlling lighting, HVAC, and access, the PIC32MZ2025DAK169-I/HF provides the processing headroom for smooth capacitive-touch response and animated floor-plan graphics. The 640 KB on-chip SRAM accommodates touch-coordinate buffers and rendering layers, while the 2 MB Flash stores zone configuration, custom icons, and protocol stacks for BACnet, Modbus, or KNX gateways. The Ethernet MAC and HS USB support commissioning via PC and over-the-air updates. Designers can pair the MCU with a 5-inch or 7-inch 800x480 TFT display for room-control stations.
Empfohlen
Point-of-Sale Terminal Display
POS terminals use the PIC32MZ2025DAK169-I/HF to drive the customer-facing or operator-facing TFT display with transaction amounts, QR codes, and promotional animations. The hardware graphics processor accelerates QR code rendering and animated transition effects that differentiate modern POS designs. The integrated Ethernet MAC supports IP-based payment terminals and cloud sync, while HS USB connects to receipt printers and barcode scanners. The 2 MB Flash stores the firmware, fonts, and graphics assets, and the 12-bit ADC reads battery voltage or thermal sensors. Designers benefit from a single-chip solution that replaces separate MCU + external graphics controller designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ2025DAK169-I/HF – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ2025DAK169T-I/HF | PIC32MZ2025DAK169-V/HF | PIC32MZ1025DAK169-I/HF | PIC32MZ2025DAB169T-I/HF | PIC32MZ2025DAA169-I/HF | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 2 MB | 2 MB | 2 MB |
| Graphics Processor | Yes (integrated) | Yes | Yes | Yes | Yes | Yes | Yes |
| DDR2 Controller | Yes (up to 128 MB) | Yes | Yes | Yes | Yes | Yes | Yes |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Extended per Microchip ordering code | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
Wichtigste Unterscheidungsmerkmale
- Integrated hardware graphics processor offloads rendering from CPU (vs. PIC32MX795F512LT-80I/PT)
- DDR2 memory controller supports up to 128 MB external frame buffer (vs. PIC32MZ1025DAK169-I/HF)
- Same-family pin-compatible tape-and-reel variant available (vs. PIC32MZ2025DAK169T-I/HF)
Designhinweise
The 169-LFBGA package requires via-in-pad (VIP) PCB construction for reliable assembly and electrical performance, especially for the high-speed DDR2 interface. Per Microchip layout guidelines, follow the land pattern and via diameter recommendations in the package drawing; do not substitute dog-bone fan-outs unless the DDR2 timing budget permits. Matched-length routing of DDR2 signals is critical - keep length matching within 25 mils for clock, DQS, and DQ groups to avoid setup/hold violations at 200 MHz.
Power sequencing of the 1.8V core rail relative to the DDR2 termination voltage must follow the datasheet guidelines to avoid power-on-reset (POR) issues or latch-up. Use a dedicated LDO or DC-DC regulator for the MCU core, and decouple with 100 nF ceramic capacitors as close as possible to each power pin pair. Bulk decoupling of 10 uF ceramic + 22 uF tantalum is recommended at the regulator output.
Keep the TFT LCD data and sync traces short and routed over a continuous ground plane to minimize EMI and crosstalk. The 12-bit ADC analog inputs are sensitive to digital switching noise - separate analog and digital ground planes and join them at a single point near the MCU GND pin. The USB D+/D- traces require 90 ohm differential impedance; route them first and avoid vias on these signals.
Although the LFBGA package has reasonable thermal dissipation through its ground balls, sustained operation at 200 MHz with DDR2 + graphics acceleration can produce noticeable junction temperature rise. Provide an unbroken ground copper pour beneath the BGA, and consider thermal vias under the central ball grid to conduct heat to an internal ground plane or backside copper layer. The industrial -40C to +85C rating covers typical appliance and industrial environments.
Do not assume all 169-LFBGA variants of the PIC32MZ DA family share identical ball-out - the DAK, DAL, DAR, DAS suffixes denote different peripheral mixes and ball assignments even at the same pin count. Always cross-check the specific datasheet pin table for the exact ordering code. Also, the DDR2 controller requires careful ZQ calibration resistor selection (typically 240 ohm to ground) and proper termination voltage (VTT = VDDQ/2) - incorrect values cause intermittent memory errors under load.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40C to +85C). AEC-Q100 not applicable for this industrial-grade part - Microchip offers automotive-qualified variants in other families.