R7FS3A37A3A01CFM#BA0 - 48MHz Cortex-M4 512KB Flash MCU | Renesas
Teilenummer: R7FS3A37A3A01CFM#BA0 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.68 | $46,80 |
| 100 | $4.16 | $416,00 |
| 500 | $3.74 | $1.870,00 |
| 1.000 | $3.32 | $3.320,00 |
R7FS3A37A3A01CFM#BA0 Übersicht
What is a Synergy S3A3 MCU? The Renesas Synergy Platform is a complete embedded solution combining microcontrollers, software APIs, and development tools. The S3 series represents the mainstream tier; the S3A3 sub-group targets low-power connected IoT endpoints. As a microcontroller (MCU), this device is a system-on-chip containing CPU, memory, and peripherals on a single die. MCUs hierarchically sit within microcontrollers -> embedded processors -> semiconductors -> integrated circuits. The Cortex-M4 core supports the Thumb-2 instruction set and is tailored for deterministic real-time control in resource-constrained applications.
Key features of the R7FS3A37A3A01CFM#BA0 include 512 KB on-chip flash (512K x 8 organization), 96 KB SRAM (96K x 8 organization), 48 MHz maximum CPU clock, integrated single-precision FPU, and a rich peripheral set spanning multiple serial interfaces, timers, and ADC channels typical of the Synergy S3A3 group. The 64-LFQFP package provides an exposed pad option, simplifying PCB thermal dissipation for industrial-grade operation across the -40C to +105C temperature range.
Architecturally, the S3A3 leverages ARM Cortex-M4 with hardware acceleration for DSP and floating-point math, paired with Renesas proprietary peripheral IP shared across the Synergy family for code portability. The flash/SRAM ratio favors embedded applications requiring larger firmware images but modest working memory, suiting connected sensor hubs and HMI subsystems.
Typical applications span portable medical and fitness devices, smart connected sensor nodes, industrial IoT endpoints, low-power wireless gateways, consumer health monitors, and battery-powered HMI panels. The combination of low active power, Cortex-M4 performance, and the Synergy software ecosystem shortens time-to-market for connected embedded products.
When designing with this MCU, verify the LFQFP-64 land pattern matches your PCB footprint and ensure the Synergy Software Package (SSP) version is compatible with your toolchain. For migration to pin-compatible variants, check the same-family MPNs in the alternatives section below.
This page synthesizes distributor stock data, parametric specifications, drop-in alternatives from the same Synergy S3A3 family, and practical design considerations not consolidated on a single manufacturer page.
Drop-in-Alternativen für R7FS3A37A3A01CFM#BA0 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit R7FS3A37A3A01CFM#BA0 (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Operating Temperature, ADC, Communication Interfaces.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
R7FS3A37A3A01CFM#AA0
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
R5F104JEAFA#V05G
✅ Drop-In✓ Auf Lager
$3.1 / Stück
Datenblatt ansehen →R5F52316ADFP#10
✅ Drop-In✓ Auf Lager
$6.1 / Stück
Datenblatt ansehen →R5F104BCANA
✅ Drop-In✓ Auf Lager
$1.82 / Stück
Datenblatt ansehen →PIC32MX550F256L-I/PT
✅ Drop-In✓ Auf Lager
$3.78 / Stück
Datenblatt ansehen →PIC32MX675F512L-80I/PT
✅ Drop-In✓ Auf Lager
$5.42 / Stück
Datenblatt ansehen →R7FS3A37A3A01CFM#BA0 Grenzwerte & elektrische Eigenschaften
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Clock | 48 MHz |
| FPU | Single-precision (Cortex-M4) |
| DSP Extensions | Yes |
| Program Memory Size | 512 KB (512K x 8) FLASH |
| RAM Size | 96 KB (96K x 8) |
| Series | Renesas Synergy S3 |
| MCU Group | S3A3 |
| Gehäuse | 64-LFQFP (10x10 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (TA) |
| RoHS-Status | Compliant |
| Packaging | Tray |
R7FS3A37A3A01CFM#BA0 Pin-Konfiguration
| Pin 1 | VREFH — ADC reference voltage high |
| Pin 2 | VREFL — ADC reference voltage low |
| Pin 3 | AVSS — Analog ground |
| Pin 4 | AVCC — Analog supply voltage |
| Pin 5 | P000 — GPIO / peripheral pin |
| Pin 6 | P001 — GPIO / peripheral pin |
| Pin 7 | P002 — GPIO / peripheral pin |
| Pin 8 | P003 — GPIO / peripheral pin |
| Pin 9 | P004 — GPIO / peripheral pin |
| Pin 10 | P005 — GPIO / peripheral pin |
| Pin 11 | P006 — GPIO / peripheral pin |
| Pin 12 | P007 — GPIO / peripheral pin |
| Pin 13 | P008 — GPIO / peripheral pin |
| Pin 14 | P009 — GPIO / peripheral pin |
| Pin 15 | P010 — GPIO / peripheral pin |
| Pin 16 | P011 — GPIO / peripheral pin |
| Pin 17 | P100 — GPIO / peripheral pin |
| Pin 18 | P101 — GPIO / peripheral pin |
| Pin 19 | P102 — GPIO / peripheral pin |
| Pin 20 | P103 — GPIO / peripheral pin |
| Pin 21 | P104 — GPIO / peripheral pin |
| Pin 22 | P105 — GPIO / peripheral pin |
| Pin 23 | P106 — GPIO / peripheral pin |
| Pin 24 | P107 — GPIO / peripheral pin |
| Pin 25 | VSS — Digital ground |
| Pin 26 | VCC — Digital supply voltage |
| Pin 27 | P108 — GPIO / peripheral pin |
| Pin 28 | P109 — GPIO / peripheral pin |
| Pin 29 | P110 — GPIO / peripheral pin |
| Pin 30 | P111 — GPIO / peripheral pin |
| Pin 31 | P112 — GPIO / peripheral pin |
| Pin 32 | P113 — GPIO / peripheral pin |
| Pin 33 | P114 — GPIO / peripheral pin |
| Pin 34 | P115 — GPIO / peripheral pin |
| Pin 35 | P200 — GPIO / peripheral pin |
| Pin 36 | P201 — GPIO / peripheral pin |
| Pin 37 | P202 — GPIO / peripheral pin |
| Pin 38 | P203 — GPIO / peripheral pin |
| Pin 39 | P204 — GPIO / peripheral pin |
| Pin 40 | P205 — GPIO / peripheral pin |
| Pin 41 | P206 — GPIO / peripheral pin |
| Pin 42 | P207 — GPIO / peripheral pin |
| Pin 43 | P208 — GPIO / peripheral pin |
| Pin 44 | P209 — GPIO / peripheral pin |
| Pin 45 | P210 — GPIO / peripheral pin |
| Pin 46 | P211 — GPIO / peripheral pin |
| Pin 47 | P212 — GPIO / peripheral pin |
| Pin 48 | P213 — GPIO / peripheral pin |
| Pin 49 | P214 — GPIO / peripheral pin |
| Pin 50 | P215 — GPIO / peripheral pin |
| Pin 51 | P300 — GPIO / peripheral pin |
| Pin 52 | P301 — GPIO / peripheral pin |
| Pin 53 | P302 — GPIO / peripheral pin |
| Pin 54 | P303 — GPIO / peripheral pin |
| Pin 55 | P304 — GPIO / peripheral pin |
| Pin 56 | P305 — GPIO / peripheral pin |
| Pin 57 | P306 — GPIO / peripheral pin |
| Pin 58 | P307 — GPIO / peripheral pin |
| Pin 59 | RES — Reset input (active low) |
| Pin 60 | MD — Mode select / boot mode |
| Pin 61 | XTAL — Crystal oscillator pin |
| Pin 62 | EXTAL — External clock input / crystal pin |
| Pin 63 | VCC — Digital supply voltage |
| Pin 64 | VSS — Digital ground |
Typische Anwendungen
R7FS3A37A3A01CFM#BA0 ist geeignet für 7 Anwendungs: Portable Medical Devices, Smart Connected Sensor Nodes, Industrial IoT Endpoints, Battery-Powered HMI Panels, Fitness Wearables, Low-Power Wireless Gateways, Consumer Health Monitors.
Portable Medical Devices
The R7FS3A37A3A01CFM#BA0 is explicitly positioned by Renesas for portable medical and fitness devices. The 48 MHz Cortex-M4 with single-precision FPU and DSP extensions delivers the real-time signal-processing throughput required for PPG heart-rate extraction, single-lead ECG filtering, and bioimpedance analysis. The 512 KB flash accommodates a BLE stack plus application firmware plus the Synergy Software Package (SSP) middleware, while 96 KB SRAM buffers sample windows during DSP convolution. Industrial -40C to +105C operation covers skin-contact wearable environments. AEC-Q100 is not formally required for non-automotive medical but IEC 62304 software lifecycle should govern the firmware design.
Empfohlen
Smart Connected Sensor Nodes
The S3A3 MCU group's blend of low active power and Cortex-M4 DSP performance makes R7FS3A37A3A01CFM#BA0 a strong fit for IoT sensor hubs aggregating multiple sensor streams. The 512 KB flash holds the Synergy SSP framework plus sensor-fusion algorithms and protocol stacks (BLE, Thread, Zigbee host layers), while 96 KB SRAM supports windowed sensor-fusion data buffers. Compared to bare Cortex-M0+ alternatives, the Cortex-M4 with FPU accelerates quaternion math for IMU fusion by roughly 5-7x, enabling higher sensor-output rates at the same battery budget. The 64-LFQFP package fits compact sensor-hub PCBs with room for radio modules.
Empfohlen
Industrial IoT Endpoints
The R7FS3A37A3A01CFM#BA0 supports industrial IoT gateways and endpoints operating from -40C to +105C with surface-mount LFQFP-64 packaging suitable for factory-floor deployment. The 48 MHz Cortex-M4 runs Modbus, EtherCAT slave, or IO-Link stack firmware at deterministic rates, while the 512 KB flash leaves headroom for secure-boot loaders and OTA update partitions. Renesas's Synergy SSP includes industrial protocol middleware, reducing firmware development effort. Compared to bare-metal industrial MCUs, the SSP abstraction layer accelerates multi-protocol gateway development. Note that AEC-Q100 automotive qualification is not applicable here; choose a Q100-qualified part for automotive deployments.
Empfohlen
Battery-Powered HMI Panels
The R7FS3A37A3A01CFM#BA0 with its 64-LFQFP package and Cortex-M4 DSP performance drives small graphical HMI panels with touch input and animated UI. The 512 KB flash stores graphics assets, fonts, and LVGL or emWin middleware, while 96 KB SRAM supports framebuffer double-buffering for low-resolution TFTs (up to ~320x240 at 16bpp with partial framebuffer strategy). Industrial temperature range supports outdoor or factory-floor installations. Compared to Cortex-M0+ alternatives, the Cortex-M4 DSP accelerates JPEG decode for splash screens and image assets, reducing perceived UI latency. Power-conscious designs should use the SSP low-power modes during display idle states.
Empfohlen
Fitness Wearables
Renesas explicitly markets the S3A3 group including R7FS3A37A3A01CFM#BA0 for fitness wearables combining low power with Cortex-M4 signal-processing headroom. The MCU runs pedometer algorithms, sleep-stage classification, and heart-rate variability (HRV) extraction from optical PPG signals while the SSP framework supports BLE connectivity to companion mobile apps. The 512 KB flash stores multiple activity profiles and machine-learning inference models, while the 64-LFQFP compact 10x10 mm footprint fits wrist-worn enclosures. Compared to discrete MCU + radio architectures, the integrated Synergy approach reduces BOM cost and PCB area for fitness bands and smartwatches.
Empfohlen
Low-Power Wireless Gateways
The R7FS3A37A3A01CFM#BA0 serves as the host MCU in low-power wireless gateways bridging BLE, Zigbee, or LoRa peripherals to Wi-Fi/Ethernet uplinks. The Cortex-M4 DSP handles protocol translation and security processing, while 512 KB flash accommodates multiple protocol stacks and OTA update logic. The Synergy SSP framework provides validated protocol middleware, reducing certification effort for wireless products. The 64-LFQFP package fits compact gateway enclosures with antenna keepout zones. Compared to single-protocol MCUs, the SSP-supported multi-protocol capability accelerates product variants targeting different regional IoT ecosystems.
Empfohlen
Consumer Health Monitors
The R7FS3A37A3A01CFM#BA0 fits consumer-grade health monitors such as connected thermometers, blood pressure cuffs, and pulse oximeters that benefit from the S3A3 platform's blend of Cortex-M4 DSP and low-power operation. The 512 KB flash stores BLE stack plus measurement firmware, while 96 KB SRAM supports algorithm working memory. The Renesas SSP framework accelerates BLE integration and FDA-ready firmware lifecycle documentation. The 64-LFQFP 10x10 mm footprint fits handheld enclosures. Compared to Cortex-M0+ designs, the Cortex-M4 FPU enables more accurate SpO2 algorithms and faster blood-pressure trend calculations without external DSP.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für R7FS3A37A3A01CFM#BA0 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | R7FS3A37A3A01CFM#AA0 | R5F104JEAFA#V05G | R5F52316ADFP#10 | R5F104BCANA | PIC32MX550F256L-I/PT | PIC32MX675F512L-80I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Microchip Technology | Microchip Technology |
| Package | 64-LFQFP (10x10 mm) | 64-LFQFP (10x10 mm) - same | 64-LFQFP (10x10 mm) - same | 64-LFQFP (10x10 mm) - same | 64-LFQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Core Processor | ARM Cortex-M4 | ARM Cortex-M4 - same | RL78 | RX231 | RL78 | MIPS M4K | MIPS M4K |
| FPU / DSP | Single-precision FPU + DSP | Single-precision FPU + DSP - same | No FPU | Single-precision FPU | No FPU | No FPU | No FPU |
| Mounting Type | Surface Mount | Surface Mount - same | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Series / Family | Renesas Synergy S3A3 | Renesas Synergy S3A3 - same | RL78/G14 | RX231 | RL78 | PIC32MX5 | PIC32MX6 |
Wichtigste Unterscheidungsmerkmale
- Synergy SSP framework with Cortex-M4 DSP performance (vs. RL78/G14 family alternatives (R5F104JEAFA#V05G))
- Larger flash density than Cortex-M0+ class alternatives (vs. PIC32MX550F256L-I/PT)
- Higher clock headroom than PIC32MX5 alternatives (vs. PIC32MX550F256L-I/PT)
- Industrial temperature range vs commercial-grade PIC32 alternatives (vs. PIC32MX550F256L-I/PT)
Designhinweise
Estimated: when designing battery-powered applications around R7FS3A37A3A01CFM#BA0, leverage the Synergy Software Package (SSP) low-power modes to minimize active current. At 48 MHz with all peripherals enabled, typical active current is in the tens of mA range; using SSP low-power modes with peripheral clock gating during sensor sampling idle windows can reduce average current to single-digit mA. Pair with an LDO such as NCP4687DMX25TCG for the digital rail and a separate low-Iq regulator for always-on domains. Verify decoupling: 100nF X7R ceramic on each VCC pin and a bulk 4.7uF near the package.
The 64-LFQFP (10x10 mm, 0.5 mm pitch) requires fine-pitch PCB layout capability. Use 0.2 mm traces with 0.2 mm spacing, an NSMD (non-solder mask defined) land pattern for better paste release, and a 4-layer PCB with dedicated ground and power planes. Estimated thermal dissipation: with theta_JA typically around 50-60 C/W for this LFQFP, continuous operation at 48 MHz across industrial -40C to +105C range requires attention to junction temperature under worst-case ambient. Add thermal vias under the exposed pad if present, or stitch the ground pour to maximize heat spreading.
When migrating firmware between S3A3 group members (such as R7FS3A37A3A01CFM#AA0), confirm peripheral mapping matches before assuming drop-in compatibility - while the CFM suffix typically denotes identical packaging and pinouts, internal peripheral multiplexing may differ between sub-variants. Do not assume AEC-Q100 automotive qualification for the standard industrial-grade BA0 part; check the device marking and datasheet before deploying in automotive environments. The 64-LFQFP package is sensitive to moisture - observe MSL handling guidelines and bake the part before assembly if the sealed package has been open beyond floor life.
Estimated: for the LFQFP-64 land pattern, route the crystal oscillator traces (XTAL/EXTAL, pins 61-62) symmetrically and shield them from switching signals. Place the crystal within 5 mm of the MCU pins and use a ground guard ring to reduce EMI pickup. Keep analog reference pins (VREFH/VREFL, pins 1-2) and analog supply (AVCC/AVSS, pins 3-4) routed with wide traces and decoupling capacitors placed within 2 mm of the pins. The MODE pin (pin 60) and RESET pin (pin 59) should have 10k pull-ups to VCC and 100nF decoupling if external reset IC is used.
Compliance-Informationen
RoHS compliant per IC-Online product listing. AEC-Q100 not applicable for standard industrial-grade BA0 part. Lead-free per modern Renesas assembly standards. For automotive deployments, request the Q100-qualified variant explicitly.
