RTAX250S-LG624B - Rad-Tolerant FPGA 250K Gates | Microchip
Teilenummer: RTAX250S-LG624B ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3200 | $3.200,00 |
| 10 | $2950 | $29.500,00 |
| 100 | $2700 | $270.000,00 |
| 500 | $2500 | $1.250.000,00 |
| 1.000 | $2350 | $2.350.000,00 |
RTAX250S-LG624B Übersicht
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of spaceflight, including total ionizing dose (TID) effects and single-event effects (SEE), where commercial FPGAs would experience configuration upsets or permanent damage. The RTAX-S family occupies the rad-tolerant tier of the space-grade programmable logic hierarchy, below full radiation-hardened parts, and is a direct successor lineage of the Actel/Microsemi Axcelerator architecture.
Key features include one-time-programmable (OTP) antifuse technology that is live-at-power-up, eliminating configuration memory upset concerns at turn-on, a true single-chip form factor that removes the need for external configuration devices, and low-power consumption valued in power-constrained satellite platforms. Embedded SRAM blocks include built-in FIFO control logic, and the architecture provides segmentable clocks, chip-wide highway routing, and carry logic for arithmetic pipelines.
The 0.15 um CMOS process with a 1.5V core combines high toggle rates (649 MHz maximum system speed) with acceptable static power, while the 624-pin LGA offers high I/O density for payload data handling. Clocking resources are segmentable, allowing isolated timing domains for different functional blocks.
Typical applications include satellite payload data processing, spacecraft on-board computers, telemetry and telecommand interfaces, and space science instrument control where SEU-robust logic is mandatory.
Design consideration: use Microchip application note AC170, which maps designs to commercial Axcelerator devices on footprint-compatible adapter boards for prototyping before committing to the OTP RTAX-S device.
This page synthesizes distributor data, drop-in same-family alternatives, prototyping methodology, and procurement guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für RTAX250S-LG624B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit RTAX250S-LG624B (gleiche Bauform und Footprint) – abweichend in Radiation Tolerance, Package, Family, Configuration, Equivalent System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTAX250S-1LG624B
✅ Drop-In✓ Auf Lager
$2020 / Stück
Datenblatt ansehen →RTAX250S-LG624V
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX250SL-LG624B
✅ Drop-In✓ Auf Lager
$2380 / Stück
Datenblatt ansehen →RTAX250SL-CG624B
✅ Drop-In✓ Auf Lager
$3950 / Stück
Datenblatt ansehen →RTAX1000S-1LG624V
✅ Drop-In✓ Auf Lager
$3600 / Stück
Datenblatt ansehen →RTAX250S-LG624B Grenzwerte & elektrische Eigenschaften
| Family | RTAX-S (RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs) |
| Equivalent System Gates | 250,000 gates |
| Configurable Logic Blocks (CLBs) | 2816 |
| Logic Cells | 4224 |
| Maximum System Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Gehäuse | 624-Pin LGA (LG624) |
| Technology Type | Antifuse, one-time programmable (OTP) |
| Configuration | Live-at-power-up, single chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Routing Features | Chip-wide highway routing, segmentable clocks, carry logic |
| Radiation Tolerance | Radiation-tolerant (spaceflight qualified family) |
| Montageart | Surface Mount |
RTAX250S-LG624B 624-pin lga (lg624) Pinbelegungsleitfaden
Pinbelegung für RTAX250S-LG624B (624-pin lga (lg624)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RTAX250S-LG624B.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTAX250S-LG624B ist geeignet für 6 Anwendungs: Satellite Payload Data Processing, Spacecraft On-Board Computer (OBC), Telemetry, Tracking and Command (TT&C) Interfaces, Space Science Instrument Control, Launch Vehicle Avionics, Prototyping with Commercial Axcelerator Devices.
Satellite Payload Data Processing
The RTAX250S-LG624B fits payload data-handling chains where 250K equivalent gates of glue logic, framing, and packet formatting must survive TID and SEE exposure for multi-year missions. Its embedded SRAM blocks with built-in FIFO control logic directly implement telemetry frame buffers and cross-domain data FIFOs without external memory. Placed between payload sensors and downlink formatters, the 649 MHz-class fabric handles clock-domain crossing and serialization at typical payload data rates, while chip-wide highway routing keeps wide buses clean. Because configuration is OTP antifuse and live-at-power-up, no configuration scrubber is needed for the fabric itself, reducing board complexity. The LG624 package provides the dense I/O needed for parallel sensor interfaces.
Empfohlen
Spacecraft On-Board Computer (OBC)
For OBC and command-and-data-handling subsystems, the RTAX250S-LG624B implements watchdog logic, memory controllers, redundant bus interfaces, and boot/reconfiguration sequencing. Its 2816 CLBs provide sufficient control-plane capacity at 250K gates, while segmentable clocks allow the processor interface, housekeeping, and safety logic to occupy isolated timing domains, improving signal integrity and easing timing closure. The radiation-tolerant antifuse fabric eliminates configuration-upset class failures at turn-on and is live-at-power-up, which is essential for autonomous fault recovery without ground intervention. Designers typically prototype on commercial Axcelerator AX250 devices using the AC170 adapter-board flow before committing OTP silicon, saving NRE on flight hardware iterations.
Empfohlen
Telemetry, Tracking and Command (TT&C) Interfaces
TT&C front-ends demand deterministic, always-available logic that boots instantly after eclipse recovery or safe-mode resets. The RTAX250S-LG624B meets this with live-at-power-up OTP configuration - no bitstream load time - so telecommand decoders and telemetry encoders are operational within microseconds of power application. The 624-pin LGA supplies the pin count for redundant interfaces, and carry-logic structures efficiently implement CRC, convolutional coding helpers, and frame synchronization state machines. Its low-power 0.15 um / 1.5V core process keeps static draw acceptable for the always-on TT&C power budget. Designers should budget decode timing to the standard speed grade early, or select the -1 grade if margins are tight.
Empfohlen
Space Science Instrument Control
Scientific instruments on observatories and interplanetary probes use the RTAX250S-LG624B for detector sequencing, ADC interface glue, and experiment state control. The radiation-tolerant fabric maintains functional integrity across accumulated dose over long cruise phases, and the embedded SRAM/FIFO blocks buffer detector data streams between acquisition events. Segmentable clocks permit quiet-domain separation so high-current digitizing logic does not modulate sensitive analog-support timing. Because the device is a single-chip solution, instrument designers avoid external configuration PROMs that add mass, board area, and additional SEE-susceptible parts - critical in tight instrument enclosures. Prototyping via the AC170 Axcelerator adapter flow lets science teams iterate control firmware rapidly before flight-lot commitment.
Empfohlen
Launch Vehicle Avionics
Stage-separation sequencing, flight-event timing, and telemetry multiplexing in launch avionics benefit from the RTAX250S-LG624B's deterministic, live-at-power-up operation and rad-tolerant margin for high-altitude radiation exposure during ascent. The 250K-gate class accommodates redundant-event majority-voting logic, and carry chains support fast comparators and counters for mission-event timing at microsecond resolution. The LG624's high I/O count supports dual-redundant interface sets demanded by launch reliability requirements. Since flight schedules are unforgiving, sourcing both the standard (RTAX250S-LG624B) and -1 speed grade (RTAX250S-1LG624B) with identical footprints lets programs qualify one PCB assembly across timing-margin outcomes, reducing board redesign risk under schedule pressure.
Empfohlen
Prototyping with Commercial Axcelerator Devices
Microchip's AC170 methodology lets teams develop RTAX250S-LG624B designs on commercial Axcelerator AX250 devices before programming flight silicon. The flow targets the RTAX-S design to the equivalent AX250 part, and extender adapter boards map the commercial package onto the LG624 RTAX-S footprint, so prototype PCBs match production. An EDIF netlist and pinout converter preserves placement intent across migration, shortening re-verification. This is essential because RTAX-S devices are one-time-programmable: any logic error discovered post-programming scrapes flight hardware. Recommended practice: complete static timing in RTAX-S timing models even while prototyping, since AX250 timing differs; reserve early adapter boards for functional checkout only, then final-verify against RTAX-S models before tape-out of flight assemblies.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTAX250S-LG624B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTAX250S-1LG624B | RTAX250S-LG624V | RTAX250SL-LG624B | RTAX1000S-1LG624V |
|---|---|---|---|---|---|
| Package | 624-Pin LGA (LG624) | 624-Pin LGA (LG624) - same | 624-Pin LGA (LG624) - same | 624-Pin LGA (LG624) - same | 624-Pin LGA (LG624) - same |
| Brand | Microchip Technology (Actel/Microsemi lineage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 250,000 | 250,000 | 250,000 | 250,000 (SL variant) | 1,000,000-class |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS |
| Qualification / Screening Suffix | B flow | -1 speed grade, B flow | V flow | B flow, SL variant | -1 speed grade, V flow |
| Configuration Technology | Antifuse OTP, live-at-power-up | Antifuse OTP, live-at-power-up | Antifuse OTP, live-at-power-up | Antifuse OTP, live-at-power-up | Antifuse OTP, live-at-power-up |
Wichtigste Unterscheidungsmerkmale
- OTP antifuse fabric with live-at-power-up operation (vs. RTAX1000S-1LG624V)
- Identical footprint across speed/screening variants (vs. RTAX250S-1LG624B)
- Single-chip solution vs external configuration (vs. SRAM-based space FPGAs (e.g., Xilinx XQR Virtex families))
Designhinweise
The RTAX250S-LG624B is one-time-programmable: a logic error discovered after programming scraps the device and possibly the assembled board. Always prototype on a commercial Axcelerator AX250 device using Microchip application note AC170 with footprint-compatible extender adapter boards, and complete static timing analysis against RTAX-S timing models (not AX250 models) before committing flight silicon. Keep the prototype netlist synchronized with the flight netlist using the EDIF netlist and pinout converter described in the datasheet.
The core operates from a 1.5V supply on a 0.15 um CMOS process. Estimated: budget core current using the RTAX-S datasheet power calculator with your toggle rates, since dynamic power dominates; do not copy figures from other family members. Provide clean 1.5V rail decoupling (bulk plus per-pin ceramics) and follow the datasheet power-up ramp requirements to guarantee reliable antifuse programming and live-at-power-up behavior. Verify I/O bank supply sequencing per the RTAX-S/SL datasheet before applying core power.
Exploit the segmentable clock resources to isolate timing domains: keep detector/interface clocks, safety-logic clocks, and housekeeping domains in separate segments to reduce clock skew and crosstalk on wide parallel buses routed through the chip-wide highway routing. For high-fanout clocks, use the datasheet's recommended buffer hierarchy rather than routing raw clocks. On the LG624 land pattern, follow the manufacturer PCB layout guidelines for LGA column attachment to ensure coplanarity and reliable solder joints across the 624 columns.
When planning PCB reuse across speed grades or screening flows, note that RTAX250S-LG624B, RTAX250S-1LG624B, and RTAX250S-LG624V share the identical LG624 footprint, so one PCB assembly can be qualified across variants; however, SL-variant timing and power differ, so re-run power and timing analysis if you plan to migrate to RTAX250SL-LG624B. Confirm I/O bank assignments remain valid across all candidate ordering suffixes before release.
Compliance-Informationen
Environmental compliance data was not present in the retrieved sources. Space-grade ceramic LGA packages are often covered by RoHS high-reliability exemptions; obtain Microchip's official material declaration for the exact ordering code before program documentation.
