RTAX250SL-LG624B - 250K Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-LG624B β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2950 | $2,950.00 |
| 10 | $2800 | $28,000.00 |
| 100 | $2650 | $265,000.00 |
| 500 | $2500 | $1,250,000.00 |
| 1,000 | $2380 | $2,380,000.00 |
Drop-in alternatives for RTAX250SL-LG624B β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
RTAX250SL-1LG624B
β Drop-Inπ Reference alternative (not in catalog)
RTAX250SL-LG624V
β Drop-Inπ Reference alternative (not in catalog)
RTAX250SL-1LG624V
β Drop-Inπ Reference alternative (not in catalog)
RTAX250SL-1CG624B
β Drop-Inπ Reference alternative (not in catalog)
RTAX250SL-LG624B Maximum Ratings & Electrical Characteristics
| Logic Family | RTAX-SL Radiation-Tolerant FPGA |
| Equivalent Gates | 250,000 |
| CLBs | 2816 |
| Logic Cells | 4224 |
| Maximum Clock Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Package | 624-pin LGA |
| Programming Technology | Antifuse (one-time programmable) |
| Power-Up Behavior | Live at power-up |
| Radiation Tolerance | Radiation-tolerant (space flight use) |
| Mounting Type | Surface Mount |
RTAX250SL-LG624B 624-pin lga Pin Configuration Guide
Complete pinout information for RTAX250SL-LG624B (624-pin lga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-LG624B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-LG624B is suitable for 6 applications: Satellite Payload Processing, Spacecraft Bus Control, Telemetry and Command Interfaces, Orbital Instrument Data Acquisition, Launch Vehicle Avionics, Deep-Space Mission Electronics.
Satellite Payload Processing
The RTAX250SL-LG624B fits satellite payload data processing because its radiation-tolerant antifuse fabric withstands total ionizing dose and single-event effects in orbit, while 250K gates and 2,816 CLBs provide enough fabric for format framing, compression pre-processing, and bus bridging. Its 649 MHz maximum clock supports high-throughput serial and parallel data paths, and the 624-pin LGA gives dense I/O for memory and payload interfaces. Placed between payload sensors and downlink chain, it is live at power-up with no configuration device, eliminating boot-time failure modes in orbit; the trade-off is one-time programming, so netlist sign-off is required before flight-lot programming.
Recommended
Spacecraft Bus Control
For spacecraft on-board computer and bus controller logic, the RTAX250SL-LG624B provides deterministic glue logic, housekeeping interfaces, and redundancy/voting circuits in a single chip. The 1.5 V core on a 0.15 um CMOS process keeps static power low - a key constraint on solar- and battery-powered buses - and the antifuse fabric cannot lose its configuration under heavy-ion strikes, unlike SRAM FPGAs that require external configuration scrubbing. Engineers implement Mil-Std-1553-style or custom bus interfaces across the 624-pin LGA I/O. Note that board power estimates must use the Libero SoC power calculator, since quiescent and dynamic currents are design-dependent.
Recommended
Telemetry and Command Interfaces
Telecommand decoders and telemetry encoders demand logic that is operational from the instant of power-up; the RTAX250SL-LG624B is live at power-up by architecture, requiring no configuration memory, which directly improves command-link availability during launch and eclipse phases. Its 4,224 logic cells comfortably host frame synchronizers, CRC engines, and time-tagging counters, and the 649 MHz fabric ceiling far exceeds typical TM/TC bit rates, leaving ample timing margin. The 624-ball LGA supports redundant interface routing for cold-spare sparing common in TT&C designs. Design teams typically prototype the RTL on ProASIC3 devices before committing to the flight-lot RTAX device.
Recommended
Orbital Instrument Data Acquisition
Science instruments on orbital platforms generate high-rate data that must be acquired, timestamped, and packetized in a radiation environment. The RTAX250SL-LG624B accommodates acquisition state machines, FIFO control, and detector interface logic within its 2816 CLBs, with the 624-pin LGA offering the pin count for multi-channel detector front-ends. The rad-tolerant qualification of the RTAX-SL family addresses the TID environment over multi-year missions, which commercial FPGAs cannot guarantee. Because acquisition latency depends on the clock plan, the -1 speed grade variant (RTAX250SL-1LG624B, 0.930 ns combinatorial delay) is recommended when detector clocking approaches the upper fabric limits.
Recommended
Launch Vehicle Avionics
Launch avionics experience intense vibration plus transient radiation from trapped belts during ascent; the RTAX250SL-LG624B's single-chip antifuse architecture provides configuration immunity with no external flash to mechanically or electrically fail, a common reliability lever in flight computers. The FPGA implements flight-event sequencers, redundancy management, and sensor aggregation across the dense 624-pin LGA I/O, and 1.5 V core operation limits dynamic power within constrained avionics power budgets. One-time programming enforces configuration control, aligning with launch-vehicle configuration management practices. Timing margins must be re-verified against temperature extremes in Libero SoC static timing analysis.
Recommended
Deep-Space Mission Electronics
Deep-space probes face galactic cosmic-ray flux far beyond LEO levels, making configuration-upset-immune logic essential. The RTAX250SL-LG624B's antifuse configuration cannot be flipped by single events, so no scrubber or configuration memory is flown - reducing parts count and failure modes on missions where repair is impossible. Its 250K-gate capacity hosts instrument control, autonomy kernels, and link-layer logic, while the 0.15 um process with 1.5 V core balances performance and total ionizing dose endurance per the RTAX-S/SL datasheet. Program managers should plan flight-lot quantities early, since space-grade lead times are long and allocation-constrained.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-LG624B β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1LG624B | RTAX250SL-LG624V | RTAX250SL-1LG624V | RTAX250SL-1CG624B |
|---|---|---|---|---|---|
| Package | 624-pin LGA | 624-pin LGA - same | 624-pin LGA - same | 624-pin LGA - same | 624-pin CGA (ceramic) |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| CLBs / Logic Cells | 2816 / 4224 | 2816 / 4224 | 2816 / 4224 | 2816 / 4224 | 2816 / 4224 |
| Max Clock Frequency | 649 MHz | 649 MHz | [DATA_NEEDED] | [DATA_NEEDED] | 649 MHz |
| CLB Combinatorial Delay | [DATA_NEEDED] | 0.930 ns (max, -1 grade) | [DATA_NEEDED] | 0.930 ns class (-1 grade) | 0.930 ns (max, -1 grade) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Radiation Tolerance | Yes (RTAX-SL rad-tolerant) | Yes | Yes | Yes | Yes |
| Speed Grade | Standard | -1 (fast) | Standard (V-grade) | -1 (V-grade) | -1 (fast) |
Key Differentiators
- Standard speed grade cost advantage (vs RTAX250SL-1LG624B)
- Single-chip live-at-power-up operation (vs SRAM-based commercial FPGAs (e.g., A3PE3000))
- High I/O density in one package (vs RTAX250SL-1CG624B)
Design Notes
RTAX-SL devices are antifuse one-time-programmable: there is no erase or rework after programming. Complete static timing analysis, simulation, and pin sign-off in the Libero SoC toolchain before submitting the fuse file to the programming house. Per the Microchip datasheet, use the footprint-compatible adaptor board with an EDIF netlist and pinout converter (application note 'Prototyping for RTAX-S and RTAX-SL Devices') to prototype on ProASIC3-family silicon before committing flight lots.
The core runs at 1.5 V on a 0.15 um CMOS process, but I/O banks use separate supply rails. Estimated: because dynamic power is design-dependent, generate your power estimate in the Libero SoC power tool using your actual netlist toggle rates rather than family averages. Provide clean decoupling (bulk plus 0.1 uF per bank) and follow the datasheet power-up sequencing requirements so the live-at-power-up fabric never sees out-of-range rail slew during launch power events.
The 624-ball LGA lands require tight solder-paste and reflow control because balls are hidden under the body - use X-ray or endoscopic inspection on flight hardware. Recommended: fan out high-speed and clock I/O to inner layers with controlled impedance, and reserve adjacent balls for ground return to minimize loop area on payload data interfaces. Verify land pattern against the Microchip package drawing in the RTAX-S/SL datasheet before PCB fab release.
Compliance Information
Space-grade qualification is governed by the RTAX-SL program flow rather than AEC-Q100. RoHS/REACH status not stated in retrieved distributor data; verify per orderable code on the Microchip product page.
