RTAX1000S-1LG624V - 1M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX1000S-1LG624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4275 | $42,750.00 |
| 100 | $4050 | $405,000.00 |
| 500 | $3825 | $1,912,500.00 |
| 1,000 | $3600 | $3,600,000.00 |
Drop-in alternatives for RTAX1000S-1LG624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX1000SL-1LG624V
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View Datasheet →RTAX1000S-LG624V
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View Datasheet →RTAX2000S-1LG624V
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View Datasheet →RTAX2000SL-1LG624V
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$9600 / Unit
View Datasheet →RTAX250S-1LG624V
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View Datasheet →RTAX250S-LG624V
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View Datasheet →RTAX1000S-1LG624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 1000000 |
| Logic Cells | 18144 |
| CLBs | 12096 |
| Maximum User I/Os | 418 |
| Embedded Memory | Up to 540 kbits SRAM with optional EDAC |
| Technology | CMOS antifuse (one-time programmable) |
| Total Ionizing Dose (Functional) | 300 krad (Si) |
| Total Ionizing Dose (Parametric) | 200 krad (Si) |
| SEU Rate | Less than 1E-10 errors per bit-day |
| Combinatorial Delay (max) | 0.93 ns |
| Speed Grade | -1 |
| Package | LG624 (624-ball ceramic column grid array) |
| Configuration | Nonvolatile, live at power-up, single chip |
| Radiation Tolerance Class | Rad-tolerant (space flight) |
| Architecture Family | RTAX-S (based on Axcelerator) |
| Mounting Type | Surface Mount |
RTAX1000S-1LG624V lg624 (624-ball ceramic column grid array) Pin Configuration Guide
Complete pinout information for RTAX1000S-1LG624V (lg624 (624-ball ceramic column grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX1000S-1LG624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX1000S-1LG624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Telemetry and Command (TM/TC) Interface, Earth-Observation Instrument Data Acquisition, Radiation-Hardened Bus Controller / Interface Bridge, Launch Vehicle Avionics and Flight Control Logic, Cubesat and SmallSat On-Board Computer Logic.
Satellite Payload Data Processing
The RTAX1000S-1LG624V fits payload processing chains because it combines 18144 logic cells with 540 kbits of embedded SRAM featuring optional EDAC protection, allowing telemetry framing, compression pre-processing, and sensor data formatting entirely on-chip. Its 418 user I/Os interface multiple instrument channels and downlink formatters without glue logic. Used between instrument front-ends and the telemetry encoder, the antifuse fabric delivers deterministic timing (0.93 ns max combinatorial delay) with no configuration-load time. The trade-off versus SRAM FPGAs is one-time programmability, mitigated by the Microchip/Aldec prototyping flow before flight-part programming, while the antifuse bitstream itself is immune to configuration upsets.
Recommended
Spacecraft Telemetry and Command (TM/TC) Interface
For TM/TC interfaces, the RTAX1000S-1LG624V provides live-at-power-up operation - a mission requirement because command receivers must be functional the instant spacecraft power is applied, with no configuration device boot sequence. The 12096-CLB fabric implements CCSDS framing, decoders, and redundant command majority-voting logic, while sub-1E-10 errors/bit-day SEU rates keep upsets within scrubbing budgets. Its single-chip form factor removes the external configuration PROM that would otherwise be a single point of failure on the critical command path. Designers pair it with rad-hardened power sequencing and verify pinout against the LG624 tables in the RTAX-S/SL datasheet.
Recommended
Earth-Observation Instrument Data Acquisition
Earth-observation imagers generate high-rate parallel data streams that map efficiently onto the RTAX1000S-1LG624V: the segmentable clock network and chip-wide highway routing distribute high-speed sampling clocks, while carry-logic chains build wide accumulation and correlator datapaths. The 1M-gate density accommodates image deflicker, region-of-interest extraction, and CCSDS packetization. Embedded dual-port SRAM with FIFO control implements line buffers without external memory, reducing board mass and radiation-sensitive part count. Because acquisition logic must not glitch after latchup recovery, the nonvolatile antifuse configuration guarantees instant restoration of the acquisition state machine after power cycling.
Recommended
Radiation-Hardened Bus Controller / Interface Bridge
Spacecraft backplanes still rely on MIL-STD-1553, SpaceWire, and custom serial bridges, all implementable in the RTAX1000S-1LG624V using its 418 user I/Os and deterministic antifuse fabric. The device bridges legacy protocol cores to modern payload buses, with 0.93 ns combinatorial delay supporting tight protocol turnaround timing. Single-chip operation avoids the configuration-readback security and availability concerns of SRAM FPGAs in trusted-platform designs. For systems migrating between 1553 and SpaceWire, the shared LG624 footprint across the RTAX-S family (RTAX250S/1000S/2000S) lets one PCB layout serve multiple protocol-density variants, cutting qualification cost across product lines.
Recommended
Launch Vehicle Avionics and Flight Control Logic
Launch environments combine extreme vibration with short, high-reliability missions; the ceramic column grid array (LG624) package of the RTAX1000S-1LG624V provides hermetic column-bonded interconnect suited to these conditions. Flight control sequencing, redundancy management, and safe-and-arm interface logic benefit from live-at-power-up behavior and zero configuration latency - the FPGA is operational before booster ignition power sequencing completes. The 300 krad functional TID tolerance covers the accumulated dose of multi-orbit and suborbital profiles, and the absence of a configuration memory chain removes a launch-delay failure mode. One-time programmability mandates full simulation plus prototyping on commercial Axcelerator parts first.
Recommended
Cubesat and SmallSat On-Board Computer Logic
SmallSat OBCs value the RTAX1000S-1LG624V for its low static power and true single-chip integration: watchdog, memory scrubbing control, and housekeeping telemetry fit alongside the main application in 18144 logic cells, replacing several discrete glue devices. Antifuse nonvolatility means a brown-out on the small power budget never corrupts configuration - the design resumes correctly at power re-application, which is essential for sun-pointing recovery sequences. EDAC-protected embedded SRAM safeguards critical tables. Designers on constrained budgets use the shared LG624 footprint to start flight builds on RTAX250S and scale to RTAX1000S or RTAX2000S densities without PCB respins as firmware scope grows.
Recommended
Recommended Products Summary
Engineering reference data for RTAX1000S-1LG624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX1000SL-1LG624V | RTAX1000S-LG624V | RTAX2000S-1LG624V | RTAX250S-1LG624V |
|---|---|---|---|---|---|
| Package | LG624 (624-ball CCGA) | LG624 - same | LG624 - same | LG624 - same | LG624 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 1000000 | 1000000 | 1000000 | ~2000000 | ~250000 |
| Speed Grade | -1 (0.93 ns max combinatorial delay) | -1 | Standard | -1 | -1 |
| Technology | CMOS antifuse (OTP) | CMOS antifuse (OTP) | CMOS antifuse (OTP) | CMOS antifuse (OTP) | CMOS antifuse (OTP) |
| Total Ionizing Dose (Functional) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) | 300 krad (Si) |
| SEU Rate | < 1E-10 errors per bit-day | Enhanced (SL flip-flops) | < 1E-10 errors per bit-day | < 1E-10 errors per bit-day | < 1E-10 errors per bit-day |
| Configuration | Nonvolatile, live at power-up, single chip | Nonvolatile, live at power-up | Nonvolatile, live at power-up | Nonvolatile, live at power-up | Nonvolatile, live at power-up |
Key Differentiators
- One-time-programmable antifuse with live-at-power-up operation (vs RTAX1000S-LG624V)
- Enhanced SEU-hardened option within identical footprint (vs RTAX1000SL-1LG624V)
- In-footset density scalability without PCB respin (vs RTAX250S-1LG624V)
- Honest trade-off: no in-flight reprogrammability (vs RTAX1000SL-1LG624V)
Design Notes
The RTAX1000S-1LG624V is one-time programmable: once antifuses are blown the part cannot be reworked. Never program flight parts before completing gate-level simulation, timing closure, and a hardware prototype. The sanctioned flow targets the equivalent commercial Axcelerator/ProASIC3E device (e.g., via the Aldec ACT-H3Ki-CG624 adaptor or Microchip Extender boards), then transfers the verified design to the RTAX-S antifuse part.
The LG624 ceramic column grid array uses column (fused-ball) interconnect rather than standard solder balls. Specify the correct CCGA reflow profile and inspect columns for coplanarity before assembly; column devices are less tolerant of warped boards than BGA parts. Follow the LG624 land-pattern data in the RTAX-S/SL datasheet and confirm escape routing under the 1.0 mm column pitch with your fabricator.
Estimated: size the core supply for the RTAX1000S static plus dynamic current using the Microchip power calculator with your actual switching activity; antifuse FPGAs have low static power but dynamic current scales with clock count and toggle rates in the 18144-cell fabric. Provide separate core and I/O rails with local decoupling, and verify the exact rail voltages and sequencing against the latest RTAX-S/SL datasheet revision before release.
With up to 418 user I/Os on a 624-ball package, many switching outputs share power returns. Assign banks to balance edge density, use the lowest slew-rate setting that meets timing for non-critical outputs, and place series termination near the driver for point-to-point lines. For single-event transient robustness on long board traces, apply TMR to off-chip handshake signals and use the embedded EDAC on SRAM blocks holding state.
Compliance Information
Compliance data not present in verified web data. Space-grade hermetic ceramic column grid array packages may be exempt from RoHS/lead-free requirements; confirm with Microchip before ordering.
