RTAX4000SL-1LG1272B - 4M-Gate Rad-Tolerant FPGA | Microchip
Teilenummer: RTAX4000SL-1LG1272B ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12500 | $12.500,00 |
| 10 | $11800 | $118.000,00 |
| 100 | $10900 | $1.090.000,00 |
| 500 | $9950 | $4.975.000,00 |
| 1.000 | $9200 | $9.200.000,00 |
RTAX4000SL-1LG1272B Übersicht
A radiation-tolerant FPGA is a programmable logic device engineered to survive the harsh radiation environment of space: total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) exposure that would disable commercial silicon. Within the programmable logic hierarchy, the RTAX-SL family sits at the space-flight tier above commercial FPGAs, descending from the Actel/Microsemi AX architecture re-implemented on a 0.15 um flash-adjacent CMOS process with antifuse-based one-time programmable interconnect.
Key features of the RTAX4000SL include the highest density in the family at four million equivalent gates, live-at-power-up operation because configuration data is fixed in antifuse interconnect rather than loaded from external memory, a true single-chip form factor that eliminates configuration PROMs, and low static power consumption critical for constrained spacecraft power budgets.
Architecturally, the device is based on the commercial Axcelerator accelerator structure, adding embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic. The 0.99 ns combinatorial delay per CLB supports high-throughput signal processing pipelines, while the 1.5 V core keeps dynamic power manageable in vacuum environments where thermal dissipation paths are limited.
Typical applications include satellite payload data processing, spacecraft avionics and telemetry controllers, deep-space instrument interfaces, and launch-vehicle flight control electronics. The RTAX4000SL fits these roles where SEU-sensitive logic must remain in a single sealed ceramic package qualified to space-flight screening levels.
A key design consideration is that antifuse FPGAs are one-time programmable: final netlists must be fully verified on the pin-compatible RTAX4000SL prototyping package before committing flight units, following Microchip's recommended prototyping-to-flight migration flow.
This page synthesizes verified distributor data, drop-in alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für RTAX4000SL-1LG1272B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit RTAX4000SL-1LG1272B (gleiche Bauform und Footprint) – abweichend in Configuration, Family, Package, Logic Cells, Core Supply Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTAX4000SL-LG1272B
✅ Drop-In✓ Auf Lager
$9600 / Stück
Datenblatt ansehen →RTAX4000SL-1CG1272V
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX4000SL-1LG1272B Grenzwerte & elektrische Eigenschaften
| Family | RTAX-SL (Radiation-Tolerant FPGA) |
| Equivalent System Gates | 4,000,000 |
| Logic Cells | 60480 |
| Configurable Logic Blocks (CLBs) | 40320 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Max Combinatorial Delay | 0.99 ns per CLB |
| Speed Grade | -1 |
| Gehäuse | 1272-pin LGA (ceramic) |
| Programmability | Antifuse, one-time programmable |
| Configuration | Live at power-up (no external configuration memory) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Montageart | Surface Mount |
| Application Domain | Space-flight systems |
| RoHS-Status | unknown |
RTAX4000SL-1LG1272B 1272-pin lga (ceramic) Pinbelegungsleitfaden
Pinbelegung für RTAX4000SL-1LG1272B (1272-pin lga (ceramic)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RTAX4000SL-1LG1272B.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTAX4000SL-1LG1272B ist geeignet für 6 Anwendungs: Satellite Payload Data Processing, Spacecraft Avionics and Telemetry Control, Deep-Space Instrument Interfaces, Launch-Vehicle Flight Control Electronics, On-Board Signal Processing Pipelines, Single-Chip System Integration (Board-Area Reduction).
Satellite Payload Data Processing
The RTAX4000SL-1LG1272B fits satellite payload processing because it packs 4,000,000 equivalent gates and 60,480 logic cells into a single hermetic 1272-pin ceramic LGA, allowing payload signal chains that once needed multiple devices to be integrated on one chip. Its 0.99 ns maximum combinatorial delay supports high-throughput pipelines for image downlink formatting and compression, while the embedded SRAM with built-in FIFO control logic absorbs burst-rate sensor data. Because the antifuse configuration is live at power-up with no external boot memory, the payload acquires logic function immediately after switch-on, a benefit during safe-mode recovery. In orbit, its 1.5 V core keeps dynamic power low, easing radiator sizing.
Empfohlen
Spacecraft Avionics and Telemetry Control
Spacecraft avionics controllers benefit from the RTAX4000SL-1LG1272B's deterministic, single-chip live-at-power-up logic: there is no configuration-load window during which the flight computer would be blind. The device's 40,320 CLBs implement redundant telemetry encoders, command decoders, and watchdog logic, while segmentable clock resources let designers isolate timing domains for redundancy management. Chip-wide highway routing simplifies distribution of global status signals across the die. Operating from a tightly regulated 1.5 V (1.425 V to 1.575 V) core, the FPGA integrates easily with spacecraft point-of-load regulation. Its ceramic LGA packaging suits board-level conformal coating and hermetic enclosure flows standard in avionics assembly.
Empfohlen
Deep-Space Instrument Interfaces
Deep-space instruments operate where repair is impossible and radiation doses accumulate over many years, making the RTAX4000SL-1LG1272B's radiation-tolerant antifuse architecture a natural fit. The 0.15 um CMOS process and 1.5 V core limit static leakage and SEU cross-section, while the fixed antifuse interconnect cannot suffer configuration upsets the way SRAM-based FPGAs do. Designers use the 60,480 logic cells to implement instrument sequencers, ADC framing, and science-data packetizers, exploiting dedicated carry logic for on-board numerical processing such as accumulation and filtering. Embedded SRAM FIFOs buffer acquisition bursts between instrument sensors and the spacecraft data bus, decoupling instrument timing from downlink timing.
Empfohlen
Launch-Vehicle Flight Control Electronics
Launch-vehicle avionics experience high vibration, wide temperature swings, and brief but intense radiation belts, and the RTAX4000SL-1LG1272B addresses these conditions with a rugged ceramic 1272-pin LGA package and radiation-tolerant silicon. The device's live-at-power-up property guarantees control logic is active the instant power is applied to the flight string - a critical requirement during the powered-flight sequence where there is no time for configuration loading. Its 0.99 ns CLB combinatorial delay permits tightly closed-loop control computations, and four million gates consolidate guidance interface, redundancy voting, and telemetry formatting into a single screened device, reducing board count, mass, and single-point failure interfaces in the control chain.
Empfohlen
On-Board Signal Processing Pipelines
For high-rate digital signal processing in space payloads - radar front-end correlation, multispectral image filtering, or CCSDS-compliant encoding - the RTAX4000SL-1LG1272B offers four million gates with dedicated carry logic enabling efficient adder and accumulator chains at device-level timing supported by the 0.99 ns maximum combinatorial delay. Embedded SRAM blocks with built-in FIFO control implement coefficient storage and ping-pong line buffers without external memory, which is valuable because board-level SRAM in space requires additional SEU mitigation. Segmentable clocks allow processing, interface, and housekeeping domains to run at independent frequencies. The 1.5 V core keeps pipeline power within spacecraft thermal budgets even for continuous-duty processing.
Empfohlen
Single-Chip System Integration (Board-Area Reduction)
Programs migrating legacy multi-chip spaceflight logic into a single device choose the RTAX4000SL-1LG1272B to reduce board area, mass, and interconnect failure points. At 4,000,000 gates it is the highest-density RTAX-SL family member, consolidating glue logic, bus bridges, memory controllers, and custom interfaces onto one hermetic ceramic LGA. Because configuration is stored in antifuse interconnect, no configuration PROM or flash - each of which is a radiation liability - is needed, delivering a true single-chip form factor as Microchip advertises. The footprint-compatible adaptor board and EDIF netlist/pinout convertor methodology documented by Microchip eases migration from the RTAX4000SL prototyping package to the screened flight part.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTAX4000SL-1LG1272B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTAX4000SL-LG1272B | RTAX4000SL-1CG1272V |
|---|---|---|---|
| Package | 1272-pin ceramic LGA | 1272-pin ceramic LGA - same | 1272-pin ceramic CGA (column grid) - footprint family match, verify pad design |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells / CLBs | 60480 / 40320 | 60480 / 40320 | 60480 / 40320 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) | 1.5 V (1.425 V to 1.575 V) |
| Max Combinatorial Delay | 0.99 ns | 0.99 ns | 0.99 ns |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS |
| Application Tier | Space-flight (screened) | Space-flight (screening per ordering code) | Space-flight (screening per ordering code) |
| Configuration | Antifuse, live at power-up | Antifuse, live at power-up | Antifuse, live at power-up |
Wichtigste Unterscheidungsmerkmale
- Live-at-power-up single-chip operation (vs. RTAX4000SL-1LG1272PROTO)
- No external configuration memory required (vs. RTAX4000SL-LG1272B)
- Same die in LGA vs CGA ceramic format (vs. RTAX4000SL-1CG1272V)
Designhinweise
Antifuse FPGAs are one-time programmable - a post-production design change requires new flight hardware. Always develop and fully verify the netlist on the RTAX4000SL prototyping package first: the Microchip datasheet documents a migration methodology using a footprint-compatible adaptor board and an EDIF netlist and pinout convertor for easy prototyping-to-flight migration. Budget schedule margin for this two-stage flow; skipping it risks scrapping expensive screened flight units. Ordering code suffixes encode speed grade and screening level - verify them against the datasheet ordering-information table before purchase.
Estimated: keep the 1.5 V core rail within the specified 1.425 V to 1.575 V window (plus/minus 5 percent) at the device pins; supply ripple and IR drop on a large 1272-pin LGA can erode timing margins against the 0.99 ns combinatorial-delay figure. Use multiple low-ESR decoupling capacitors distributed around the package perimeter and a solid power plane. Confirm core current requirements for your design via the Microchip power estimation flow, since dynamic current scales with clock segmentation and utilization.
The 1272-pin ceramic LGA requires careful land-pattern design: ceramic packages have a CTE mismatch with standard FR-4, so follow the land-pattern and under-constraints guidance in the Microchip RTAX-S/SL datasheet and consider board material CTE matching for large flight boards. Ball/land assignment follows the datasheet pinout tables - do not infer pin functions from other packages. For flight assemblies, plan inspection access for solder-joint verification under the large body, and account for the package mass in vibration-margin analysis.
Compliance-Informationen
Space-flight-grade hermetic ceramic LGA package. Compliance declarations are not stated in the provided web data; request certification documents from Microchip. AEC-Q100 is not applicable to this space-flight product.