RTAX4000SL-LG1272B - 4M Gate Rad-Tolerant FPGA, 1.5V LGA | Microchip
MPN: RTAX4000SL-LG1272B β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12000 | $12,000.00 |
| 10 | $11400 | $114,000.00 |
| 100 | $10800 | $1,080,000.00 |
| 500 | $10200 | $5,100,000.00 |
| 1,000 | $9600 | $9,600,000.00 |
Drop-in alternatives for RTAX4000SL-LG1272B β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX4000SL-1LG1272B
β Drop-Inβ In Stock
$9200 / Unit
View Datasheet βRTAX4000SL-1LG1272PROTO
β Drop-Inπ Reference alternative (not in catalog)
RTAX4000SL-LG1272PROTO
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
RTAX4000S-1LG1272B
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
RTAX4000SL-1LG1272
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
RTAX4000SL-LG1272B Maximum Ratings & Electrical Characteristics
| Family | RTAX-SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 4,000,000 |
| Logic Cells | 40320 |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) |
| Package | 1272-Pin LGA |
| Mounting Type | Surface Mount |
| Packaging | Box |
| Programmability | One-Time Programmable (antifuse) |
| Configuration | Live-at-power-up, single chip |
| Embedded Memory | Embedded SRAM with FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Radiation Tolerance | Radiation-tolerant (space-flight class) |
RTAX4000SL-LG1272B 1272-pin lga Pin Configuration Guide
Complete pinout information for RTAX4000SL-LG1272B (1272-pin lga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000SL-LG1272B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000SL-LG1272B is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Avionics, On-Board Telemetry and Telecommand, Instrumentation and Sensor Interface Electronics, Launch Vehicle and Avionics Control Electronics, Deep-Space and GEO Communication Payloads.
Satellite Payload Data Processing
The RTAX4000SL-LG1272B fits satellite payload processing where 4M system gates and 40320 logic cells implement image compression, CCSDS framing, and wide parallel bus interfaces in a single chip. Its live-at-power-up antifuse operation removes external configuration flash - a radiation-upset weak point - so the payload logic is functional the instant power is applied after eclipse exit. The 1272-pin LGA package supplies the terminal count for wide 32- and 64-bit data paths to imaging sensors and mass memories. Implemented between a sensor front-end and a downlink formatter, the fabric's embedded SRAM with built-in FIFO control buffers rate-mismatch streams without external memory, reducing board-level parts count and mission risk in LEO and GEO payloads.
Recommended
Spacecraft Bus Avionics
Spacecraft on-board computers and TMTC controllers use the RTAX4000SL-LG1272B to glue together MIL-STD-1553, SpaceWire, and UART peripherals around a rad-tolerant processor, exploiting the 1.5V core (1.425V-1.575V range) for low bus power. Radiation tolerance at the 0.15 um process node sustains total-ionizing-dose budgets typical of multi-year LEO missions, while segmentable clocks let designers isolate the time-critical 1553 scheduler clock domain from lower-speed housekeeping logic. Because the antifuse fabric is one-time programmable, bus designers lock flight firmware at qualification, eliminating in-orbit configuration-upset risk. The chip-wide highway routing resources keep long inter-domain buses deterministic in timing, simplifying worst-case timing sign-off for avionics certification.
Recommended
On-Board Telemetry and Telecommand
TMTC modules benefit from the RTAX4000SL-LG1272B's deterministic, single-chip implementation of frame sync, Reed-Solomon and convolutional framing, and command decoders. With 4M gates there is headroom to instantiate redundant decoder channels within one device, supporting majority-voted architectures without extra FPGA packages on the power budget. Live-at-power-up behavior guarantees the receiver chain decodes commands immediately after a power cycle initiated by the flight software watchdog - a scenario commercial SRAM FPGAs handle poorly because of reconfiguration latency. Embedded FIFO blocks decouple the 1.5V core logic from slower front-end processors, and the 1272-terminal LGA offers enough I/O to bond out redundant interfaces for cross-strapping between the primary and redundant TMTC chains.
Recommended
Instrumentation and Sensor Interface Electronics
Science instruments - spectrometers, star trackers, and radiation monitors - use the RTAX4000SL-LG1272B for front-end sequencer and ADC interfacing logic. The carry-logic fabric implements high-speed accumulation and co-adding chains, while embedded SRAM banks hold calibration tables adjacent to the datapath. The 0.15 um antifuse process exhibits low static power, valuable when instruments are duty-cycled under tight solar-array budgets, and the single-chip form factor reduces board area inside thermally constrained optical benches. Designers typically pair the device with space-grade ADCs and use the LG1272's generous I/O to run parallel CMOS or LVDS-style links; the deterministic fabric timing (sub-nanosecond per-cell delays on the -1 grade) simplifies fixed-latency trigger alignment across multiple sensor channels.
Recommended
Launch Vehicle and Avionics Control Electronics
Launch-vehicle flight control and sequencing electronics adopt the RTAX4000SL-LG1272B because mission durations are short but radiation and vibration environments are severe; the ceramic LGA package withstands mechanical stress better than plastic BGA alternatives. The 4M-gate fabric hosts redundant control laws, majority-voting on safety-critical signals, and discrete hot-standby channels within one package, cutting system mass. Live-at-power-up logic is essential on vehicles where power application coincides with the start of the flight sequence - there is no configuration boot window. Designers implement the sequencer on the footprint-compatible PROTO device first, then port the EDIF netlist and pinout to flight LG1272 units using Microchip's documented migration converter flow.
Recommended
Deep-Space and GEO Communication Payloads
Communications transponders for GEO and deep-space missions map encoders, scramblers, and multiplexers into the RTAX4000SL-LG1272B's 40320-cell fabric. Radiation tolerance over long mission profiles at the 0.15 um node supports TID budgets of multi-year GEO service, while single-chip operation shrinks the failure surface versus multi-FPGA chains. The embedded SRAM/FIFO resources handle constant-bit-rate adaptation between baseband processors and modulators, and the 1272-pin LGA terminates the wide parallel baseband buses and multiple redundant RF-chain control interfaces. Operating from a 1.5V rail (1.425V-1.575V), the device keeps core power low - important on transponders where DC budgets are dominated by TWTAs - and the deterministic antifuse timing simplifies fixed-latency frame alignment across the transmit chain.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000SL-LG1272B β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000SL-1LG1272B | RTAX4000SL-1LG1272PROTO | RTAX4000SL-LG1272PROTO |
|---|---|---|---|---|
| Package | 1272-Pin LGA | 1272-Pin LGA - same | 1272-Pin LGA (PROTO) - same footprint | 1272-Pin LGA (PROTO) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 40320 | 40320 | 40320 (60480 logic cells) | 40320 |
| Speed Grade | Standard | -1 (faster, 0.99 ns max combinatorial delay) | -1 | Standard |
| Core Supply Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS |
| Intended Use | Flight unit | Flight unit (higher timing margin) | Prototyping / development | Prototyping / development |
Key Differentiators
- Live-at-power-up single-chip operation (vs Commercial SRAM FPGAs (e.g., Xilinx Virtex class))
- Higher timing margin option without respin (vs RTAX4000SL-LG1272B (standard grade, this part))
- Dedicated flight vs prototyping split (vs RTAX4000SL-1LG1272PROTO)
Design Notes
RTAX-SL devices are one-time programmable (antifuse). Each RTAX4000SL-LG1272B flight unit accepts exactly one programming pass, so never use flight silicon for functional debug. Per the Microchip datasheet methodology, implement and verify the design on a footprint-compatible adapter board with the PROTO variant, then use the EDIF netlist and pinout converter to migrate to the flight LG1272 device. Budget at least one spare flight unit per board for program loss or handling damage.
Design the core rail for 1.5V nominal with a 1.425V-1.575V tolerance window per the Microchip USA RTAX4000SL description. Since antifuse fabric draws mostly static current, size the core regulator for worst-case static plus I/O dynamic current rather than assuming commercial-FPGA-style switching profiles. Verify I/O bank supply (VCCI) options and any power-up sequencing requirements in the RTAX-S/SL datasheet (ds2169) before releasing the power tree.
The 1272-pin LGA ceramic package requires a precision land pattern and careful coplanarity management; follow the package drawing in the Microchip datasheet exactly and avoid via-in-pad under terminals unless filled and capped. Radiated-emission and single-event-latchup hardening practice for space boards: place bulk and 0.1 uF decoupling at each VCCI bank, and keep the 1.5V core plane solid under the package to minimize rail droop during simultaneous switching on the wide parallel buses.
Compliance Information
Space-grade ceramic-package programmatic part; environmental compliance data was not present in the retrieved web data. Export control (ITAR/EAR) restrictions typically apply to radiation-tolerant flight parts - verify with the franchised distributor.
