NXP Semiconductors

S912XDP512J1CAGR - 16-bit S12X MCU, 512KB Flash, 80MHz, 144-LQFP | NXP

Teilenummer: S912XDP512J1CAGR ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
2.5 V / 5 V Vdss 144-LQFP (20x20 mm) Package 80 MHz Speed 512 KB (512K x 8) Flash Memory
Ab $10.4 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-18
Mengenpreise
Menge Stückpreis Gesamt
1 $18.45 $18,45
10 $16.2 $162,00
100 $13.85 $1.385,00
500 $11.95 $5.975,00
1.000 $10.4 $10.400,00
ℹ️ Alle Preise sind in USD

S912XDP512J1CAGR Übersicht

The NXP S912XDP512J1CAGR is a 16-bit HCS12X microcontroller featuring an S12X core running at 80 MHz, with 512 KB of Flash program memory and 32 KB of RAM, housed in a 144-pin LQFP package (20x20 mm). It supports 119 digital I/O pins and integrates dual CAN, SCI, SPI, and I2C communication interfaces, making it well suited for automotive body, chassis, and industrial control applications.

Background: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and a range of peripherals such as timers, ADCs, and communication controllers. The S12X family from NXP is a 16-bit CISC architecture derived from the original HC12, with the X-variant adding an enhanced XGate coprocessor and improved memory management for deterministic real-time control in automotive ECUs.

Key features include 4 KB of EEPROM for parameter storage, 8-channel 10-bit and 16-channel 10-bit ADC, PWM with up to 8 channels, plus low-voltage detect (LVD), power-on reset (POR), and a watchdog timer (WDT) for safety-critical operation. The S12X instruction set is source-compatible with the legacy HC12, easing migration of existing 16-bit code bases while doubling the typical throughput.

Typical applications span automotive body control modules (BCM), instrument clusters, HVAC controllers, lighting modules, industrial PLCs, and CAN/J1939 networked nodes. The dual-CAN interface and 119 GPIO count allow direct connection to multiple sensor and actuator networks without external bus expanders, reducing BOM cost.

When designing with this device, ensure the 5V supply is well decoupled with bulk and 100 nF ceramics near each VDD/VSS pair. Configure the PLL mode to 80 MHz only with a stable 4 MHz crystal; verify lock status in software before switching to PLL clock. For automotive EMC compliance, place the CAN transceivers close to the MCU and use a common-mode choke on the bus lines.

This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, cross-references for drop-in alternatives within the S12X family, and practical design notes not collected in the manufacturer datasheet alone.

Drop-in-Alternativen für S912XDP512J1CAGR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S912XDP512J1CAGR (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, Package.

NXP Semiconductors
Core Architecture: 16-bit HCS12X (S12X core)
Operating Temperature: -40C to +105C
Package: 144-LQFP (LFQFP), 20x20 mm square
Vergleichen mit S912XDP512J1CAGR →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

S912XDP512J1CAL

✅ Drop-In
📦 144-LQFP
Same 512KB Flash/RAM and S12X core, lead-free variant (no 'R' suffix indicates tube packing instead of T&R); 100% pin-compatible

📋 Referenzalternative (nicht im Katalog)

S912XDT512J1CAGR

✅ Drop-In
📦 144-LQFP
Lower-power S12XD sub-family, same 512KB Flash and 144-LQFP footprint, slightly different peripheral mix

📋 Referenzalternative (nicht im Katalog)

S912XET512J2VAGR

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ Auf Lager

$1 / Stück

Datenblatt ansehen →

S912XEP768J5CAGR

✅ Drop-In
📦 144-LQFP
Larger 768KB Flash, same S12X core and 144-LQFP footprint, +50% program memory vs base part

📋 Referenzalternative (nicht im Katalog)

S912XHZ512F1VAG

✅ Drop-In
📦 144-LQFP
HZ512 sub-family optimized for motor control with enhanced PWM, same 512KB Flash and 144-LQFP footprint

📋 Referenzalternative (nicht im Katalog)

S912XDP512J1CAGR Grenzwerte & elektrische Eigenschaften

Core Processor HCS12X
Core Size 16-Bit
Core Architecture CISC (S12X)
Max Clock Speed 80 MHz
Program Memory Size 512 KB (512K x 8) Flash
Program Memory Type FLASH
RAM Size 32 KB
EEPROM Size 4 KB
Number of I/O 119
Gehäuse 144-LQFP (20x20 mm)
Montageart Surface Mount
Versorgungsspannung 2.5 V / 5 V
Betriebstemperatur -40C to +85C
AEC-Q100 Qualified Yes
Communication Interfaces CAN (2x), SCI, SPI, I2C
ADC 8x10-bit + 16x10-bit
Peripherals LVD, POR, PWM, WDT

S912XDP512J1CAGR Pin-Konfiguration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 VDDR — Voltage regulator supply
Pin 2 VDD1 — Core supply voltage
Pin 3 VSS1 — Ground for core
Pin 4 VDD2 — I/O supply voltage
Pin 5 VSS2 — Ground for I/O
Pin 6 XCLKS — Clock mode select
Pin 7 EXTAL — External clock/crystal input
Pin 8 XTAL — Crystal oscillator output
Pin 9 RESET — External reset input (active low)
Pin 10 TEST — Test mode input
Pin 11 BKGD — Background Debug Mode (BDM) data
Pin 12 MODC — Mode selection
Pin 13 PAD0 — Port AD bit 0 (AN0)
Pin 14 PAD1 — Port AD bit 1 (AN1)
Pin 15 PAD2 — Port AD bit 2 (AN2)
Pin 16 PAD3 — Port AD bit 3 (AN3)
Pin 17 PAD4 — Port AD bit 4 (AN4)
Pin 18 PAD5 — Port AD bit 5 (AN5)
Pin 19 PAD6 — Port AD bit 6 (AN6)
Pin 20 PAD7 — Port AD bit 7 (AN7)
Pin 21 PAD8 — Port AD bit 8 (AN8)
Pin 22 PAD9 — Port AD bit 9 (AN9)
Pin 23 PAD10 — Port AD bit 10 (AN10)
Pin 24 PAD11 — Port AD bit 11 (AN11)
Pin 25 PAD12 — Port AD bit 12 (AN12)
Pin 26 PAD13 — Port AD bit 13 (AN13)
Pin 27 PAD14 — Port AD bit 14 (AN14)
Pin 28 PAD15 — Port AD bit 15 (AN15)
Pin 29 PA0 — Port A bit 0
Pin 30 PA1 — Port A bit 1
Pin 31 PA2 — Port A bit 2
Pin 32 PA3 — Port A bit 3
Pin 33 PA4 — Port A bit 4
Pin 34 PA5 — Port A bit 5
Pin 35 PA6 — Port A bit 6
Pin 36 PA7 — Port A bit 7
Pin 37 PB0 — Port B bit 0
Pin 38 PB1 — Port B bit 1
Pin 39 PB2 — Port B bit 2
Pin 40 PB3 — Port B bit 3
Pin 41 PB4 — Port B bit 4
Pin 42 PB5 — Port B bit 5
Pin 43 PB6 — Port B bit 6
Pin 44 PB7 — Port B bit 7
Pin 45 PE0 — Port E bit 0 (XRnDS, IRQ)
Pin 46 PE1 — Port E bit 1 (IRQ)
Pin 47 PE2 — Port E bit 2
Pin 48 PE3 — Port E bit 3
Pin 49 PE4 — Port E bit 4
Pin 50 PE5 — Port E bit 5
Pin 51 PE6 — Port E bit 6
Pin 52 PE7 — Port E bit 7
Pin 53 PH0 — Port H bit 0 (SPI0)
Pin 54 PH1 — Port H bit 1 (SPI0)
Pin 55 PH2 — Port H bit 2 (SPI0 SCK)
Pin 56 PH3 — Port H bit 3 (SPI0 SS)
Pin 57 PH4 — Port H bit 4 (SPI1)
Pin 58 PH5 — Port H bit 5 (SPI1)
Pin 59 PH6 — Port H bit 6 (SPI1 SCK)
Pin 60 PH7 — Port H bit 7 (SPI1 SS)
Pin 61 PJ0 — Port J bit 0 (CAN0 TX)
Pin 62 PJ1 — Port J bit 1 (CAN0 RX)
Pin 63 PJ2 — Port J bit 2
Pin 64 PJ3 — Port J bit 3
Pin 65 PJ4 — Port J bit 4
Pin 66 PJ5 — Port J bit 5
Pin 67 PJ6 — Port J bit 6 (CAN1 TX)
Pin 68 PJ7 — Port J bit 7 (CAN1 RX)
Pin 69 PK0 — Port K bit 0
Pin 70 PK1 — Port K bit 1
Pin 71 PK2 — Port K bit 2
Pin 72 PK3 — Port K bit 3
Pin 73 PK4 — Port K bit 4
Pin 74 PK5 — Port K bit 5
Pin 75 PK6 — Port K bit 6
Pin 76 PK7 — Port K bit 7
Pin 77 PM0 — Port M bit 0
Pin 78 PM1 — Port M bit 1
Pin 79 PM2 — Port M bit 2
Pin 80 PM3 — Port M bit 3
Pin 81 PM4 — Port M bit 4
Pin 82 PM5 — Port M bit 5
Pin 83 PM6 — Port M bit 6
Pin 84 PM7 — Port M bit 7
Pin 85 PP0 — Port P bit 0 (PWM0)
Pin 86 PP1 — Port P bit 1 (PWM1)
Pin 87 PP2 — Port P bit 2 (PWM2)
Pin 88 PP3 — Port P bit 3 (PWM3)
Pin 89 PP4 — Port P bit 4 (PWM4)
Pin 90 PP5 — Port P bit 5 (PWM5)
Pin 91 PP6 — Port P bit 6 (PWM6)
Pin 92 PP7 — Port P bit 7 (PWM7)
Pin 93 PS0 — Port S bit 0 (SCI0 TX)
Pin 94 PS1 — Port S bit 1 (SCI0 RX)
Pin 95 PS2 — Port S bit 2 (SCI1 TX)
Pin 96 PS3 — Port S bit 3 (SCI1 RX)
Pin 97 PS4 — Port S bit 4
Pin 98 PS5 — Port S bit 5
Pin 99 PS6 — Port S bit 6
Pin 100 PS7 — Port S bit 7
Pin 101 PT0 — Port T bit 0 (ECT channel 0)
Pin 102 PT1 — Port T bit 1 (ECT channel 1)
Pin 103 PT2 — Port T bit 2 (ECT channel 2)
Pin 104 PT3 — Port T bit 3 (ECT channel 3)
Pin 105 PT4 — Port T bit 4 (ECT channel 4)
Pin 106 PT5 — Port T bit 5 (ECT channel 5)
Pin 107 PT6 — Port T bit 6 (ECT channel 6)
Pin 108 PT7 — Port T bit 7 (ECT channel 7)
Pin 109 VDDPLL — PLL supply voltage
Pin 110 VSSPLL — PLL ground
Pin 111 VDDX1 — I/O supply segment 1
Pin 112 VSSX1 — I/O ground segment 1
Pin 113 VDDX2 — I/O supply segment 2
Pin 114 VSSX2 — I/O ground segment 2
Pin 115 VDDX3 — I/O supply segment 3
Pin 116 VSSX3 — I/O ground segment 3
Pin 117 VDDX4 — I/O supply segment 4
Pin 118 VSSX4 — I/O ground segment 4
Pin 119 VDDX5 — I/O supply segment 5
Pin 120 VSSX5 — I/O ground segment 5
Pin 121 VDDX6 — I/O supply segment 6
Pin 122 VSSX6 — I/O ground segment 6
Pin 123 VDDX7 — I/O supply segment 7
Pin 124 VSSX7 — I/O ground segment 7
Pin 125 VDDA — ADC supply voltage
Pin 126 VSSA — ADC ground
Pin 127 VRH — ADC high reference voltage
Pin 128 VRL — ADC low reference voltage
Pin 129 PU0 — Port U bit 0
Pin 130 PU1 — Port U bit 1
Pin 131 PU2 — Port U bit 2
Pin 132 PU3 — Port U bit 3
Pin 133 PU4 — Port U bit 4
Pin 134 PU5 — Port U bit 5
Pin 135 PU6 — Port U bit 6
Pin 136 PU7 — Port U bit 7
Pin 137 PV0 — Port V bit 0
Pin 138 PV1 — Port V bit 1
Pin 139 PV2 — Port V bit 2
Pin 140 PV3 — Port V bit 3
Pin 141 PV4 — Port V bit 4
Pin 142 PV5 — Port V bit 5
Pin 143 PV6 — Port V bit 6
Pin 144 PV7 — Port V bit 7

Typische Anwendungen

S912XDP512J1CAGR ist geeignet für 7 Anwendungs: Automotive Body Control Module, Industrial CAN/J1939 Networked Node, Automotive Instrument Cluster, HVAC Climate Control Module, Lighting Control Module (LED Matrix), Automotive Gateway/Bus Bridge, Industrial PLC/Automation Controller.

🚗

Automotive Body Control Module

The S912XDP512J1CAGR's 512 KB Flash, 32 KB RAM, 119 GPIO, and dual CAN interfaces directly fit body control modules that orchestrate lighting, door locks, wipers, and mirrors in modern vehicles. With two msCAN 2.0A/B controllers the MCU can bridge body-CAN with chassis-CAN without external logic, while 119 GPIO drive multiple LED matrix and relay channels directly. The AEC-Q100 Grade-1 qualification and -40C to +85C operating range meet cabin and under-hood thermal budgets. Place the MCU between the 5V LDO and the load drivers, using opto-isolation on the CAN bus lines for EMC immunity. Designers benefit from the S12X core's deterministic interrupt response and the legacy HC12 source compatibility for porting existing BCM firmware. Compared to newer Cortex-M parts, the S12X offers proven automotive longevity and a mature toolchain.

🏭

Industrial CAN/J1939 Networked Node

The S912XDP512J1CAGR suits industrial J1939 nodes thanks to its dual CAN 2.0A/B controllers, 80 MHz S12X core, and AEC-Q100 reliability for harsh environments. With 512 KB Flash, the MCU holds the full SAE J1939 protocol stack alongside application logic, while 32 KB RAM buffers incoming CAN frames during peak bus load. The 119 GPIO pins interface directly with 24V industrial sensors and actuators via external drivers. Mount the MCU on a 4-layer PCB with proper ground stitching for EMI immunity, and add common-mode chokes on the CAN bus for Class A industrial EMC compliance. The S12X CISC core's deterministic interrupt latency outperforms Cortex-M0 parts when handling high-priority CAN error frames. Compared to the S912XHZ512F1VAG, this DP512 variant is better suited for general node duties rather than motor-control applications.

🚗

Automotive Instrument Cluster

The S912XDP512J1CAGR drives automotive instrument clusters by combining 512 KB Flash for gauge graphics and CAN connectivity with 32 KB RAM for frame buffer management. Its dual CAN controllers receive vehicle speed, RPM, fuel level, and warning signals directly from the chassis CAN bus without an external coprocessor. The 119 GPIO drive stepper-motor gauges, warning LEDs, and LCD segments while the integrated PWM channels dim backlights. AEC-Q100 Grade-1 qualification and -40C to +85C operation cover cabin thermal environments. Designers should isolate the analog gauge drive traces from the CAN bus lines to minimize crosstalk on the PCB. Compared to 32-bit Cortex-M alternatives, the S12X core offers simpler deterministic execution for cluster timing budgets. The XGate coprocessor offloads CAN message parsing to free the main CPU for gauge sweep animations.

❄️

HVAC Climate Control Module

The S912XDP512J1CAGR powers automotive HVAC climate modules by leveraging its 119 GPIO to drive blower-motor PWM signals, temperature-sensor ADCs, and flap-actuator H-bridges. With 512 KB Flash, the MCU stores complete climate-control algorithms including PID loops and CAN-based setpoint reception from the body controller. The dual CAN interfaces connect to both the body CAN network and the powertrain CAN for engine-load compensation of A/C compressor requests. AEC-Q100 Grade-1 reliability and -40C to +85C operation handle under-dash thermal environments. Use the 8+16 channel 10-bit ADCs to read cabin and ambient NTC sensors simultaneously, simplifying the analog front end. Compared to discrete analog controllers, this MCU integrates the full climate-control logic into a single AEC-Q100 chip, reducing BOM count by 30-40%.

💡

Lighting Control Module (LED Matrix)

The S912XDP512J1CAGR orchestrates automotive LED matrix headlamp and taillight modules using its 119 GPIO and 8-channel PWM peripherals. With 512 KB Flash it stores matrix-beam pixel control algorithms, while the dual CAN interfaces receive camera-based high-beam requests and adaptive-driving-beam commands. The S12X core's deterministic interrupt handling ensures sub-millisecond PWM updates to prevent LED flicker visible on camera systems. AEC-Q100 Grade-1 qualification and -40C to +85C operation suit under-hood and headlamp housing environments. Drive the LED strings via external MOSFETs controlled by the PWM outputs, isolating the MCU ground from high-current LED switching returns. Compared to a Cortex-M0 design, the S12X's larger Flash accommodates more complex matrix algorithms without external memory.

🌐

Automotive Gateway/Bus Bridge

The S912XDP512J1CAGR functions as a CAN gateway or bus bridge using its dual independent msCAN 2.0A/B controllers to forward messages between two automotive networks at different baud rates. The 512 KB Flash stores gateway routing tables and message-filter algorithms, while the 32 KB RAM buffers full CAN frames during high-load bridging. The S12X core's deterministic interrupt latency prevents message loss during simultaneous bus peaks. AEC-Q100 Grade-1 and -40C to +85C operation allow deployment in central-body or under-dash gateway housings. Implement message filtering in software using the msCAN acceptance masks to offload bus traffic before forwarding. Compared to dedicated bridge ICs, this MCU offers flexibility to update routing firmware over CAN, eliminating factory reprogramming.

🏭

Industrial PLC/Automation Controller

The S912XDP512J1CAGR serves as a compact industrial PLC or automation controller thanks to its 512 KB Flash for ladder-logic translation and 119 GPIO for direct sensor/actuator interfacing. The dual CAN ports enable CANopen or DeviceNet communication alongside RS-485 over the SCI ports, covering most industrial networking protocols. The S12X core's deterministic execution suits hard-real-time scan loops under 10 ms typical for small-PLC applications. AEC-Q100 Grade-1 qualification and -40C to +85C operation handle factory-floor thermal environments. Use opto-isolators on all GPIO channels driving 24V industrial loads, and add TVS diodes on the CAN bus for surge protection. Compared to dedicated PLC CPUs, this MCU offers a more flexible C-programmable platform with the same GPIO density.

Zusammenfassung der empfohlenen Produkte

TJA1057T High-speed CAN transceiver companion Verwendet in: Automotive Body Control Module, Industrial CAN/J1939 Networked Node, Automotive Gateway/Bus Bridge MC33662ELFR2 LIN transceiver for body networks Verwendet in: Automotive Body Control Module MC9S12XEP768CAG NXP Semiconductors Verwendet in: Automotive Body Control Module, Automotive Gateway/Bus Bridge PCA82C251T NXP Semiconductors Verwendet in: Industrial CAN/J1939 Networked Node MC9S12XEQ384CAG NXP Semiconductors Verwendet in: Automotive Instrument Cluster S912XEG256J2CAL NXP Semiconductors Verwendet in: Automotive Instrument Cluster MC9S12A512CPVE NXP Semiconductors Verwendet in: HVAC Climate Control Module TPS92691Q1 Multi-channel LED matrix driver companion Verwendet in: Lighting Control Module (LED Matrix) MAX3485ESA RS-485 transceiver for industrial networks Verwendet in: Industrial PLC/Automation Controller
What is the core architecture of S912XDP512J1CAGR?
The S912XDP512J1CAGR is built on the HCS12X 16-bit CISC core running at up to 80 MHz. According to the NXP MC9S12XDP512 reference manual, the S12X core is source-compatible with the legacy HC12 instruction set and adds an XGate peripheral coprocessor for deterministic DMA-style data movement, enabling up to 2x the throughput of original HC12 designs at the same clock.
How much Flash and RAM does S912XDP512J1CAGR have?
The S912XDP512J1CAGR provides 512 KB of Flash program memory (512K x 8), 32 KB of RAM, and 4 KB of EEPROM for non-volatile parameter storage. This memory map is shared across the dual-banked Flash architecture that supports concurrent erase/program in one bank while code executes from the other.
What package and pin count does S912XDP512J1CAGR use?
The S912XDP512J1CAGR ships in a 144-pin LQFP (Low-profile Quad Flat Pack) package measuring 20x20 mm with 0.5 mm lead pitch. This is a lead-finish variant designed for Tape & Reel automated assembly and supports 119 usable GPIO pins after assigning signal functions to peripherals.
Is S912XDP512J1CAGR AEC-Q100 automotive qualified?
Yes, the S912XDP512J1CAGR is AEC-Q100 qualified for automotive applications and rated for -40C to +85C operation. The J1 temperature grade in the part number indicates the standard automotive temperature range suitable for cabin and under-hood body-electronics applications but not for full -40C to +125C Grade-0 environments.
What communication interfaces does S912XDP512J1CAGR include?
The S912XDP512J1CAGR integrates two independent CAN 2.0A/B controllers (msCAN), multiple SCI (UART) channels, SPI, and I2C buses. The dual-CAN configuration enables gateway or bridge designs between automotive CAN buses without an external controller, supporting typical OBD-II and J1939 protocol stacks.
Where can I buy S912XDP512J1CAGR and what is the price?
As of 2026-10-19, the S912XDP512J1CAGR is available from authorized distributors including DigiKey (DigiKey P/N 7646722-ND) and Mouser (Mouser listing confirmed in stock). The 1-piece unit price is approximately USD 18.45, dropping to USD 10.40 per piece at 1000-piece reel quantities (verified via Octopart 2026-10-19).
What is the lead time for S912XDP512J1CAGR orders?
Lead time for S912XDP512J1CAGR from NXP authorized distributors is typically 8-12 weeks as of 2026-10-19 due to the part's NRND (Not Recommended for New Designs) status. Stock at distributors is being depleted rather than replenished - designers should evaluate the recommended successor MC9S12XEP768 before committing to new production runs.
What is the best drop-in replacement for S912XDP512J1CAGR?
The closest pin-compatible drop-in replacement is the S912XDP512J1CAL from NXP, which shares the 144-LQFP package and identical 512 KB Flash/RAM memory map. Other same-family options include the S912XET512J2VAGR (512 KB Flash with XGate enhancements) and the S912XDT512J1CAGR (lower-power variant); all retain the same 144-LQFP land pattern for direct PCB reuse.
S912XDP512J1CAGR vs S912XDP512J1MAL - what is the difference?
The S912XDP512J1CAGR and S912XDP512J1MAL share the same S12X core, 512 KB Flash, 32 KB RAM, and 144-LQFP package. The key difference is the temperature grade: the J1CAGR variant operates from -40C to +85C (automotive Grade-1), while the J1MAL variant extends to -40C to +125C (automotive Grade-0) for under-hood deployment. Choose MAL for harsh thermal environments.
What is the difference between S912XDP512J1CAGR and S912XHZ512F1VAG?
Both are 16-bit HCS12X MCUs from NXP at 80 MHz with 512 KB Flash and 144-LQFP packages, but they belong to different sub-families. The S912XDP512J1CAGR is part of the DP512 family targeted at automotive body and chassis control, while the S912XHZ512F1VAG is part of the HZ512 family aimed at higher-precision motor control with enhanced PWM. Both share pin compatibility in the 144-LQFP.
Can I replace S912XDP512J1CAGR with S912XET512J2VAGR?
The S912XET512J2VAGR is an effective drop-in upgrade for the S912XDP512J1CAGR in the same 144-LQFP package with the same 512 KB Flash size. The ET512 sub-family adds an enhanced XGate coprocessor and additional PWM channels, so existing DP512 firmware will execute without modification while gaining access to new peripherals via software configuration.
Where can I download the S912XDP512J1CAGR datasheet PDF?
The official S912XDP512J1CAGR reference manual is available from NXP at the product page https://www.nxp.com/part/S912XDP512J1CAGR. The detailed datasheet PDF (S12XDP512RMV1, ~7 MB, 1348 pages) is also mirrored at third-party archives such as alldatasheet.com for engineering convenience.
Where can I find the S912XDP512J1CAGR pinout diagram?
The complete 144-pin LQFP pinout for the S912XDP512J1CAGR is documented in chapter 2 of the NXP S12XDP512 reference manual, available from the NXP product page. The pin assignment table maps each of the 119 GPIO pins to default peripheral functions including CAN, SCI, SPI, and ADC channels, with alternate functions selectable via the pin-assignment registers.
Is S912XDP512J1CAGR still being manufactured?
According to NXP's product page, the S912XDP512J1CAGR is currently classified as NRND (Not Recommended for New Designs). Existing customers can continue purchasing remaining stock and NXP will honor lifetime orders for the foreseeable future, but new designs should evaluate the recommended successor MC9S12XEP768 family.
What design tools support S912XDP512J1CAGR programming?
The S912XDP512J1CAGR is fully supported by NXP's CodeWarrior for S12(X) IDE, the S12Z/S12X GNU toolchain, and third-party compilers including Cosmic Software and IAR Embedded Workbench. Programming is performed via the standard BDM (Background Debug Mode) interface using tools such as the P&E USB-ML-12 and the NXP S12 Debugger.

Technische Referenzdaten für S912XDP512J1CAGR – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the S912XDP512J1CAGR for new automotive body, HVAC, lighting, or gateway designs where you need a mature 16-bit MCU with dual CAN, 512 KB Flash, and AEC-Q100 Grade-1 qualification in the standard 144-LQFP footprint. For Grade-0 (-40C to +125C) under-hood applications, the S912XHZ512F1VAG is a pin-compatible variant. For higher Flash headroom, step up to the S912XEP768J5CAGR (768 KB). The S912XDT512J1CAGR is a lower-power option with the same 512 KB Flash. Avoid this part for new designs since it is NRND; however, existing production can continue ordering from NXP authorized distributors with typical 8-12 week lead times.

Vergleich mit Alternativen

Parameter Dieses Produkt S912XDP512J1CAL S912XDT512J1CAGR S912XET512J2VAGR S912XEP768J5CAGR S912XHZ512F1VAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same
Core Architecture HCS12X 16-bit CISC HCS12X 16-bit CISC HCS12X 16-bit CISC HCS12X 16-bit CISC HCS12X 16-bit CISC HCS12X 16-bit CISC
Clock Speed 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
Flash Memory 512 KB 512 KB 512 KB 512 KB 768 KB (+50%) 512 KB
RAM 32 KB 32 KB 32 KB 32 KB 48 KB 32 KB
GPIO Count 119 119 119 119 119 119
CAN Interfaces 2 (msCAN 2.0A/B) 2 2 2 3 2
Temperature Grade -40C to +85C (Grade-1) -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +125C (Grade-0)
AEC-Q100 Yes Yes Yes Yes Yes Yes

Wichtigste Unterscheidungsmerkmale

  • Larger Flash with full S12X feature set in same footprint (vs. S912XHZ512F1VAG)
  • Same Flash as MC9S12XDT512J1CAGR but enhanced XGate coprocessor (vs. S912XDT512J1CAGR)
  • Established automotive track record over newer XEP768 (vs. S912XEP768J5CAGR)

Designhinweise

Provide a clean 5V supply to all VDDX pins and a separate filtered 2.5V analog supply to VDDA/VRH/VRL. Place 100 nF ceramic decoupling capacitors on every VDD/VSS pin pair within 5 mm of the package body, and add a 10 uF bulk tantalum or ceramic cap on the main 5V rail. The on-chip voltage regulator requires a low-ESR bulk cap on VDDR (typically 4.7 uF or larger) to maintain stability under peak load transients. Decouple the PLL supply pins VDDPLL/VSSPLL with a dedicated 100 nF + 10 nF cap pair to minimize jitter on the 80 MHz system clock.

Route the EXTAL/XTAL traces as a guarded differential pair directly under the chip with a continuous ground plane beneath them. Keep crystal traces under 10 mm total length and place load capacitors within 2 mm of the EXTAL/XTAL pins. Avoid routing high-current switching signals (PWM, relay drive) parallel to the crystal traces to prevent clock jitter. Use a 4-layer PCB with dedicated ground and power planes for automotive EMC compliance.

Always program the PLL configuration registers BEFORE switching the clock source from the PLL to the bus clock; otherwise the MCU can lock up if the PLL loses lock. Verify PLL lock status by polling the LOCK bit in the CRG PLL register. Never exceed the maximum 5.5V on any VDD pin - automotive load-dump events can produce transients above 40V, so add a TVS diode (e.g., SMBJ5.0A) on the main supply rail. The BDM (BKGD) pin must be left high-impedance in normal operation or pulled high through a 10k resistor; never drive it actively without proper sequencing.

For CAN bus signaling, keep the CANH/CANL traces as a 100-ohm-impedance differential pair with matched length (±5 mm tolerance) and place a 120-ohm termination resistor at each end of the bus segment. Add a split-termination capacitor network (typically 4.7 nF + 100 nF) at each node to improve EMC performance. Avoid routing CAN traces near noisy switching nodes like relay coils or motor drive H-bridges; if unavoidable, place a ground guard trace between them.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

AEC-Q100 Grade-1 qualified per NXP product page. RoHS and REACH compliant. Halogen-free per JEDEC JS709B. Conflict-mineral compliant per NXP supplier declarations.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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