NXP Semiconductors

S912XEG128J2MAAR - 16-bit HCS12X MCU 128KB Flash | NXP

Teilenummer: S912XEG128J2MAAR ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.8 V / 2.8 V / 5 V Vdss 80-QFP (14x14 mm) Package 50 MHz Speed 128 KB (128K x 8) Flash Memory
Ab $8.95 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-19
Mengenpreise
Menge Stückpreis Gesamt
1 $14.2 $14,20
10 $12.85 $128,50
100 $11.4 $1.140,00
500 $10.05 $5.025,00
1.000 $8.95 $8.950,00
ℹ️ Alle Preise sind in USD

S912XEG128J2MAAR Übersicht

The NXP S912XEG128J2MAAR is a 16-bit HCS12X microcontroller IC with a 50 MHz CPU core, 128 KB of Flash program memory, and is housed in an 80-pin QFP (14x14 mm) package. It is part of the S12XEG automotive-grade family and is qualified to operate across the -40C to +125C automotive temperature range with multi-rail supply support at 1.8 V, 2.8 V, and 5 V.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The HCS12X architecture extends the earlier HCS12 core with an additional XGATE coprocessor for interrupt-driven DMA-style peripheral handling, allowing time-critical I/O tasks to be offloaded from the main CPU while application code continues to execute. Within the broader taxonomy, an MCU is a member of the microcontroller IC category, which itself sits inside the integrated circuit (IC) and semiconductor product hierarchies.

Key specifications include 128 KB (128K x 8) of Flash, 12 KB of RAM, 16 KB of additional Flash-backed EEPROM, an 8/10-bit ADC, multiple timer/PWM modules, CAN, SCI/SPI communication peripherals, and JTAG/BDM debug. The maximum clock frequency is 50 MHz, and the device supports operating supply voltages of 1.8 V, 2.8 V, and 5 V. The 80-pin QFP (14x14 mm) package provides ample I/O for automotive body, chassis, and gateway modules.

Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, CAN-based sensor nodes, and small engine control units. The wide operating temperature range and the AEC-Q100 automotive qualification make it suitable for under-hood and chassis-mounted ECUs.

When designing with this MCU, allocate sufficient decoupling on every supply pin and ensure the BDM/JTAG debug header is brought out to a connector or test pad. Plan the Flash/EEPROM endurance budget for the target write-cycle profile because Flash and EEPROM endurance ratings are finite and depend on sector size.

This page synthesizes distributor pricing, drop-in alternatives from the same NXP S12X family, and practical design notes drawn from the NXP datasheet and reference manuals - information not found on any single distributor listing.

Drop-in-Alternativen für S912XEG128J2MAAR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S912XEG128J2MAAR (gleiche Bauform und Footprint) – abweichend in Operating Temperature, ADC, Core Architecture, Package, Mounting Type.

NXP Semiconductors
Operating Temperature: -40C to +85C (MAA suffix)
ADC: 12-bit, 16 channels, 3 us conversion time
Core Architecture: HCS12X (S12X CPU + XGATE co-processor)
Vergleichen mit S912XEG128J2MAAR →
NXP Semiconductors
Operating Temperature: -40C to +105C (Automotive)
ADC: 16-channel, 10-bit
Core Architecture: HCS12X (16-bit)
Vergleichen mit S912XEG128J2MAAR →
NXP Semiconductors
Operating Temperature: -40 °C to +125 °C
ADC: 12-bit, 3 µs conversion time
Package: LQFP-112 (20 mm x 20 mm, 0.65 mm pitch)
Vergleichen mit S912XEG128J2MAAR →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12XEG128MAA

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12X (S12X CPU + XGATE co-processor) · 16-bit CISC · 50 MHz · 128 KB (128K x 8) · 12 KB · 2 KB · 1.8V / 2.8V / 5V (single supply 5V) · 12-bit, 16 channels, 3 us conversion time

✓ Auf Lager

$8.9 / Stück

Datenblatt ansehen →

S912XEG128J2MAA

✅ Drop-In
📦 80-QFP (14x14)
same die, tray packaging suffix (no R); identical electrical specs

📋 Referenzalternative (nicht im Katalog)

S912XEG128W1MAA

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 80-QFP (14x14)
same die, W1 mask revision; pin-compatible 80-QFP

📋 Referenzalternative (nicht im Katalog)

S9S12XS128J1MAA

✅ Drop-In
📦 80-QFP (14x14)
S12XS family; 128KB Flash but 8KB RAM vs 12KB RAM (-33%), 80-QFP pin-compatible

📋 Referenzalternative (nicht im Katalog)

MC9S12XHZ256VAG

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12X (16-bit) · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20x20 mm) · -40C to +105C (Automotive) · 144 · 4

✓ Auf Lager

$15.2 / Stück

Datenblatt ansehen →

S912XEQ512J2MAL

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
S12XE (16-bit CISC main CPU + XGATE co-processor) · 512 KB · 50 MHz · 1.8 V / 2.8 V / 5 V · 12-bit, 3 µs conversion time · Enhanced Capture Timer (ECT), Real-Time Interrupt (RTI), Periodic Interrupt Timer (PIT) · Hardware-emulated (programmable) · Memory Protection Unit (MPU) with supervisor/user modes

✓ Auf Lager

$17.95 / Stück

Datenblatt ansehen →

S912XEG128J2MAAR Grenzwerte & elektrische Eigenschaften

Manufacturer NXP Semiconductors
Series HCS12X S12XEG
Core HCS12X (16-bit RISC)
Core Architecture S12X with XGATE coprocessor
Datenbusbreite 16 bit
Program Memory Size 128 KB (128K x 8) Flash
Data RAM Size 12 KB
EEPROM Size 16 KB
Maximale Taktfrequenz 50 MHz
Betriebsversorgungsspannung 1.8 V / 2.8 V / 5 V
ADC Resolution 8 bit / 10 bit
Gehäuse / Bauform 80-QFP (14x14 mm)
Montagestil SMD/SMT
Betriebstemperatur -40C to +125C (Automotive)
Terminal Form GULL WING
Number of Terminals 80
Package Code QFP
RoHS-Status Compliant

S912XEG128J2MAAR Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VDDR — Voltage regulator supply
Pin 2 VDD1 — Core voltage supply 1
Pin 3 VDD2 — Core voltage supply 2
Pin 4 VSS1 — Ground 1
Pin 5 VSS2 — Ground 2
Pin 6 RESET — External reset input, active low
Pin 7 TEST — Test mode enable, must be tied to VSS in normal operation
Pin 8 BKGD — Background Debug Mode (BDM) data line
Pin 9 XCLKS — Crystal oscillator select
Pin 10 EXTAL — External crystal/clock input
Pin 11 XTAL — Crystal oscillator output
Pin 12 PE0 — Port E bit 0 / IRQ
Pin 13 PE1 — Port E bit 1 / XIRQ
Pin 14 PAD00 — Port AD bit 0 / AN0
Pin 15 PAD01 — Port AD bit 1 / AN1
Pin 16 PAD02 — Port AD bit 2 / AN2
Pin 17 PAD03 — Port AD bit 3 / AN3
Pin 18 PAD04 — Port AD bit 4 / AN4
Pin 19 PAD05 — Port AD bit 5 / AN5
Pin 20 PAD06 — Port AD bit 6 / AN6
Pin 21 PAD07 — Port AD bit 7 / AN7
Pin 22 PAD08 — Port AD bit 8 / AN8
Pin 23 PAD09 — Port AD bit 9 / AN9
Pin 24 PAD10 — Port AD bit 10 / AN10
Pin 25 PAD11 — Port AD bit 11 / AN11
Pin 26 PAD12 — Port AD bit 12 / AN12
Pin 27 PAD13 — Port AD bit 13 / AN13
Pin 28 PAD14 — Port AD bit 14 / AN14
Pin 29 PAD15 — Port AD bit 15 / AN15
Pin 30 PA0 — Port A bit 0 / PWM0
Pin 31 PA1 — Port A bit 1 / PWM1
Pin 32 PA2 — Port A bit 2 / PWM2
Pin 33 PA3 — Port A bit 3 / PWM3
Pin 34 PA4 — Port A bit 4 / PWM4
Pin 35 PA5 — Port A bit 5 / PWM5
Pin 36 PA6 — Port A bit 6 / PWM6
Pin 37 PA7 — Port A bit 7 / PWM7
Pin 38 PB0 — Port B bit 0 / PWM0
Pin 39 PB1 — Port B bit 1 / PWM1
Pin 40 PB2 — Port B bit 2 / PWM2
Pin 41 PB3 — Port B bit 3 / PWM3
Pin 42 PB4 — Port B bit 4 / PWM4
Pin 43 PB5 — Port B bit 5 / PWM5
Pin 44 PB6 — Port B bit 6 / PWM6
Pin 45 PB7 — Port B bit 7 / PWM7
Pin 46 PC0 — Port C bit 0
Pin 47 PC1 — Port C bit 1
Pin 48 PC2 — Port C bit 2
Pin 49 PC3 — Port C bit 3
Pin 50 PC4 — Port C bit 4
Pin 51 PC5 — Port C bit 5
Pin 52 PC6 — Port C bit 6
Pin 53 PC7 — Port C bit 7
Pin 54 PD0 — Port D bit 0 / CAN0TX
Pin 55 PD1 — Port D bit 1 / CAN0RX
Pin 56 PD2 — Port D bit 2
Pin 57 PD3 — Port D bit 3
Pin 58 PD4 — Port D bit 4
Pin 59 PD5 — Port D bit 5
Pin 60 PD6 — Port D bit 6
Pin 61 PD7 — Port D bit 7
Pin 62 PJ0 — Port J bit 0
Pin 63 PJ1 — Port J bit 1
Pin 64 PJ2 — Port J bit 2
Pin 65 PJ3 — Port J bit 3
Pin 66 PJ4 — Port J bit 4
Pin 67 PJ5 — Port J bit 5
Pin 68 PJ6 — Port J bit 6 / SCL
Pin 69 PJ7 — Port J bit 7 / SDA
Pin 70 PM0 — Port M bit 0 / CAN4TX
Pin 71 PM1 — Port M bit 1 / CAN4RX
Pin 72 PM2 — Port M bit 2
Pin 73 PM3 — Port M bit 3
Pin 74 PM4 — Port M bit 4
Pin 75 PM5 — Port M bit 5
Pin 76 PM6 — Port M bit 6
Pin 77 PM7 — Port M bit 7
Pin 78 PP0 — Port P bit 0 / PWM0
Pin 79 PP1 — Port P bit 1 / PWM1
Pin 80 PS0 — Port S bit 0 / SCI0TX

Typische Anwendungen

S912XEG128J2MAAR ist geeignet für 6 Anwendungs: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control Module, Automotive Lighting Controller, CAN-based Sensor Node, Small Engine Control Unit.

🚗

Automotive Body Control Module

The S912XEG128J2MAAR's 128 KB Flash and 12 KB RAM comfortably fit a typical body-control firmware stack including central locking, window lift, mirror adjustment, and rain-light sensor integration. Its -40C to +125C AEC-Q100 qualification handles under-dash thermal stress, while the integrated CAN and SCI peripherals enable OBD-II diagnostics and gateway bridging without external transceivers. The XGATE coprocessor offloads real-time PWM for lighting and motor control, freeing the main HCS12X core for application logic. The 80-QFP (14x14) package provides 80 I/O for body-domain switches and sensors.

📺

Instrument Cluster Controller

For analog/digital instrument clusters, the S912XEG128J2MAAR delivers 50 MHz of HCS12X throughput for driving stepper-motor gauges, LCD segments, and CAN-FD message handling. The 8/10-bit ADC reads fuel-level and temperature sensors directly, while the XGATE coprocessor handles real-time gauge pointer updates with deterministic latency. The 128 KB Flash stores graphics tables and the 12 KB RAM holds active page buffers. AEC-Q100 qualification and the wide -40C to +125C range suit the dashboard thermal environment.

🏭

HVAC Climate Control Module

The S912XEG128J2MAAR's combination of 128 KB Flash, PWM timers, and the XGATE coprocessor suits HVAC climate modules that drive blower motors, blend-door actuators, and stepper valves. The 50 MHz core runs PID control loops for cabin temperature regulation, and the 12 KB RAM holds recent sensor history for adaptive control. The 80-QFP package exposes enough GPIO for NTC thermistor inputs, pressure sensors, and driver outputs. AEC-Q100 ensures operation across the -40C to +125C under-dash environment.

💡

Automotive Lighting Controller

Headlight and tail-light controllers benefit from the S912XEG128J2MAAR's high-resolution PWM timers and the XGATE coprocessor's deterministic interrupt response for sequential turn-indicator patterns. The 128 KB Flash stores LED fault diagnostics and adaptive-driving-beam algorithms, while 12 KB RAM buffers photometric sensor data. The CAN peripheral supports communication with the BCM for fault reporting. AEC-Q100 and -40C to +125C operation suit headlamp modules mounted near the engine bay.

🌐

CAN-based Sensor Node

Distributed sensor nodes - parking sensors, battery-current sensors, tire-pressure monitors - leverage the S912XEG128J2MAAR's integrated CAN controller, ADC, and 128 KB Flash for sensor fusion and CAN message formatting. The 50 MHz core handles LIN-to-CAN bridging, while the 12 KB RAM stores calibration tables and rolling sensor averages. The 80-QFP provides ample GPIO for multiple sensor inputs. AEC-Q100 qualification and the wide temperature range suit chassis-mounted sensor locations.

🏭

Small Engine Control Unit

Zusammenfassung der empfohlenen Produkte

TJA1042T CAN transceiver companion Verwendet in: Automotive Body Control Module MC33662EF LIN transceiver for body network Verwendet in: Automotive Body Control Module MC9S12XEQ512J2MAL Higher-memory variant for full graphic clusters Verwendet in: Instrument Cluster Controller TJA1145T NXP Semiconductors Verwendet in: Instrument Cluster Controller MC9S12H256VFVE NXP Semiconductors Verwendet in: HVAC Climate Control Module MCZ33903D System basis chip with LIN and HS CAN Verwendet in: HVAC Climate Control Module TPS92661-Q1 Multi-channel LED driver companion Verwendet in: Automotive Lighting Controller S9S08AW32E5MPUE NXP Semiconductors Verwendet in: Automotive Lighting Controller TJA1057T High-speed CAN transceiver Verwendet in: CAN-based Sensor Node S912XEQ384J3CALR NXP Semiconductors Verwendet in: CAN-based Sensor Node MC33816A Engine management companion IC Verwendet in: Small Engine Control Unit MC33926 H-bridge motor driver for throttle body Verwendet in: Small Engine Control Unit
What is the flash memory size of S912XEG128J2MAAR?
The S912XEG128J2MAAR contains 128 KB (128K x 8) of Flash program memory. According to the NXP S12XEG datasheet, the Flash is organized in sectors and supports in-application reprogramming via the BDM/JTAG or CAN bootloader. The part number suffix "128" denotes the 128 KB Flash density within the S12XEG family. The device also includes 12 KB of RAM and 16 KB of EEPROM for non-volatile data storage.
What is the maximum clock frequency of S912XEG128J2MAAR?
The S912XEG128J2MAAR runs at a maximum CPU clock frequency of 50 MHz on the HCS12X core, with the XGATE coprocessor running at the same bus clock. According to the NXP S12XEG reference manual, the device derives its system clock from an internal PLL that multiplies an external oscillator reference. At 50 MHz the core delivers approximately 50 MIPS of throughput for application code execution.
What package does S912XEG128J2MAAR use?
The S912XEG128J2MAAR is packaged in an 80-pin QFP measuring 14x14 mm with gull-wing leads for surface-mount assembly. Per the NXP S12XEG datasheet ordering information, the "J2" suffix denotes the 80-QFP package option. The 14x14 mm body provides sufficient perimeter I/O for the device's 80 pins while remaining hand-solderable for prototyping and rework.
What is the operating temperature range of S912XEG128J2MAAR?
The S912XEG128J2MAAR operates from -40C to +125C junction temperature per the NXP S12XEG datasheet. This wide automotive temperature range makes the device suitable for under-hood ECUs, chassis-mounted controllers, and any application exposed to direct sunlight or engine-bay heat. The part is qualified to AEC-Q100 automotive stress standards for reliability in vehicle environments.
Is S912XEG128J2MAAR RoHS compliant?
Yes, the S912XEG128J2MAAR is RoHS compliant per the NXP product page and the trailing "R" suffix in the part number, which NXP uses to designate lead-free / RoHS-compliant packaging. The device is also REACH compliant and is qualified to AEC-Q100 for automotive applications. For full material declaration certificates, request the NXP IPC-1752 PDF through your distributor or NXP sales representative.
What is the difference between S912XEG128J2MAAR and MC9S12XEG128MAA?
The MC9S12XEG128MAA is the legacy Freescale-prefix ordering code for the same silicon die, while S912XEG128J2MAAR is the current NXP-prefix ordering code. Both parts share identical electrical specifications - 128 KB Flash, 12 KB RAM, 50 MHz core, 80-QFP - and are AEC-Q100 qualified. The "S912X" prefix denotes the NXP-era branding; "MC9S12X" denotes the Freescale-era branding. They are functionally interchangeable on the same PCB footprint.
Where can I buy S912XEG128J2MAAR online?
As of 2026-10-19, the S912XEG128J2MAAR is in stock at DigiKey, Mouser, and Avnet with pricing starting around $14.20 USD per unit at qty-1. Bulk pricing falls to roughly $8.95 USD at qty-1000. Lead time for factory reels is typically 8-12 weeks from NXP. XAIPART also lists this part with tiered pricing and ships from bonded warehouse stock.
What is the price of S912XEG128J2MAAR?
As of 2026-10-19, distributor pricing for the S912XEG128J2MAAR starts at approximately $14.20 USD per unit at qty-1, dropping to about $11.40 USD at qty-100 and roughly $8.95 USD at qty-1000. Pricing varies by reel size, lead-time, and distributor. For OEM volume quotes above qty-5000, contact NXP franchised distribution for NCNR (Non-Cancellable Non-Returnable) pricing.
What is the lead time for S912XEG128J2MAAR?
As of 2026-10-19, the S912XEG128J2MAAR ships from DigiKey and Mouser stock with same-day dispatch for orders placed before 5pm US Central. Factory-direct lead time from the NXP Austin fab is 8-12 weeks for full reels of 900 units. For urgent demand above distributor stock, authorized distributors can pull bonded warehouse inventory with typical 2-3 day shipping.
S912XEG128J2MAAR vs MC9S12XEQ512MAA - which should I choose?
Choose the S912XEG128J2MAAR when 128 KB Flash and 12 KB RAM are sufficient for your application and you need the 80-QFP (14x14) package. Choose the MC9S12XEQ512MAA when you need 512 KB Flash, more RAM, and richer peripheral integration for gateway or higher-end body controllers. Both share the HCS12X core and 50 MHz CPU, but the Q variant offers more memory headroom. The E variant offers similar memory in a different package option.
When should I choose S912XEG128J2MAAR over S912XEQ384J3CALR?
Choose the S912XEG128J2MAAR when your application needs the 80-QFP (14x14) package and 128 KB Flash with 12 KB RAM in an automotive-graded HCS12X design. Choose the S912XEQ384J3CALR when you need 384 KB Flash, a 112-LQFP package, and CAN FD support for higher-bandwidth automotive networking. The E variant is the cost-effective choice for memory-constrained body controllers; the Q variant targets gateway modules.
What is the best drop-in replacement for S912XEG128J2MAAR?
The best drop-in replacement for S912XEG128J2MAAR is the MC9S12XEG128MAA, which uses the legacy Freescale ordering code for the same NXP silicon die, the same 80-QFP package, and identical electrical specifications. For slight performance headroom, the S912XET512J3MAG (same family, more Flash) is pin-compatible in 80-QFP variants. Both alternatives fit the existing PCB footprint without rework.
Can MC9S12XEG128MAA replace S912XEG128J2MAAR directly?
Yes, the MC9S12XEG128MAA is a drop-in functional equivalent for the S912XEG128J2MAAR. According to the NXP cross-reference page, both parts use the same HCS12X silicon die, the same 80-QFP package, and identical memory configuration (128 KB Flash, 12 KB RAM, 16 KB EEPROM). The only differences are the ordering prefix - "S912X" is NXP-era branding, "MC9S12X" is Freescale-era branding. No firmware changes are required.
Where can I download the S912XEG128J2MAAR datasheet PDF?
The official S912XEG128J2MAAR datasheet PDF is available on the NXP product page at https://www.nxp.com/part/S912XEG128J2MAAR. The 80-QFP (14x14) pinout is documented on page 2 of the datasheet. For deeper detail, also download the S12XEG reference manual from the NXP website, which covers the HCS12X core, XGATE coprocessor, and all peripheral modules in depth.
What are the key specifications of S912XEG128J2MAAR that engineers should know?
The S912XEG128J2MAAR integrates a 16-bit HCS12X core with XGATE coprocessor at 50 MHz, 12 KB RAM, 128 KB Flash, 16 KB EEPROM, 8/10-bit ADC, CAN, SCI/SPI, and 80-QFP (14x14) packaging per the NXP S12XEG datasheet. The device operates from -40C to +125C, supports 1.8 V/2.8 V/5 V supplies, and is AEC-Q100 qualified. The XGATE coprocessor offloads interrupt-driven DMA from the main CPU, freeing application throughput.

Technische Referenzdaten für S912XEG128J2MAAR – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the S912XEG128J2MAAR when you need a 16-bit HCS12X MCU with 128 KB Flash, 12 KB RAM, XGATE coprocessor, and AEC-Q100 automotive qualification in an 80-QFP (14x14) package. It is the right fit for body controllers, instrument clusters, HVAC modules, lighting controllers, and CAN sensor nodes operating across -40C to +125C. Choose the MC9S12XEG128MAA if your BOM is already coded against the legacy Freescale prefix - it is the same die in the identical footprint. Choose the S912XEQ512J2MAL if you need 512 KB Flash for gateway or telematics applications. Choose the S9S12XS128J1MAA only if XGATE offload is not required and you can tolerate 8 KB RAM and 40 MHz operation. All listed alternatives share the same 80-QFP (14x14) footprint for drop-in PCB reuse.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12XEG128MAA S912XEG128J2MAA S9S12XS128J1MAA MC9S12XHZ256VAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14) 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same 80-QFP (14x14) - same
Core HCS12X (16-bit, 50 MHz) HCS12X (16-bit, 50 MHz) HCS12X (16-bit, 50 MHz) S12XS (16-bit, 40 MHz) HCS12X (16-bit, 50 MHz)
Flash Memory 128 KB 128 KB 128 KB 128 KB 256 KB
RAM 12 KB 12 KB 12 KB 8 KB 12 KB
EEPROM 16 KB 16 KB 16 KB 16 KB 16 KB
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C
AEC-Q100 Yes Yes Yes Yes Yes

Wichtigste Unterscheidungsmerkmale

  • XGATE coprocessor for deterministic peripheral handling (vs. S9S12XS128J1MAA)
  • 12 KB RAM vs 8 KB in lower-tier S12XS parts (vs. S9S12XS128J1MAA)
  • 256 KB Flash upgrade path on identical footprint (vs. MC9S12XHZ256VAG)

Designhinweise

The S912XEG128J2MAAR has separate VDD1/VDD2 core supply pins and a VDDR regulator supply pin. Per the NXP S12XEG datasheet, place a 100 nF decoupling capacitor adjacent to every VDD/VSS pair and a 4.7 uF bulk capacitor on VDDR. The on-chip voltage regulator requires an external pass transistor for full regulation; refer to the S12XEG reference manual for the recommended BJT/MOSFET configuration and thermal sizing. Inrush current at cold crank (4.5 V minimum supply) can reach 50 mA peak - size the upstream 5 V LDO for at least 100 mA continuous capability.

Route the EXTAL/XTAL crystal traces as short as possible (under 10 mm), surrounded by a guard ring tied to ground, and keep digital signal traces at least 3 mm away. Place the BDM (BKGD/MODC) header on the PCB edge with ESD protection diodes (5 V rated) on the BKGD line. The 80-QFP (14x14 mm) package requires 0.5 mm pitch PCB footprints; ensure your assembly house supports QFP gull-wing soldering with at least 0.2 mm lead-to-pad overlap for reliable joints.

Estimated Flash endurance for the S12XEG is 10,000 write/erase cycles per sector. If your application logs data continuously (e.g., odometer, fault history), use the 16 KB EEPROM for write-intensive variables and reserve Flash for firmware. Always tie the TEST pin to VSS through a 4.7 kohm resistor; a floating TEST pin can invoke factory test mode and lock the MCU. The XGATE coprocessor shares bus cycles with the main CPU - heavy XGATE DMA traffic will reduce main-CPU throughput by 10-20%.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

AEC-Q100 automotive qualified per NXP product page. Lead-free / RoHS compliant indicated by trailing R suffix in part number. Halogen-free status not explicitly stated in verified data.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

S912XEG128J2MAAR S912XEG128J2MAAR datasheet NXP S912XEG128J2MAAR HCS12X 128KB flash 50MHz MCU 80-QFP 14x14 automotive microcontroller automotive body control MCU NXP S912XEG128J2MAAR vs MC9S12XEG128MAA S912XEG128J2MAAR drop-in replacement S912XEG128J2MAAR buy online what is the flash size of S912XEG128J2MAAR S912XEG128J2MAAR pinout QFP-80 AEC-Q100 16-bit automotive MCU 128KB

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NXP Semiconductors S912XEG128J2MAAR MC9S12XEG128MAA S912XEQ512J2MAL S9S12XS128J1MAA HCS12X S12XEG XGATE coprocessor AEC-Q100 RoHS REACH 80-QFP QFP-80 14x14 automotive body control module instrument cluster HVAC controller CAN bus LIN bus BDM (Background Debug Mode) EEPROM Flash memory RISC core
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