S912XEG128J2MAAR - 16-bit HCS12X MCU 128KB Flash | NXP
Référence : S912XEG128J2MAAR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.85 | $128,50 |
| 100 | $11.4 | $1 140,00 |
| 500 | $10.05 | $5 025,00 |
| 1 000 | $8.95 | $8 950,00 |
S912XEG128J2MAAR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The HCS12X architecture extends the earlier HCS12 core with an additional XGATE coprocessor for interrupt-driven DMA-style peripheral handling, allowing time-critical I/O tasks to be offloaded from the main CPU while application code continues to execute. Within the broader taxonomy, an MCU is a member of the microcontroller IC category, which itself sits inside the integrated circuit (IC) and semiconductor product hierarchies.
Key specifications include 128 KB (128K x 8) of Flash, 12 KB of RAM, 16 KB of additional Flash-backed EEPROM, an 8/10-bit ADC, multiple timer/PWM modules, CAN, SCI/SPI communication peripherals, and JTAG/BDM debug. The maximum clock frequency is 50 MHz, and the device supports operating supply voltages of 1.8 V, 2.8 V, and 5 V. The 80-pin QFP (14x14 mm) package provides ample I/O for automotive body, chassis, and gateway modules.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, CAN-based sensor nodes, and small engine control units. The wide operating temperature range and the AEC-Q100 automotive qualification make it suitable for under-hood and chassis-mounted ECUs.
When designing with this MCU, allocate sufficient decoupling on every supply pin and ensure the BDM/JTAG debug header is brought out to a connector or test pad. Plan the Flash/EEPROM endurance budget for the target write-cycle profile because Flash and EEPROM endurance ratings are finite and depend on sector size.
This page synthesizes distributor pricing, drop-in alternatives from the same NXP S12X family, and practical design notes drawn from the NXP datasheet and reference manuals - information not found on any single distributor listing.
Alternatives de remplacement direct pour S912XEG128J2MAAR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XEG128J2MAAR (même facteur de forme et même empreinte) — différant par Operating Temperature, ADC, Core Architecture, Package, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12XEG128MAA
✅ Remplacement direct✓ En stock
$8.9 / unité
Voir la fiche technique →S912XEG128J2MAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XEG128W1MAA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S9S12XS128J1MAA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XHZ256VAG
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →S912XEQ512J2MAL
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →S912XEG128J2MAAR Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | HCS12X S12XEG |
| Core | HCS12X (16-bit RISC) |
| Core Architecture | S12X with XGATE coprocessor |
| Largeur du bus de données | 16 bit |
| Program Memory Size | 128 KB (128K x 8) Flash |
| Data RAM Size | 12 KB |
| EEPROM Size | 16 KB |
| Fréquence d'horloge maximale | 50 MHz |
| Tension d'alimentation de fonctionnement | 1.8 V / 2.8 V / 5 V |
| ADC Resolution | 8 bit / 10 bit |
| Boîtier / Format | 80-QFP (14x14 mm) |
| Style de montage | SMD/SMT |
| Température de fonctionnement | -40C to +125C (Automotive) |
| Terminal Form | GULL WING |
| Number of Terminals | 80 |
| Package Code | QFP |
| Statut RoHS | Compliant |
Configuration des broches de S912XEG128J2MAAR
| Broche 1 | VDDR — Voltage regulator supply |
| Broche 2 | VDD1 — Core voltage supply 1 |
| Broche 3 | VDD2 — Core voltage supply 2 |
| Broche 4 | VSS1 — Ground 1 |
| Broche 5 | VSS2 — Ground 2 |
| Broche 6 | RESET — External reset input, active low |
| Broche 7 | TEST — Test mode enable, must be tied to VSS in normal operation |
| Broche 8 | BKGD — Background Debug Mode (BDM) data line |
| Broche 9 | XCLKS — Crystal oscillator select |
| Broche 10 | EXTAL — External crystal/clock input |
| Broche 11 | XTAL — Crystal oscillator output |
| Broche 12 | PE0 — Port E bit 0 / IRQ |
| Broche 13 | PE1 — Port E bit 1 / XIRQ |
| Broche 14 | PAD00 — Port AD bit 0 / AN0 |
| Broche 15 | PAD01 — Port AD bit 1 / AN1 |
| Broche 16 | PAD02 — Port AD bit 2 / AN2 |
| Broche 17 | PAD03 — Port AD bit 3 / AN3 |
| Broche 18 | PAD04 — Port AD bit 4 / AN4 |
| Broche 19 | PAD05 — Port AD bit 5 / AN5 |
| Broche 20 | PAD06 — Port AD bit 6 / AN6 |
| Broche 21 | PAD07 — Port AD bit 7 / AN7 |
| Broche 22 | PAD08 — Port AD bit 8 / AN8 |
| Broche 23 | PAD09 — Port AD bit 9 / AN9 |
| Broche 24 | PAD10 — Port AD bit 10 / AN10 |
| Broche 25 | PAD11 — Port AD bit 11 / AN11 |
| Broche 26 | PAD12 — Port AD bit 12 / AN12 |
| Broche 27 | PAD13 — Port AD bit 13 / AN13 |
| Broche 28 | PAD14 — Port AD bit 14 / AN14 |
| Broche 29 | PAD15 — Port AD bit 15 / AN15 |
| Broche 30 | PA0 — Port A bit 0 / PWM0 |
| Broche 31 | PA1 — Port A bit 1 / PWM1 |
| Broche 32 | PA2 — Port A bit 2 / PWM2 |
| Broche 33 | PA3 — Port A bit 3 / PWM3 |
| Broche 34 | PA4 — Port A bit 4 / PWM4 |
| Broche 35 | PA5 — Port A bit 5 / PWM5 |
| Broche 36 | PA6 — Port A bit 6 / PWM6 |
| Broche 37 | PA7 — Port A bit 7 / PWM7 |
| Broche 38 | PB0 — Port B bit 0 / PWM0 |
| Broche 39 | PB1 — Port B bit 1 / PWM1 |
| Broche 40 | PB2 — Port B bit 2 / PWM2 |
| Broche 41 | PB3 — Port B bit 3 / PWM3 |
| Broche 42 | PB4 — Port B bit 4 / PWM4 |
| Broche 43 | PB5 — Port B bit 5 / PWM5 |
| Broche 44 | PB6 — Port B bit 6 / PWM6 |
| Broche 45 | PB7 — Port B bit 7 / PWM7 |
| Broche 46 | PC0 — Port C bit 0 |
| Broche 47 | PC1 — Port C bit 1 |
| Broche 48 | PC2 — Port C bit 2 |
| Broche 49 | PC3 — Port C bit 3 |
| Broche 50 | PC4 — Port C bit 4 |
| Broche 51 | PC5 — Port C bit 5 |
| Broche 52 | PC6 — Port C bit 6 |
| Broche 53 | PC7 — Port C bit 7 |
| Broche 54 | PD0 — Port D bit 0 / CAN0TX |
| Broche 55 | PD1 — Port D bit 1 / CAN0RX |
| Broche 56 | PD2 — Port D bit 2 |
| Broche 57 | PD3 — Port D bit 3 |
| Broche 58 | PD4 — Port D bit 4 |
| Broche 59 | PD5 — Port D bit 5 |
| Broche 60 | PD6 — Port D bit 6 |
| Broche 61 | PD7 — Port D bit 7 |
| Broche 62 | PJ0 — Port J bit 0 |
| Broche 63 | PJ1 — Port J bit 1 |
| Broche 64 | PJ2 — Port J bit 2 |
| Broche 65 | PJ3 — Port J bit 3 |
| Broche 66 | PJ4 — Port J bit 4 |
| Broche 67 | PJ5 — Port J bit 5 |
| Broche 68 | PJ6 — Port J bit 6 / SCL |
| Broche 69 | PJ7 — Port J bit 7 / SDA |
| Broche 70 | PM0 — Port M bit 0 / CAN4TX |
| Broche 71 | PM1 — Port M bit 1 / CAN4RX |
| Broche 72 | PM2 — Port M bit 2 |
| Broche 73 | PM3 — Port M bit 3 |
| Broche 74 | PM4 — Port M bit 4 |
| Broche 75 | PM5 — Port M bit 5 |
| Broche 76 | PM6 — Port M bit 6 |
| Broche 77 | PM7 — Port M bit 7 |
| Broche 78 | PP0 — Port P bit 0 / PWM0 |
| Broche 79 | PP1 — Port P bit 1 / PWM1 |
| Broche 80 | PS0 — Port S bit 0 / SCI0TX |
Applications typiques
S912XEG128J2MAAR convient pour 6 applications: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control Module, Automotive Lighting Controller, CAN-based Sensor Node, Small Engine Control Unit.
Automotive Body Control Module
The S912XEG128J2MAAR's 128 KB Flash and 12 KB RAM comfortably fit a typical body-control firmware stack including central locking, window lift, mirror adjustment, and rain-light sensor integration. Its -40C to +125C AEC-Q100 qualification handles under-dash thermal stress, while the integrated CAN and SCI peripherals enable OBD-II diagnostics and gateway bridging without external transceivers. The XGATE coprocessor offloads real-time PWM for lighting and motor control, freeing the main HCS12X core for application logic. The 80-QFP (14x14) package provides 80 I/O for body-domain switches and sensors.
Recommandé
Instrument Cluster Controller
For analog/digital instrument clusters, the S912XEG128J2MAAR delivers 50 MHz of HCS12X throughput for driving stepper-motor gauges, LCD segments, and CAN-FD message handling. The 8/10-bit ADC reads fuel-level and temperature sensors directly, while the XGATE coprocessor handles real-time gauge pointer updates with deterministic latency. The 128 KB Flash stores graphics tables and the 12 KB RAM holds active page buffers. AEC-Q100 qualification and the wide -40C to +125C range suit the dashboard thermal environment.
Recommandé
HVAC Climate Control Module
The S912XEG128J2MAAR's combination of 128 KB Flash, PWM timers, and the XGATE coprocessor suits HVAC climate modules that drive blower motors, blend-door actuators, and stepper valves. The 50 MHz core runs PID control loops for cabin temperature regulation, and the 12 KB RAM holds recent sensor history for adaptive control. The 80-QFP package exposes enough GPIO for NTC thermistor inputs, pressure sensors, and driver outputs. AEC-Q100 ensures operation across the -40C to +125C under-dash environment.
Recommandé
Automotive Lighting Controller
Headlight and tail-light controllers benefit from the S912XEG128J2MAAR's high-resolution PWM timers and the XGATE coprocessor's deterministic interrupt response for sequential turn-indicator patterns. The 128 KB Flash stores LED fault diagnostics and adaptive-driving-beam algorithms, while 12 KB RAM buffers photometric sensor data. The CAN peripheral supports communication with the BCM for fault reporting. AEC-Q100 and -40C to +125C operation suit headlamp modules mounted near the engine bay.
Recommandé
CAN-based Sensor Node
Distributed sensor nodes - parking sensors, battery-current sensors, tire-pressure monitors - leverage the S912XEG128J2MAAR's integrated CAN controller, ADC, and 128 KB Flash for sensor fusion and CAN message formatting. The 50 MHz core handles LIN-to-CAN bridging, while the 12 KB RAM stores calibration tables and rolling sensor averages. The 80-QFP provides ample GPIO for multiple sensor inputs. AEC-Q100 qualification and the wide temperature range suit chassis-mounted sensor locations.
Recommandé
Small Engine Control Unit
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XEG128J2MAAR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12XEG128MAA | S912XEG128J2MAA | S9S12XS128J1MAA | MC9S12XHZ256VAG |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14) | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same |
| Core | HCS12X (16-bit, 50 MHz) | HCS12X (16-bit, 50 MHz) | HCS12X (16-bit, 50 MHz) | S12XS (16-bit, 40 MHz) | HCS12X (16-bit, 50 MHz) |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB |
| RAM | 12 KB | 12 KB | 12 KB | 8 KB | 12 KB |
| EEPROM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- XGATE coprocessor for deterministic peripheral handling (vs S9S12XS128J1MAA)
- 12 KB RAM vs 8 KB in lower-tier S12XS parts (vs S9S12XS128J1MAA)
- 256 KB Flash upgrade path on identical footprint (vs MC9S12XHZ256VAG)
Notes de conception
The S912XEG128J2MAAR has separate VDD1/VDD2 core supply pins and a VDDR regulator supply pin. Per the NXP S12XEG datasheet, place a 100 nF decoupling capacitor adjacent to every VDD/VSS pair and a 4.7 uF bulk capacitor on VDDR. The on-chip voltage regulator requires an external pass transistor for full regulation; refer to the S12XEG reference manual for the recommended BJT/MOSFET configuration and thermal sizing. Inrush current at cold crank (4.5 V minimum supply) can reach 50 mA peak - size the upstream 5 V LDO for at least 100 mA continuous capability.
Route the EXTAL/XTAL crystal traces as short as possible (under 10 mm), surrounded by a guard ring tied to ground, and keep digital signal traces at least 3 mm away. Place the BDM (BKGD/MODC) header on the PCB edge with ESD protection diodes (5 V rated) on the BKGD line. The 80-QFP (14x14 mm) package requires 0.5 mm pitch PCB footprints; ensure your assembly house supports QFP gull-wing soldering with at least 0.2 mm lead-to-pad overlap for reliable joints.
Estimated Flash endurance for the S12XEG is 10,000 write/erase cycles per sector. If your application logs data continuously (e.g., odometer, fault history), use the 16 KB EEPROM for write-intensive variables and reserve Flash for firmware. Always tie the TEST pin to VSS through a 4.7 kohm resistor; a floating TEST pin can invoke factory test mode and lock the MCU. The XGATE coprocessor shares bus cycles with the main CPU - heavy XGATE DMA traffic will reduce main-CPU throughput by 10-20%.
Informations de conformité
AEC-Q100 automotive qualified per NXP product page. Lead-free / RoHS compliant indicated by trailing R suffix in part number. Halogen-free status not explicitly stated in verified data.