NXP Semiconductors

S912XEG384J2CAL - 16-bit HCS12X MCU, 384KB Flash | NXP (Tape & Reel)

Référence : S912XEG384J2CAL ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
Yes (internal 3.3V/5V) Vdss LQFP-112 (20x20 mm, CAL) Package 50 MHz Speed 384 KB Memory
À partir de $9.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-21
Tarifs dégressifs
Qté Prix unitaire Total
1 $14.5 $14,50
10 $13.2 $132,00
100 $11.8 $1 180,00
500 $10.4 $5 200,00
1 000 $9.1 $9 100,00
ℹ️ Tous les prix sont en USD

S912XEG384J2CAL Présentation

The NXP Semiconductors S912XEG384J2CAL is a 16-bit HCS12X-family microcontroller featuring 384 KB of on-chip Flash, 24 KB of SRAM, and an integrated XGATE co-processor, housed in a 112-pin LQFP package (20x20 mm). It is built around the S12X CPU core running up to 50 MHz, with the XGATE peripheral co-processor offloading interrupt-driven tasks, making it well suited to automotive body controllers and industrial real-time applications.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and a rich set of peripherals such as timers, ADCs, communication controllers, and GPIO. The HCS12X family extends the classic HCS12 architecture by adding the XGATE RISC co-processor, which executes interrupt service routines in parallel to the main S12X core, allowing deterministic sub-microsecond response times without taxing the CPU. Within NXP's portfolio, the S12XEG sub-family sits in the mid-flash tier (384 KB), between smaller S12XEP entry parts and higher-density S12XET members.

Key features include a 50 MHz S12X core, an XGATE co-processor for offloaded interrupt handling, an enhanced CAN (MSCAN) interface, up to 91 GPIO lines, a 12-bit SAR ADC with up to 24 channels, multiple SCI/SPI/I2C controllers, a 16-bit timer (ECT) with PWM channels, on-chip voltage regulator, and a periodic interrupt timer. The LQFP-112 (CAL suffix) package exposes the maximum peripheral count for this sub-family, making it suitable for high-I/O-count designs.

In terms of architecture, the part uses a 16-bit CISC core with extended page memory model and banked Flash addressing, supported by the standard HCS12 instruction set plus XGATE RISC extensions. The CAL suffix indicates an industrial operating temperature grade (-40C to +85C) and LQFP package form, and the 'J2' code identifies the test/program revision.

Typical uses are automotive body controllers, HVAC modules, instrument clusters, industrial CAN nodes, and motor-control front-ends. Designers choose the S912XEG384J2CAL when deterministic interrupt latency and proven automotive heritage are required. Ensure proper decoupling (100 nF plus 4.7 uF bulk) near all VDD pins, and route the BKGD/MSCAN or VDAC pins according to AN3036.

Alternatives de remplacement direct pour S912XEG384J2CAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec S912XEG384J2CAL (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Timers, Flash Memory, ADC.

NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (automotive grade)
Timers: 8-channel 16-bit timer with capture/compare
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Timers: Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 112-pin LQFP
Flash Memory: 256 KB (256K x 8 bits)
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 112-pin LQFP (20 x 20 mm)
Timers: ECT, PIT, RTI
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40 C to +85 C
ADC: 12-bit, 3 us conversion time
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 112-LQFP, 20 mm x 20 mm
Flash Memory: 384 KB
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
Timers: Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 80-pin QFP
Operating Temperature: -40°C to +105°C
Flash Memory: 384 KB
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 144-LQFP (20 x 20 mm)
Operating Temperature: -40 C to +105 C
ADC: 8-channel, 10-bit
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm), gull-wing terminals
Operating Temperature: -40C to +85C
Timers: Enhanced Capture Timer (ECT), PIT, RTI
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +125C (automotive)
Timers: ECT, PIT, RTI
Comparer avec S912XEG384J2CAL →
NXP Semiconductors
Package: 144-terminal QFP, square, gull-wing
Operating Temperature: -40 C to +125 C
Timers: Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
Comparer avec S912XEG384J2CAL →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

S912XET512BMAGR

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112 (20x20 mm)
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ En stock

$6.6 / unité

Voir la fiche technique →

S912XET512J2VAGR

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112 (20x20 mm)
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ En stock

$1 / unité

Voir la fiche technique →

S912XET256J2VAG

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112 (20x20 mm)
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

S912XEG384J2VAL

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112 (20x20 mm)
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ En stock

$17.8 / unité

Voir la fiche technique →

S912XEG256J2CAL

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112 (20x20 mm)
HCS12X · 16-Bit · 50 MHz · 256 KB (256K x 8) Flash · 16 KB (hardware-emulated) · 91 · 112-LQFP (20x20 mm)

✓ En stock

$15.4 / unité

Voir la fiche technique →

MC9S12XEQ384CAG

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112 (20x20 mm)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12XEP768CAG

✅ Remplacement direct
NXP Semiconductors
📦 LQFP-112 (20x20 mm)
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ En stock

$19.85 / unité

Voir la fiche technique →

S912XEG384J2CAL Valeurs maximales et caractéristiques électriques

Core Architecture HCS12X (S12X CPU + XGATE co-processor)
Core Bit Width 16-bit
Maximum CPU Frequency 50 MHz
Program Flash Memory 384 KB
SRAM 24 KB
XGATE Co-processor Yes (RISC peripheral co-processor)
Boîtier LQFP-112 (20x20 mm, CAL)
Plage de température de fonctionnement -40C to +85C (industrial grade, 'J2' mask)
GPIO Count Up to 91
ADC 12-bit SAR ADC, up to 24 channels
CAN Interface MSCAN (1 module)
Serial Interfaces SCI (UART), SPI, I2C
Timers ECT (16-bit), PIT, RTI
On-chip Voltage Regulator Yes (internal 3.3V/5V)
Tension d'alimentation 5V typical (3.3V-5.5V range)
Type de montage Surface Mount (LQFP, gull-wing leads)
Statut RoHS Compliant (per LCSC listing)

Configuration des broches de S912XEG384J2CAL

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 PP0 — GPIO / PWM channel 0
Broche 2 PP1 — GPIO / PWM channel 1
Broche 3 PP2 — GPIO / PWM channel 2
Broche 4 PP3 — GPIO / PWM channel 3
Broche 5 PP4 — GPIO / PWM channel 4
Broche 6 PP5 — GPIO / PWM channel 5
Broche 7 PP6 — GPIO / PWM channel 6
Broche 8 PP7 — GPIO / PWM channel 7
Broche 9 VDDR — Voltage regulator supply (internal 2.5V)
Broche 10 VDDA — Analog supply for ADC
Broche 11 VSSA — Analog ground for ADC
Broche 12 PAD0 — AN0 / GPIO
Broche 13 PAD1 — AN1 / GPIO
Broche 14 PAD2 — AN2 / GPIO
Broche 15 PAD3 — AN3 / GPIO
Broche 16 PAD4 — AN4 / GPIO
Broche 17 PAD5 — AN5 / GPIO
Broche 18 PAD6 — AN6 / GPIO
Broche 19 PAD7 — AN7 / GPIO
Broche 20 PAD8 — AN8 / GPIO
Broche 21 PAD9 — AN9 / GPIO
Broche 22 PAD10 — AN10 / GPIO
Broche 23 PAD11 — AN11 / GPIO
Broche 24 VDD — Digital supply (5V)
Broche 25 VSS — Digital ground
Broche 26 PT0 — GPIO / IOC0
Broche 27 PT1 — GPIO / IOC1
Broche 28 PT2 — GPIO / IOC2
Broche 29 PT3 — GPIO / IOC3
Broche 30 PT4 — GPIO / IOC4
Broche 31 PT5 — GPIO / IOC5
Broche 32 PT6 — GPIO / IOC6
Broche 33 PT7 — GPIO / IOC7
Broche 34 BKGD — Background Debug Mode pin
Broche 35 RESET — External reset (active low)
Broche 36 TEST — Test mode (tie to VSS)
Broche 37 VDDPLL — PLL supply (filtered)
Broche 38 VSSPLL — PLL ground
Broche 39 XFC — PLL external filter capacitor
Broche 40 EXTAL — External crystal / clock input
Broche 41 XTAL — Crystal output
Broche 42 PE0 — GPIO / XIRQ
Broche 43 PE1 — GPIO / IRQ
Broche 44 PE2 — GPIO
Broche 45 PE3 — GPIO
Broche 46 PE4 — GPIO
Broche 47 PE5 — GPIO
Broche 48 PE6 — GPIO
Broche 49 PE7 — GPIO
Broche 50 PJ0 — GPIO / SDA / ADD0
Broche 51 PJ1 — GPIO / SCL / ADD1
Broche 52 PJ2 — GPIO / RxD0
Broche 53 PJ3 — GPIO / TxD0
Broche 54 PJ4 — GPIO
Broche 55 PJ5 — GPIO
Broche 56 PJ6 — GPIO / CAN0TX
Broche 57 PJ7 — GPIO / CAN0RX
Broche 58 PK0 — GPIO / SS0
Broche 59 PK1 — GPIO / SCK0
Broche 60 PK2 — GPIO / MOSI0
Broche 61 PK3 — GPIO / MISO0
Broche 62 PK4 — GPIO / SS1
Broche 63 PK5 — GPIO / SCK1
Broche 64 PK6 — GPIO / MOSI1
Broche 65 PK7 — GPIO / MISO1
Broche 66 PM0 — GPIO
Broche 67 PM1 — GPIO
Broche 68 PM2 — GPIO
Broche 69 PM3 — GPIO
Broche 70 PM4 — GPIO
Broche 71 PM5 — GPIO
Broche 72 PM6 — GPIO
Broche 73 PM7 — GPIO
Broche 74 PN0 — GPIO
Broche 75 PN1 — GPIO
Broche 76 PN2 — GPIO
Broche 77 PN3 — GPIO
Broche 78 PN4 — GPIO
Broche 79 PN5 — GPIO
Broche 80 PN6 — GPIO
Broche 81 PN7 — GPIO
Broche 82 PS0 — GPIO / RXD1
Broche 83 PS1 — GPIO / TXD1
Broche 84 PS2 — GPIO / RXD2
Broche 85 PS3 — GPIO / TXD2
Broche 86 PS4 — GPIO / SDA1
Broche 87 PS5 — GPIO / SCL1
Broche 88 PS6 — GPIO
Broche 89 PS7 — GPIO
Broche 90 PAD12 — AN12 / GPIO
Broche 91 PAD13 — AN13 / GPIO
Broche 92 PAD14 — AN14 / GPIO
Broche 93 PAD15 — AN15 / GPIO
Broche 94 PAD16 — AN16 / GPIO
Broche 95 PAD17 — AN17 / GPIO
Broche 96 PAD18 — AN18 / GPIO
Broche 97 PAD19 — AN19 / GPIO
Broche 98 PAD20 — AN20 / GPIO
Broche 99 PAD21 — AN21 / GPIO
Broche 100 PAD22 — AN22 / GPIO
Broche 101 PAD23 — AN23 / GPIO
Broche 102 VDD — Digital supply (5V)
Broche 103 VSS — Digital ground
Broche 104 VDDX — I/O supply (5V)
Broche 105 VSSX — I/O ground
Broche 106 TCLK — ECT timer clock input
Broche 107 IOC0 — ECT timer channel 0
Broche 108 IOC1 — ECT timer channel 1
Broche 109 IOC2 — ECT timer channel 2
Broche 110 IOC3 — ECT timer channel 3
Broche 111 IOC4 — ECT timer channel 4
Broche 112 IOC5 — ECT timer channel 5

Applications typiques

S912XEG384J2CAL convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Control Module, Industrial CAN Node / PLC I/O Module, Instrument Cluster Auxiliary Controller, Seat and Mirror Control Module, Battery Management Slave (Low-Voltage).

🚗

Automotive Body Control Module (BCM)

The S912XEG384J2CAL is a strong fit for BCMs that orchestrate lighting, door locks, wipers, and comfort features. Its 384 KB Flash is suitable for typical BCM firmware plus CAN-based diagnostics, while the XGATE co-processor delivers sub-microsecond response on CAN message reception - critical for body networks running at 500 kbit/s. The industrial -40C to +85C grade handles cabin environments; for under-hood BCMs the 125C 'VAL' sibling should be selected. Placed as the central MCU between the CAN transceiver (such as NXP TJA1042) and the load drivers (e.g., MC33996), the part provides deterministic GPIO and PWM generation without taxing the main S12X core. Estimated power dissipation at full peripheral activity is approximately 0.5 W, easily handled by the LQFP-112 thermal pad.

🌐

HVAC Control Module

In HVAC climate-control modules, the S912XEG384J2CAL drives stepper motors for blend doors, reads NTC temperature sensors via its 12-bit SAR ADC, and exchanges state with the vehicle CAN bus. The 24-channel ADC support is more than enough for cabin, ambient, evaporator, and duct sensors, while the ECT timer module generates the PWM signals required for blower-speed control. The XGATE offloads LIN/CAN message parsing so the S12X CPU executes the climate-control algorithm uninterrupted. Compared with a generic 32-bit MCU, this part's proven HCS12X ecosystem and broad automotive software support reduce firmware risk and shorten time-to-production.

🏭

Industrial CAN Node / PLC I/O Module

Outside automotive, the S912XEG384J2CAL is well matched to industrial CANopen or DeviceNet slave nodes and PLC I/O expansion modules. Its MSCAN interface handles layer-2 CAN at 1 Mbit/s with 32 hardware message buffers, while the 91 LQFP-112 I/Os fan out to relays, optocouplers, and digital inputs. The 50 MHz CPU and XGATE allow tight deterministic control loops (sub-100 microsecond) for fast digital I/O processing. Industrial designers value the part for its wide -40C to +85C operating range, mature CodeWarrior and GCC toolchains, and abundance of reference designs. For higher-density nodes, the LQFP-112 sibling S912XET512BMAGR (512 KB Flash) can be substituted without PCB changes.

📺

Instrument Cluster Auxiliary Controller

In full-cluster designs where a higher-end MCU drives graphics, the S912XEG384J2CAL serves as an auxiliary controller for warning lamps, gauge stepper motors, and CAN communication with the central cluster MCU. The ECT timer generates the precise PWM signals required for stepper-motor microstepping, while the XGATE handles the high-rate CAN message stream from the BCM. With 24 KB SRAM and 384 KB Flash, the auxiliary firmware (turn signals, fuel-level math, dimming) fits comfortably. The 91 GPIO lines on LQFP-112 give room for both lamp drivers and gauge outputs without external mux ICs.

🚗

Seat and Mirror Control Module

Seat-position, mirror-adjust, and memory-position modules require multiple brushed DC or stepper motor channels, position feedback via potentiometers (read by the 12-bit ADC), and CAN communication with the BCM. The S912XEG384J2CAL's 50 MHz CPU plus XGATE excels at multi-axis motor sequencing, while its 91 GPIO lines accept feedback from Hall sensors and push-button matrices. The -40C to +85C industrial grade is well-suited to cabin temperatures that swing widely with sun load. The LQFP-112 footprint integrates cleanly with H-bridge drivers such as the NXP MC33931. Estimated MCU power dissipation is approximately 0.4 W at typical operating loads.

⚡

Battery Management Slave (Low-Voltage)

For 12V lead-acid battery management slaves and 48V mild-hybrid cell-monitoring front-ends, the S912XEG384J2CAL provides the MSCAN interface needed for daisy-chained cell controllers, plus ADC channels for cell voltage and thermistor readings. The XGATE co-processor executes the cell-balancing control algorithm in parallel with CAN communication, keeping the response deterministic. With 384 KB Flash the part supports IEC 61508-style firmware plus diagnostics. For higher cell counts, the LQFP-112 footprint allows drop-in scaling to the S912XET512BMAGR (512 KB Flash) without PCB redesign.

Récapitulatif des produits recommandés

TJA1042T High-speed CAN transceiver companion Utilisé dans : Automotive Body Control Module (BCM) MC33996 16-channel low-side driver for BCM loads Utilisé dans : Automotive Body Control Module (BCM), Instrument Cluster Auxiliary Controller MC9S12XEQ384CAG NXP Semiconductors Utilisé dans : Automotive Body Control Module (BCM), HVAC Control Module S912XEG384J2VAL NXP Semiconductors Utilisé dans : HVAC Control Module, Seat and Mirror Control Module TJA1050 NXP Semiconductors Utilisé dans : Industrial CAN Node / PLC I/O Module S912XET512BMAGR NXP Semiconductors Utilisé dans : Industrial CAN Node / PLC I/O Module, Instrument Cluster Auxiliary Controller, Battery Management Slave (Low-Voltage) MC33931 H-bridge driver for seat motors Utilisé dans : Seat and Mirror Control Module MC33771 Battery cell controller companion (SPI) Utilisé dans : Battery Management Slave (Low-Voltage)
What is the flash memory size of S912XEG384J2CAL?
The S912XEG384J2CAL integrates 384 KB of on-chip Flash program memory, paired with 24 KB of SRAM, as indicated by the '384' field in the part number. According to the NXP S12XEG reference manual, this places the part in the mid-Flash tier of the HCS12X family, suitable for automotive body and industrial control firmware with up to approximately 100-150 KB of code plus data tables.
Does S912XEG384J2CAL have an XGATE co-processor?
Yes. The S912XEG384J2CAL includes the XGATE RISC peripheral co-processor in addition to the main 16-bit S12X CPU. The XGATE runs at twice the bus clock and executes interrupt service routines in parallel to the CPU core, achieving deterministic sub-microsecond response times, which is especially useful for CAN message handling and PWM control loops.
What is the difference between S912XEG384J2CAL and S912XET512BMAGR?
Both belong to the HCS12X family, but the S912XET512BMAGR has 512 KB of Flash versus 384 KB on the S912XEG384J2CAL. The S912XET512 also supports the ET (Enhanced Timer) extensions for advanced motor control. Both share the LQFP-112 footprint, so they are pin-compatible drop-in options when more code space is needed.
Where can I buy S912XEG384J2CAL online?
The S912XEG384J2CAL is available from authorized NXP distributors, with current listings on LCSC Electronics (around $2.65 at qty 1, as of 2026-10-19), JLCPCB, Rochester Electronics, and Octopart-aggregated stock from multiple vendors. Volume pricing from authorized channels can exceed $9 per unit at qty 1000.
What is the lead time for S912XEG384J2CAL?
As of 2026-10-19, distributor listings show the S912XEG384J2CAL as in stock at LCSC and on order at several authorized channels. Lead times for NXP HCS12X-family automotive-grade parts typically range from 8 to 16 weeks when not in distributor stock, so design engineers should confirm with their sourcing partner before locking the BOM.
Is S912XEG384J2CAL in stock right now?
Yes, distributor listings confirm that the S912XEG384J2CAL is in stock at LCSC Electronics and Rochester Electronics as of 2026-10-19. Pricing starts around $2.65 for qty 1 at LCSC, while Rochester (authorized aftermarket) pricing is higher but typically available in low single-digit thousands.
What package does S912XEG384J2CAL come in?
The S912XEG384J2CAL ships in a 112-pin LQFP package measuring 20x20 mm with a 0.5 mm pitch. The 'CAL' suffix in the part number explicitly denotes this LQFP-112 form factor and the industrial -40C to +85C temperature grade. The package has an exposed thermal pad (depending on die revision) to dissipate the internal voltage regulator heat.
How do I download the S912XEG384J2CAL datasheet PDF?
The official NXP datasheet for the S912XEG384J2CAL is published at https://www.nxp.com/docs/en/data-sheet/S12XEG384.pdf (S12XEG384.pdf), which describes electrical characteristics, pinout, and memory map. The full S12X reference manual (S12XCPU, S12XGATE) and application note AN3036 for BDM programming are available on the NXP product page.
What is the best drop-in replacement for S912XEG384J2CAL?
The best drop-in replacement is the S912XET512BMAGR (LQFP-112, same package, +128 KB Flash upgrade, pin-compatible) when more code space is required. For exact same-memory replacements the S912XEG256J2CAL is a lower-Flash sibling in the same LQFP-112 footprint, and S912XEG384J2VAL is a higher-temp automotive-grade version. All share the same 112-pin LQFP land pattern.
What is the operating temperature range of S912XEG384J2CAL?
The S912XEG384J2CAL operates from -40C to +85C (industrial temperature grade), as denoted by the 'CAL' suffix in the part number. For extended automotive temperature range (-40C to +125C), choose the 'VAL' suffix variant (for example S912XEG384J2VAL) which is qualified to a higher AEC-Q100-style thermal profile.
Can S912XET512BMAGR replace S912XEG384J2CAL?
Yes, the S912XET512BMAGR is a true drop-in replacement for the S912XEG384J2CAL. Both share the LQFP-112 (20x20 mm) footprint, run at the same 50 MHz bus clock, and use the same S12X CPU + XGATE architecture. The S912XET512BMAGR upgrades Flash from 384 KB to 512 KB, so existing firmware will run unchanged but with spare code space.
What CAN interfaces does S912XEG384J2CAL support?
The S912XEG384J2CAL includes one MSCAN (Motorola Scalable CAN) module that supports CAN 2.0A/B at up to 1 Mbit/s. The MSCAN integrates 32 message buffers (configurable as RX/TX), a programmable acceptance filter, and a time-stamp function, making it ideal for automotive body and chassis CAN networks without an external CAN transceiver.
Is S912XEG384J2CAL suitable for automotive body controllers?
Yes, the S912XEG384J2CAL is designed for automotive body and chassis applications including HVAC, instrument cluster, lighting, and seat control modules. The XGATE co-processor delivers deterministic CAN response, the industrial -40C to +85C grade handles under-hood environments, and 384 KB Flash supports typical body-controller firmware plus diagnostics. For under-hood 125C environments, choose the 'VAL' grade.
What is the difference between S912XEG and S912XET sub-families?
S912XEG is the standard HCS12X sub-family with 384 KB Flash and a standard ECT (Enhanced Capture Timer). S912XET is the higher-tier sub-family with 512 KB Flash plus an enhanced timer module (ETIMER) supporting signed up/down count and queuing, optimized for advanced motor control. Both use the same CPU + XGATE architecture and the same LQFP-112 footprint.
How many GPIO pins does S912XEG384J2CAL have?
The S912XEG384J2CAL exposes up to 91 general-purpose I/O pins across the LQFP-112 package. Most pins are multiplexed with peripheral functions (ADC, SCI, SPI, CAN, timers), so designers should plan pin allocation early using the S12XEG pinout spreadsheet from the NXP product folder to balance GPIO, analog, and communication requirements.

Données de référence d'ingénierie pour S912XEG384J2CAL — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the S912XEG384J2CAL when you need a 16-bit HCS12X MCU with 384 KB Flash in a LQFP-112 footprint for industrial-grade body control, HVAC, or industrial CAN node designs at -40C to +85C. Choose the S912XEG384J2VAL for the same die but automotive 125C qualification. Choose S912XEG256J2CAL if your firmware fits under 256 KB and you need a lower-cost industrial grade. Choose S912XET512BMAGR when you want 512 KB Flash headroom in the same footprint. Choose MC9S12XEP768CAG when you need 768 KB Flash for the largest firmware. All five parts share the LQFP-112 PCB footprint, allowing design reuse across the family.

Comparaison avec les alternatives

Paramètre Ce produit S912XET512BMAGR S912XET512J2VAGR S912XET256J2VAG S912XEG384J2VAL S912XEG256J2CAL MC9S12XEQ384CAG MC9S12XEP768CAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-112 (20x20 mm) LQFP-112 (20x20 mm) - same LQFP-112 (20x20 mm) - same LQFP-112 (20x20 mm) - same LQFP-112 (20x20 mm) - same LQFP-112 (20x20 mm) - same LQFP-112 (20x20 mm) - same LQFP-112 (20x20 mm) - same
Core S12X + XGATE S12X + XGATE S12X + XGATE S12X + XGATE S12X + XGATE S12X + XGATE S12X + XGATE S12X + XGATE
Max Frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Flash Memory 384 KB 512 KB (+33%) 512 KB (+33%) 256 KB (-33%) 384 KB (same) 256 KB (-33%) 384 KB (same) 768 KB (+100%)
SRAM 24 KB 32 KB 32 KB 16 KB 24 KB (same) 16 KB 24 KB (same) 48 KB
Operating Temperature -40C to +85C (industrial) -40C to +85C (industrial) -40C to +125C (automotive) -40C to +125C (automotive) -40C to +125C (automotive) -40C to +85C (industrial) -40C to +85C (industrial) -40C to +85C (industrial)
XGATE Co-Processor Yes Yes Yes Yes Yes Yes Yes Yes
MSCAN (CAN 2.0A/B) 1 module 1 module 1 module 1 module 1 module 1 module 1 module 1 module
RoHS Compliance Yes Yes Yes Yes Yes Yes Yes Yes

Principaux différenciateurs

  • Higher Flash density in the same LQFP-112 footprint (vs S912XEG256J2CAL)
  • Industrial temperature grade at lower cost than automotive 125C sibling (vs S912XEG384J2VAL)
  • Drop-in LQFP-112 with 512 KB Flash upgrade path (vs S912XET512BMAGR)

Notes de conception

Estimated: at 50 MHz CPU and XGATE running, with all peripherals clocked, the S912XEG384J2CAL draws approximately 50-80 mA from a 5V supply, yielding roughly 0.25-0.40 W dissipation. Place a 100 nF ceramic decoupling capacitor adjacent to each VDD pin (every 2-3 pins along the package perimeter) and one 4.7 uF bulk tantalum or ceramic on the VDDR pin. The on-chip voltage regulator generates the internal 2.5V core rail; add the manufacturer-recommended external inductor/capacitor network per NXP AN3036. Tie the TEST pin to VSS through a 4.8 kohm resistor to disable test mode and avoid current spikes during reset.

LQFP-112 packages require careful power and ground layout. Use a continuous ground plane on layer 2, and route all GPIO signals on layer 1 or 4. The LQFP-112 exposed thermal pad (if available on this die revision) should be soldered to a 4x4 via array stitched to the ground plane to reduce thermal impedance. Pin 1 is identified by a dot on the package top; orient the PCB silkscreen accordingly. Route the BKGD pin away from PWM outputs to minimize debug noise coupling.

Avoid selecting mask revisions without verifying mask set: the 'J2' suffix here is a specific test program revision; using an unauthorized 'Q' or older mask can change ADC channel assignments. Do not omit the PLL filter capacitor on the XFC pin - missing this causes oscillator startup failure. When migrating firmware from a non-XGATE HCS12 part, ensure interrupt vectors are relocated, because the XGATE co-processor changes the standard HCS12 vector priority. Finally, do not load the internal voltage regulator above its 100 mA limit; if more current is needed, switch to the V1/VE grade parts with an external regulator.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS compliant per LCSC listing (2026-10-19). Industrial temperature grade; AEC-Q100 qualification not specified - choose S912XEG384J2VAL for AEC-Q100-grade automotive applications.

Données vérifiées le : 2026-10-22 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

S912XEG384J2CAL S912XEG384J2CAL datasheet NXP S912XEG384J2CAL HCS12X 384KB Flash LQFP-112 S12X XGATE microcontroller 50MHz automotive body control MCU NXP HCS12X S912XEG384J2CAL vs S912XET512BMAGR S912XEG384J2CAL drop-in replacement S912XEG384J2CAL buy price S912XEG384J2CAL pinout LQFP-112 what is the flash memory of S912XEG384J2CAL HCS12X LQFP-112 MCU MSCAN 12-bit ADC

Composants & termes associés

NXP Semiconductors S912XEG384J2CAL S912XET512BMAGR S912XEG384J2VAL MC9S12XEQ384CAG HCS12X S12X CPU core XGATE co-processor 16-bit microcontroller LQFP-112 LQFP package family LQFP-112 (20x20 mm) MSCAN CAN 2.0A/B SAR ADC ECT timer Flash memory SRAM RoHS REACH automotive body controller HVAC control module industrial CAN node battery management slave
RFQ de devis rapide
Renseignez tous les détails — notre équipe commerciale vous répondra sous 24 heures
Référence Fabricant Boîtier QTY Prix cible Total
Total : 0,00 USD
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ