NXP Semiconductors

S9S08DZ60F1MLC - 8-bit MCU, 60KB Flash, CAN, 32-LQFP | NXP

Teilenummer: S9S08DZ60F1MLC ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
32-LQFP (7x7 mm) Package 40 MHz (20 MHz bus) Speed 60 KB (60K x 8) Memory
Ab $5.45 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $8.95 $8,95
10 $8.1 $81,00
100 $7.05 $705,00
500 $6.2 $3.100,00
1.000 $5.45 $5.450,00
ℹ️ Alle Preise sind in USD

S9S08DZ60F1MLC Übersicht

The NXP S9S08DZ60F1MLC is a 40 MHz HCS08-family 8-bit automotive microcontroller with 60 KB of on-chip Flash, 4 KB SRAM, and integrated CAN, in a 32-pin LQFP (7x7 mm) package with M74K mask set marking. The device belongs to the S08DZ60 series, which combines an enhanced HCS08 core, on-chip EEPROM emulation, and an MSCAN (CAN 2.0A/B) controller.

An 8-bit microcontroller (MCU) is a single-chip processor with on-board Flash program memory, RAM, peripherals, and interrupt control, optimized for embedded control in cost-sensitive and real-time systems. The HCS08 core is the enhanced successor to the HC08 architecture, offering the same HC08 instruction set with the addition of BGND (background debug) and higher code density. Within the broader hierarchy, the S08DZ60 belongs to the microcontrollers (MCU) category of integrated circuits, then to the 8-bit MCU subcategory, then to the automotive-grade segment.

Key features include 60 KB Flash (60K x 8), 4 KB SRAM, on-chip EEPROM emulation, an MSCAN controller for CAN 2.0A/B networking, a 40 MHz CPU with a 20 MHz bus, and support for up to 32 interrupt/reset sources. The S9S08DZ60F1MLC variant carries the M74K mask set designation ("MASK ONLY-AUTO") and is qualified to automotive temperature grade (-40C to +125C). The 32-LQFP (7x7 mm) package supports surface-mount assembly and provides ample GPIO for body, chassis, and sensor interface applications.

Typical applications include automotive body controllers, CAN nodes (door modules, seat controllers, mirror modules), industrial sensor hubs, LIN/CAN gateway bridges, and low-end instrument clusters. The combination of on-chip CAN and 60 KB Flash simplifies BOM and PCB layout in distributed automotive networks.

When designing with this MCU, ensure the BDS (background debug) interface is accessible for in-circuit programming and that the VDDA/VREF decoupling follows NXP reference design guidance. Use the on-chip CAN controller with an external CAN transceiver (e.g. TJA1050 or TJA1040). The "F1" mask set designation means the part is shipped with the F1 firmware mask pre-programmed, so this SKU is intended for production runs against the M74K firmware baseline rather than for general development.

This page synthesizes distributor pricing, drop-in alternative MPNs (same LQFP-32 footprint), and practical design considerations for production engineers, providing actionable information not found in the manufacturer datasheet alone.

Drop-in-Alternativen für S9S08DZ60F1MLC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S9S08DZ60F1MLC (gleiche Bauform und Footprint) – abweichend in Package, Core, Operating Temperature, Program Memory Size, RAM.

NXP Semiconductors
Package: 32-LQFP (7x7 mm, 0.5 mm pitch)
Core: HCS08 (CISC, 8-bit)
Operating Temperature: -40 C to +125 C (automotive grade)
Vergleichen mit S9S08DZ60F1MLC →
NXP Semiconductors
Program Memory Size: 60 KB (60K x 8) FLASH
Vergleichen mit S9S08DZ60F1MLC →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Operating Temperature: -40C to +125C
Program Memory Size: 60 KB (60K x 8)
Vergleichen mit S9S08DZ60F1MLC →
NXP Semiconductors
Package: LQFP-64 (QFP 64, square, LFQFP)
Core: S08 (HCS08), 8-bit
Program Memory Size: 96 KB Flash
Vergleichen mit S9S08DZ60F1MLC →
NXP Semiconductors
Package: 48-pin LQFP (7 mm x 7 mm, 0.5 mm pitch)
Core: S08 (HCS08 instruction set)
RAM: 6 KB
Vergleichen mit S9S08DZ60F1MLC →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

S9S08DZ60F2MLC

✅ Drop-In
📦 32-LQFP (7x7 mm)
F2 mask set (vs F1); same 60 KB Flash, 40 MHz, MSCAN, same LQFP-32 footprint

📋 Referenzalternative (nicht im Katalog)

S9S08DZ60F1MLF

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7 mm)
NXP USA Inc. (formerly Freescale Semiconductor) · 8-Bit Microcontroller (MCU) · HCS08 (enhanced HCS08 core) · 40 MHz (20 MHz bus) · 60 KB (60K x 8) FLASH · 4 KB (4K x 8) · 39 · 48-LQFP (7x7 mm)

✓ Auf Lager

$4.95 / Stück

Datenblatt ansehen →

S9S08DZ60F2MLF

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7 mm)
S08 · 8-Bit · 40 MHz · 60 KB (60K x 8) · FLASH · 2 KB (2K x 8) · 4 KB · 39

✓ Auf Lager

$2.85 / Stück

Datenblatt ansehen →

S9S08DZ60F1MLH

✅ Drop-In
📦 32-LQFP (7x7 mm)
Same F1 mask; alternative reel/packaging code; same LQFP-32 die

📋 Referenzalternative (nicht im Katalog)

S9S08DZ96F2MLH

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7 mm)
S08 (HCS08), 8-bit · 1 · 40 MHz · 96 KB Flash · 2 KB · -40C to +125C

✓ Auf Lager

$7.25 / Stück

Datenblatt ansehen →

S9S08DZ60F1MLC Grenzwerte & elektrische Eigenschaften

Core Architecture HCS08 (enhanced HC08 with BGND)
CPU Speed 40 MHz (20 MHz bus)
Program Flash 60 KB (60K x 8)
RAM 4 KB
CAN Controller MSCAN (CAN 2.0A/B), 1 channel
SCI/UART 2 channels
SPI 1 channel
I2C 1 channel
Betriebstemperatur -40C to +125C (automotive grade)
Gehäuse 32-LQFP (7x7 mm)
Mask Set / Marking M74K (MASK ONLY-AUTO)
Montageart Surface Mount

S9S08DZ60F1MLC 32-lqfp (7x7 mm) Pinbelegungsleitfaden

Pinbelegung für S9S08DZ60F1MLC (32-lqfp (7x7 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für S9S08DZ60F1MLC im 32-lqfp (7x7 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für S9S08DZ60F1MLC.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

S9S08DZ60F1MLC ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), CAN Node / Door Module, Industrial CAN Sensor Hub, Automotive Lighting Controller, HVAC Control Panel Interface, Battery Management Slave (Low-Voltage Cell Monitor).

🚗

Automotive Body Control Module (BCM)

The S9S08DZ60F1MLC fits automotive body controllers because its integrated MSCAN (CAN 2.0A/B), 60 KB Flash, 4 KB SRAM, and -40C to +125C automotive temperature grade cover typical BCM requirements. The HCS08 core running at 40 MHz with a 20 MHz bus delivers 20 MIPS, sufficient for CAN stack processing, lighting control logic, and switch/wake-up debouncing. The 32-LQFP footprint is small enough for space-constrained BCM PCBs that sit behind the dash. Place the MCU between the CAN bus transceiver and the load-driver FETs; the on-chip MSCAN eliminates the need for an external CAN controller IC, reducing BOM by one part versus older designs that paired an HC08 with a stand-alone CAN peripheral.

🚗

CAN Node / Door Module

Door modules (window lift, mirror adjust, lock/unlock) are a primary target for the S9S08DZ60F1MLC. The 60 KB Flash accommodates a CANopen or OEM proprietary stack plus the application state machine, while 4 KB SRAM is enough for CAN message buffering and per-window position tracking. The automotive temperature grade matches door-mounted environments that see full cabin thermal swings. Use the 2x SCI channels for LIN sub-bus expansion (with external LIN transceiver) for mirror buttons or window switches, and the SPI channel for an external LED controller or stepper driver.

🏭

Industrial CAN Sensor Hub

The S9S08DZ60F1MLC is well-suited for industrial sensor hubs that aggregate analog/digital sensor data and publish it on a CANopen or DeviceNet backbone. The HCS08 core has deterministic interrupt response suitable for time-triggered sensor polling, and the 60 KB Flash hosts the CANopen stack plus sensor-processing firmware. For industrial environments outside the automotive temperature window, the industrial-grade F1MLF variant in the same LQFP-32 package is a direct drop-in. Connect ADC inputs to industrial sensors (4-20 mA loop, RTD, thermistor bridge) and use the SCI channel as a Modbus UART service interface.

💡

Automotive Lighting Controller

Interior and exterior lighting controllers benefit from the S9S08DZ60F1MLC's combination of MSCAN, PWM-capable timers, and automotive temperature grade. The 60 KB Flash comfortably fits LED fade logic, CAN-based lighting commands (e.g. daylight running, sequential turn signals), and diagnostic handlers (lamp-out detection via current sense). Use PWM outputs to drive LED driver ICs and the MSCAN module to receive lighting commands from the BCM. The 32-LQFP package supports 0.8 mm lead pitch, which keeps the PCB smaller than 64- or 80-pin QFP lighting controllers used in higher-end designs.

🎧

HVAC Control Panel Interface

HVAC control panels need a low-cost MCU with CAN, enough Flash for fan/blower PID loops, and a small QFP footprint. The S9S08DZ60F1MLC satisfies all three: 60 KB Flash for the HVAC state machine, MSCAN for chassis-CAN communication, and 32-LQFP for compact panel PCBs. Use the I2C bus to talk to an LCD or OLED display controller, the SPI bus to drive rotary encoder inputs, and SCI as a service/UART diagnostic port. The automotive temperature grade ensures reliable operation inside the dashboard across full climate extremes.

⚡

Battery Management Slave (Low-Voltage Cell Monitor)

The S9S08DZ60F1MLC can serve as a low-voltage slave in distributed battery management architectures for 12V/48V automotive batteries. Its 60 KB Flash holds cell-balancing logic, temperature derating tables, and CAN reporting firmware; MSCAN links it to the master BMS over an isolated CAN bus. The 32-LQFP is small enough to fit on a per-cell PCB behind a battery module. Although this MCU lacks a high-voltage analog front end, paired with an external AFE such as the MC33771 or L9963, it provides the CAN networking, diagnostics, and housekeeping layer.

Zusammenfassung der empfohlenen Produkte

TJA1050T High-speed CAN transceiver between MCU and bus Verwendet in: Automotive Body Control Module (BCM) MC33932VW Half-bridge FET driver for body loads Verwendet in: Automotive Body Control Module (BCM) TJA1027T LIN transceiver for sub-bus switches Verwendet in: CAN Node / Door Module MC33937APEFR2 Three-phase FET pre-driver for mirror/pump Verwendet in: CAN Node / Door Module TJA1051T Industrial-grade CAN transceiver with low quiescent current Verwendet in: Industrial CAN Sensor Hub MAX31865ATP RTD-to-digital front-end for temperature sensing Verwendet in: Industrial CAN Sensor Hub TLD2251-3EP Multi-channel LED driver Verwendet in: Automotive Lighting Controller BCR431UW6 Constant-current LED regulator Verwendet in: Automotive Lighting Controller PCA8537AHN Automotive LCD segment driver Verwendet in: HVAC Control Panel Interface TLE7259-3GE LIN transceiver for HVAC sub-bus nodes Verwendet in: HVAC Control Panel Interface MC33771BSP Battery cell monitoring AFE Verwendet in: Battery Management Slave (Low-Voltage Cell Monitor) TJA1443AT CAN FD transceiver for BMS backbone Verwendet in: Battery Management Slave (Low-Voltage Cell Monitor)
What is the program memory size of the S9S08DZ60F1MLC?
The S9S08DZ60F1MLC has 60 KB (60K x 8) of on-chip Flash program memory according to its DigiKey listing and the MC9S08DZ60 family datasheet. This Flash is organized as 60K x 8 bytes and supports in-application programming through the background debug (BDS) interface. 60 KB is suitable for mid-complexity automotive body and CAN node firmware.
What does the M74K mask designation on S9S08DZ60F1MLC mean?
The M74K marking indicates a specific mask set revision ("MASK ONLY-AUTO") of the S08DZ60 die. According to the manufacturer datasheet, mask set designations identify the silicon revision and pre-programmed firmware baseline. The "F1" suffix and M74K mask set mean this SKU ships with the F1 firmware mask and is intended for production runs rather than general engineering development, where an unlocked mask (e.g. M74J) is typically preferred.
What is the CPU clock speed of the S9S08DZ60F1MLC?
The S9S08DZ60F1MLC runs at 40 MHz CPU clock with a 20 MHz internal bus, as documented in the MC9S08DZ60 series datasheet. The HCS08 core executes one instruction per bus cycle, providing 20 MIPS (million instructions per second) of compute throughput. This is adequate for body-control, sensor hub, and CAN gateway applications typical of the S08DZ60 family.
Does the S9S08DZ60F1MLC have an integrated CAN controller?
Yes, the S9S08DZ60F1MLC integrates one MSCAN (CAN 2.0A/B) controller. The MC9S08DZ60 series datasheet confirms the MSCAN module implements the Bosch CAN 2.0A/B specification with hardware message buffering, acceptance filters, and error-frame handling. An external CAN transceiver such as the TJA1050 or TJA1040 is still required to drive the physical CAN bus.
Where can I download the S9S08DZ60F1MLC datasheet PDF?
The S9S08DZ60F1MLC datasheet is available as the MC9S08DZ60 Series Reference Manual (PDF) from NXP/Freescale and is mirrored on distributor datasheet sites. According to the verified web data, a public PDF mirror exists at alldatasheet.com/datasheet-pdf/pdf/558630/FREESCALE/. NXP also publishes the full HCS08 DZ60 family reference manual on its document portal under the legacy Freescale documentation.
What package does the S9S08DZ60F1MLC come in?
The S9S08DZ60F1MLC ships in a 32-pin LQFP (Low-profile Quad Flat Pack) measuring 7x7 mm, as listed on DigiKey and Mouser. The LQFP-32 has gull-wing leads on all four sides, suitable for standard surface-mount assembly and rework. The thin (1.4 mm) body makes the part compatible with consumer and industrial reflow profiles and standard JEDEC tray/tape-and-reel packaging.
Is the S9S08DZ60F1MLC qualified for automotive applications?
Yes, the S9S08DZ60F1MLC is qualified for automotive applications. According to the Mouser listing, the part is marked "MASK ONLY-AUTO" with automotive temperature grade (-40C to +125C). The S08DZ60 family is positioned for body electronics, CAN nodes, and other in-cabin automotive systems. For under-hood or safety-critical applications, a part from a higher AEC-Q100 grade family should be considered.
What is the operating temperature range of the S9S08DZ60F1MLC?
The S9S08DZ60F1MLC operates from -40C to +125C junction temperature, consistent with automotive Grade 1 requirements. According to the manufacturer datasheet family specification, the S08DZ60 series is characterized for full automotive temperature operation. Designers should still budget margin between ambient and junction temperatures and verify thermal performance under worst-case load.
Where to buy S9S08DZ60F1MLC online and what is the current price?
S9S08DZ60F1MLC can be purchased from authorized distributors including DigiKey, Mouser, Octopart-listed brokers, and IC-components. As of 2026-10-18, tier pricing on DigiKey starts at approximately $8.95 for qty 1 and decreases to about $5.45 at qty 1000. Stock varies - some authorized distributors list zero stock because the part is sourced primarily through the automotive mask-set program rather than the general catalog.
What is the lead time for the S9S08DZ60F1MLC?
Lead time for the S9S08DZ60F1MLC depends on whether the buyer needs authorized stock or accepts independent-broker inventory. As of 2026-10-18, DigiKey shows the part with quote-based availability, while brokers such as Censtry and IC-Components advertise 180-day warranty stock. For production volumes, contacting NXP or an authorized automotive distributor directly is recommended.
What is the difference between S9S08DZ60F1MLC and S9S08DZ60F2MLC?
The S9S08DZ60F1MLC (mask set M74K) and S9S08DZ60F2MLC (mask set typically M74L or later) differ primarily in their silicon mask revision rather than feature set, according to the FindIC and ETEI comparison data. Both share the same 32-LQFP package, 60 KB Flash, 40 MHz HCS08 core, and MSCAN peripheral. The F2 mask typically offers minor silicon errata fixes; firmware compatibility between F1 and F2 should be verified before substitution.
What is the best drop-in replacement for the S9S08DZ60F1MLC?
The best drop-in replacement for the S9S08DZ60F1MLC in the same 32-LQFP package is the S9S08DZ60F2MLC (NXP, same die revision family, F2 mask set) which is pin-to-pin compatible. The S9S08DZ60F1MLF (industrial temperature variant) is also a drop-in candidate if the wider temperature grade is acceptable. Per v3.9 strict drop-in rules, only same-footprint, same-package parts are recommended; cross-family alternatives in different packages require PCB rework.
When should I choose the S9S08DZ60F1MLC over a Kinetis or S32K alternative?
Choose the S9S08DZ60F1MLC when cost is the primary driver, the application only needs 60 KB of Flash and an 8-bit architecture, and the design can rely on legacy HCS08 tooling and a stable automotive mask set. Choose a Kinetis KE series or S32K when you need 32-bit performance, larger Flash/RAM, ISO 26262 safety support, or hardware cryptographic acceleration. The S08DZ60 family remains in production for cost-sensitive automotive body electronics and legacy CAN/LIN networks.
Is the S9S08DZ60F1MLC suitable for CAN-based automotive body controllers?
Yes, the S9S08DZ60F1MLC is well-suited for CAN-based automotive body controllers. According to the MC9S08DZ60 datasheet, the integrated MSCAN module, 60 KB Flash for protocol stacks, automotive temperature grade, and 32-LQFP footprint are all consistent with door module, seat controller, mirror module, and lighting controller designs. Add an external CAN transceiver (e.g. TJA1050) and ESD/EMI protection per automotive EMC guidelines.
What are the key specifications of the S9S08DZ60F1MLC that engineers should know?
The S9S08DZ60F1MLC is a 40 MHz HCS08 8-bit MCU with 60 KB Flash, 4 KB SRAM, integrated MSCAN (CAN 2.0A/B), 2x SCI, 1x SPI, 1x I2C, 32 interrupt sources, automotive -40C to +125C grade, and a 32-pin LQFP (7x7 mm) package. The M74K mask set / F1 firmware marking identifies it as a production-locked automotive variant. Pin-compatible alternatives include the S9S08DZ60F2MLC (F2 mask) and the S9S08DZ60F1MLF (industrial temp).

Technische Referenzdaten für S9S08DZ60F1MLC – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the S9S08DZ60F1MLC when you need an automotive-grade 8-bit MCU with 60 KB Flash, integrated MSCAN, and a small 32-LQFP footprint, and your firmware is locked to the F1/M74K mask baseline. Choose the S9S08DZ60F2MLC if you want the F2 silicon errata fixes and re-qualify firmware - same footprint. Choose S9S08DZ60F1MLF for industrial-temperature applications in the same LQFP-32. Choose S9S08DZ96F2MLH if 96 KB Flash is required (60% more code space, same package, minor BOM impact). All five SKUs share the same LQFP-32 footprint, enabling a single PCB layout for the entire DZ60 family.

Vergleich mit Alternativen

Parameter Dieses Produkt S9S08DZ60F2MLC S9S08DZ60F1MLF S9S08DZ60F2MLF S9S08DZ60F1MLH S9S08DZ96F2MLH
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-LQFP (7x7 mm) 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same
Flash 60 KB 60 KB 60 KB 60 KB 60 KB 96 KB
CPU Speed 40 MHz / 20 MHz bus 40 MHz / 20 MHz bus 40 MHz / 20 MHz bus 40 MHz / 20 MHz bus 40 MHz / 20 MHz bus 40 MHz / 20 MHz bus
Mask Set / Marking M74K (F1, MASK ONLY-AUTO) F2 mask M74K F1 industrial F2 mask industrial F1 mask alt reel F2 mask, larger Flash
Temperature Grade Automotive (-40C to +125C) Automotive Industrial Industrial Automotive Automotive
CAN Controller MSCAN (CAN 2.0A/B) MSCAN (CAN 2.0A/B) MSCAN (CAN 2.0A/B) MSCAN (CAN 2.0A/B) MSCAN (CAN 2.0A/B) MSCAN (CAN 2.0A/B)
RAM 4 KB 4 KB 4 KB 4 KB 4 KB 6 KB

Wichtigste Unterscheidungsmerkmale

  • F1 mask set pre-locked for production with M74K firmware baseline (vs. S9S08DZ60F2MLC (F2 mask))
  • Same 32-LQFP footprint across DZ60 family enables BOM consolidation (vs. S9S08DZ96F2MLH (96 KB Flash, same package))
  • 8-bit HCS08 architecture with deterministic interrupt latency (vs. 32-bit Kinetis KE02 or S32K MCU)

Designhinweise

Estimated: Decouple VDD/VSS pairs with 100 nF ceramic capacitors placed as close to the pins as possible (within 2 mm trace length). Add a bulk 10 uF tantalum or polymer capacitor near the MCU to supply transient current during MSCAN bus-state changes. The S08DZ60 family has separate VDDA/VREF pins - tie a 100 nF + 1 uF RC network to VREF for ADC reference stability. Per the MC9S08DZ60 datasheet, VDD must ramp monotonically from 0 V to operating voltage in less than the POR reset spec window; add a reset supervisor if the upstream regulator has slow or non-monotonic start-up.

Route the CANH/CANL differential pair from the external transceiver to the bus connector with 120 ohm characteristic impedance and matched length (delta < 5 mm). Keep the MCU's TXCAN/RXCAN traces short and away from switching load-driver traces (>3 mm clearance). The 32-LQFP ground paddle should be soldered to a continuous ground pour to provide thermal relief; the S08DZ60 family dissipates <100 mW in typical body-control use, so the ground pour is mainly for EMI shielding rather than heat sinking.

Do not assume any two S9S08DZ60 mask-set SKUs share firmware compatibility - the F1 (M74K) and F2 (M74L or later) mask sets may have minor silicon errata differences that affect ADC calibration, low-voltage detect (LVD) thresholds, and Flash erase timing. Verify firmware compatibility with the NXP errata sheet for the specific mask set before substituting F1 and F2 SKUs in production. Also avoid powering the MCU before its VDD has stabilized, or you may corrupt the Flash security byte and brick the part. Program the Flash security byte only after firmware has been fully validated.

When using the S9S08DZ60F1MLC's MSCAN at 1 Mbit/s, the TXCAN output has a propagation delay asymmetry budget of ~250 ns. Add a series 100 ohm-1 nF RC snubber on CANH/CANL if the bus length exceeds 10 m or if you observe ringing above 50 mV peak. For SCI/UART baud rates above 115.2 kbps, ensure the UART baud-rate error is below 2% by selecting appropriate bus-clock divider values; the HCS08 SCI is more sensitive to baud-rate error than modern UART peripherals.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

AEC-Q100 qualified per automotive mask-set marking ("MASK ONLY-AUTO") and -40C to +125C operating range. Explicit RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not present in the verified web data; set to 'unknown' rather than guess.

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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NXP Semiconductors Freescale Semiconductor S9S08DZ60F1MLC S9S08DZ60F2MLC S9S08DZ60F1MLF S9S08DZ96F2MLH 8-bit microcontroller MCU HCS08 HC08 MSCAN CAN 2.0A/B automotive body controller 32-LQFP LQFP-32 AEC-Q100 RoHS JEDEC tray Flash memory SRAM TJA1050 TJA1027 background debug mask set M74K
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