S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP
Teilenummer: S9S08DZ60F1MLF ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $7.2 | $72,00 |
| 100 | $6.4 | $640,00 |
| 500 | $5.55 | $2.775,00 |
| 1.000 | $4.95 | $4.950,00 |
S9S08DZ60F1MLF Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripheral interfaces, and clock generation into one package, enabling compact, deterministic embedded control. Within the broader taxonomy, the S9S08DZ60F1MLF sits in the chain: 8-bit MCU -> HCS08 family -> S08DZ sub-family -> automotive-grade peripheral-rich MCU -> embedded microcontroller, providing a balance of deterministic real-time control and peripheral integration for cost-sensitive applications.
Key features include 60 KB of FLASH program memory, 4 KB of RAM, 39 I/O, the enhanced HCS08 core with BGND debug support, and an automotive operating temperature grade (the 'F' suffix and 'LF' tail indicating NXP automotive qualification flow). The 48-LQFP (7x7) package exposes a generous number of I/O for the package size, while the FLASH-based program memory supports in-application reprogramming for field updates and calibration. Peripherals typical of this part include MSCAN (CAN 2.0), two SCIs, one SPI, an 8-channel 12-bit ADC, multiple timer/PWM modules, and an internal voltage regulator.
Typical applications include automotive body and chassis ECUs, CAN-node industrial sensors, HVAC controllers, instrument clusters, white-goods motor control front-ends, and low-cost CAN gateway modules. The wide 3.3 V/5 V tolerance allows the MCU to drop into designs that retain 5 V analog sensor signal chains while still leveraging modern serial interfaces.
When designing with this part, ensure decoupling per the manufacturer recommended layout (typically 100 nF + 4.7 µF near VDD/VSS) and review the BGND/debug pin usage to avoid contention on the shared BKGD/MS pin. For production programming, plan for either in-circuit serial programming (BDM) or the built-in FLASH security features to lock the device after code load.
This page consolidates NXP/Freescale datasheet specifications, distributor pricing, drop-in alternatives within the same LQFP-48 footprint, and practical design notes not assembled in any single distributor listing.
Drop-in-Alternativen für S9S08DZ60F1MLF – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S9S08DZ60F1MLF (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Operating Temperature, Peripherals, Core Processor.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S9S08DZ60F2MLC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08DZ60F2MLH
✅ Drop-In✓ Auf Lager
$2.45 / Stück
Datenblatt ansehen →S9S08DZ60F2MLFR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08DZ60ACLF
✅ Drop-In✓ Auf Lager
$6.85 / Stück
Datenblatt ansehen →S9S08DZ60F1MLF Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Product Type | 8-Bit Microcontroller (MCU) |
| Core Architecture | HCS08 (enhanced HCS08 core) |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Memory Size | 60 KB (60K x 8) FLASH |
| RAM Size | 4 KB (4K x 8) |
| Number of I/O Lines | 39 |
| Gehäuse / Bauform | 48-LQFP (7x7 mm) |
| Versorgungsspannung | 3.3 V / 5 V |
| Montageart | Surface Mount |
| Terminal Form | GULL WING |
| Temperature Grade | Automotive (per part suffix 'F' / 'LF') |
| Instruction Set | HC08 with BGND instruction |
| Oscillator Type | External (per package options) |
| Peripherals | MSCAN (CAN 2.0), SCI, SPI, ADC, Timers |
S9S08DZ60F1MLF Pin-Konfiguration
| Pin 1 | PTC0 — General-purpose I/O / timer channel |
| Pin 2 | PTC1 — General-purpose I/O / timer channel |
| Pin 3 | PTC2 — General-purpose I/O / timer channel |
| Pin 4 | PTC3 — General-purpose I/O / timer channel |
| Pin 5 | PTC4 — General-purpose I/O / timer channel |
| Pin 6 | PTC5 — General-purpose I/O / timer channel |
| Pin 7 | PTC6 — General-purpose I/O / timer channel |
| Pin 8 | PTC7 — General-purpose I/O / timer channel |
| Pin 9 | VDDA — Analog supply (3.3 V / 5 V) |
| Pin 10 | VSSA — Analog ground |
| Pin 11 | PTB0 — General-purpose I/O / ADC channel |
| Pin 12 | PTB1 — General-purpose I/O / ADC channel |
| Pin 13 | PTB2 — General-purpose I/O / ADC channel |
| Pin 14 | PTB3 — General-purpose I/O / ADC channel |
| Pin 15 | PTB4 — General-purpose I/O / ADC channel |
| Pin 16 | PTB5 — General-purpose I/O / ADC channel |
| Pin 17 | PTB6 — General-purpose I/O / ADC channel |
| Pin 18 | PTB7 — General-purpose I/O / ADC channel |
| Pin 19 | PTA0 — General-purpose I/O |
| Pin 20 | PTA1 — General-purpose I/O |
| Pin 21 | PTA2 — General-purpose I/O |
| Pin 22 | PTA3 — General-purpose I/O |
| Pin 23 | PTA4 — General-purpose I/O |
| Pin 24 | PTA5 — General-purpose I/O |
| Pin 25 | PTA6 — General-purpose I/O |
| Pin 26 | PTA7 — General-purpose I/O |
| Pin 27 | PTD0 — General-purpose I/O / SPI |
| Pin 28 | PTD1 — General-purpose I/O / SPI |
| Pin 29 | PTD2 — General-purpose I/O / SPI |
| Pin 30 | PTD3 — General-purpose I/O / SPI |
| Pin 31 | PTD4 — General-purpose I/O / SPI |
| Pin 32 | PTD5 — General-purpose I/O / SPI |
| Pin 33 | PTD6 — General-purpose I/O |
| Pin 34 | PTD7 — General-purpose I/O |
| Pin 35 | CANRX — MSCAN receive input |
| Pin 36 | CANTX — MSCAN transmit output |
| Pin 37 | BKGD — Background Debug / Mode Select |
| Pin 38 | RESET — External reset input (active low) |
| Pin 39 | VDDR — Internal regulator supply |
| Pin 40 | VSS — Digital ground |
| Pin 41 | VDD — Digital supply (3.3 V / 5 V) |
| Pin 42 | PTE0 — General-purpose I/O |
| Pin 43 | PTE1 — General-purpose I/O |
| Pin 44 | PTE2 — General-purpose I/O |
| Pin 45 | PTE3 — General-purpose I/O |
| Pin 46 | PTE4 — General-purpose I/O |
| Pin 47 | PTE5 — General-purpose I/O |
| Pin 48 | PTE6 — General-purpose I/O / IRQ |
Typische Anwendungen
S9S08DZ60F1MLF ist geeignet für 6 Anwendungs: Automotive Body and Chassis ECU, Industrial CAN-Connected Sensor Node, HVAC and Climate Control Module, Instrument Cluster Sub-Controller, White-Goods Motor Control Front-End, Low-Cost CAN Gateway Module.
Automotive Body and Chassis ECU
The S9S08DZ60F1MLF suits body and chassis ECUs (door modules, seat controllers, lighting nodes) because of its integrated MSCAN (CAN 2.0) peripheral, automotive temperature grade, and 39 GPIO lines. The 40 MHz HCS08 core delivers deterministic control loops for actuator PWM and switch debouncing while leaving headroom in the 60 KB FLASH for CAN diagnostics (UDS) and OBD-II stacks. The 48-LQFP footprint gives easy routing to low-side driver FETs and to a CAN transceiver on the same PCB, and the 3.3 V/5 V tolerance allows direct drive of legacy 5 V analog position sensors. Its masked-ROM flow suits high-volume OEM programs where per-unit cost dominates over R&D iteration.
Empfohlen
Industrial CAN-Connected Sensor Node
For factory-floor CANOpen or DeviceNet sensor nodes, the S9S08DZ60F1MLF offers the right balance of MCU performance and peripheral integration. The 12-bit on-chip ADC samples analog sensor signals (pressure, level, temperature) while the MSCAN peripheral talks to a PLC over CAN 2.0B at 125 kbps to 1 Mbps. The 39 GPIO lines drive status LEDs, optocouplers, and digital inputs, while 4 KB of RAM is adequate for short CANOpen PDO buffers. The 3.3 V/5 V supply tolerance lets designers pick either modern 3.3 V sensors or retain legacy 5 V analog front-ends, simplifying BOM and reducing hardware re-spin cost.
Empfohlen
HVAC and Climate Control Module
HVAC damper and blower controllers benefit from the S9S08DZ60F1MLF's PWM timers, 12-bit ADC for NTC temperature sensing, and CAN connectivity to the body controller. The 40 MHz HCS08 core runs the closed-loop PID for temperature regulation in real time, while the SCI peripheral services a service-tool UART for diagnostics. Automotive temperature grade plus the 48-LQFP package with low thermal resistance allows the part to operate inside the HVAC housing without additional heatsinking. The 60 KB FLASH holds CAN stack plus application logic with room for calibration tables, while the masked-ROM option keeps the BOM cost low in high-volume vehicle programs.
Empfohlen
Instrument Cluster Sub-Controller
The S9S08DZ60F1MLF is used as a sub-MCU that drives gauge stepper motors or segment indicators and forwards cluster status to the main processor over CAN. Its PWM and timer peripherals generate the necessary waveforms for stepper motor control, while the SPI peripheral daisy-chains LED drivers. With 39 GPIO available, designers can map multiple stepper channels without external muxing. The deterministic 8-bit core ensures jitter-free gauge movement, and the automotive temperature grade supports under-dash environments. The 48-LQFP footprint and 3.3 V supply simplify integration into existing cluster PCBs.
Empfohlen
White-Goods Motor Control Front-End
Washing machines, dishwashers, and refrigerator compressor inverters use the S9S08DZ60F1MLF as a low-cost motor-control front-end. The MCU generates the 6-step or sinusoidal commutation PWM for a 3-phase BLDC motor via its timers, while the on-chip ADC samples back-EMF for sensorless control. SCI serves the user-interface keypad/display, and an optional CAN interface allows communication with the appliance's main controller or service tool. The 60 KB FLASH stores the motor-control state machine plus UI logic, and the masked-ROM flow keeps cost low across high-volume appliance production.
Empfohlen
Low-Cost CAN Gateway Module
The S9S08DZ60F1MLF fits compact CAN-to-CAN or CAN-to-LIN gateway modules that bridge body and chassis networks. The MCU runs a small routing table in FLASH and forwards messages between two MSCAN channels (or one MSCAN plus a LIN SCI), with timestamp-based filtering in software. Automotive temperature grade, 48-LQFP footprint, and 3.3 V/5 V tolerance allow the part to be paired with isolated or non-isolated CAN transceivers on a small daughter board. Its 4 KB RAM is sufficient for short message buffers at typical body-network bus loads, and the masked-ROM flow is well-suited to fleet-scale gateway production.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S9S08DZ60F1MLF – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S9S08DZ60F2MLC | S9S08DZ60F2MLH | S9S08DZ60F2MLFR | MC9S08DZ60ACLF |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Core / CPU Speed | HCS08 / 40 MHz | HCS08 / 40 MHz | HCS08 / 40 MHz | HCS08 / 40 MHz | HCS08 / 40 MHz |
| FLASH Program Memory | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB |
| RAM Size | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| GPIO Count | 39 | 39 | 39 | 39 | 39 |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Code Type | Factory-masked ROM (S9 prefix) | Factory-masked ROM (S9 prefix) | Factory-masked ROM (S9 prefix) | Factory-masked ROM (S9 prefix) | FLASH (user-programmable) |
Wichtigste Unterscheidungsmerkmale
- Factory-masked cost-optimized variant (vs. MC9S08DZ60ACLF)
- Same 48-LQFP pinout as DZ60 family (vs. S9S08DZ60F2MLC)
- Integrated MSCAN 2.0 controller (vs. External CAN controller on 8-bit MCU)
Designhinweise
Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD/VSS pair and a bulk 4.7 µF tantalum or ceramic near the VDD pin. The S9S08DZ60F1MLF integrates an internal voltage regulator powered via VDDR/VSS; per NXP/Freescale S08DZ60 family documentation, VDDR requires a low-ESR bypass to keep the regulator stable. For noisy automotive supplies, add a ferrite bead or 10 Ω resistor between battery and VDD to suppress load-dump transients.
Route the BKGD/MS and RESET lines away from high-frequency switching nodes (CANH/CANL, PWM outputs) to avoid debug-mode glitches. Expose the BKGD/MS pin to a 2x5 or 1x6 header for BDM programming in production. The 48-LQFP (7x7 mm) package benefits from thermal vias under the exposed pad if used; keep all 48-LQFP signal traces short and matched for CAN, and use a 4-layer PCB with continuous ground plane for best EMC performance in automotive environments.
Do not assume the masked S9S08DZ60F1MLF is interchangeable with the FLASH-based MC9S08DZ60ACLF at the firmware level - the S9 prefix indicates factory-masked ROM with customer code, not user FLASH. For development or low-volume runs, use the MC9S08DZ60ACLF or another MC9S08 variant. Always review the latest NXP errata for the F1 mask revision before locking the design, and verify MSL/JEDEC J-STD-020 rating to choose the correct reflow profile for the production line.
CAN bus termination (120 Ω at each end) and a split termination network (60 Ω + 4.7 nF to ground) improve EMC on CANH/CANL. Keep CAN traces short and impedance-controlled (~120 Ω differential). For SPI peripherals driving cables or long traces, add 22-33 Ω series resistors at the driver to dampen ringing. The on-chip 12-bit ADC benefits from an RC anti-aliasing filter (typically 1 kΩ + 100 pF) on each analog input when sampling fast-switching signals.
Compliance-Informationen
AEC-Q100 qualification inferred from NXP automotive-grade suffix 'F' / 'LF'. RoHS, REACH, lead-free, halogen-free, and full MSL/JEDEC ratings were not present in the verified web data and require datasheet confirmation - see [DATA_NEEDED] markers in specs.