SI5330F-B00214-GM - 1:8 LVCMOS Clock Buffer | Skyworks | 200MHz
Teilenummer: SI5330F-B00214-GM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.47 | $3,47 |
| 10 | $3.12 | $31,20 |
| 100 | $2.78 | $278,00 |
| 500 | $2.49 | $1.245,00 |
| 1.000 | $2.21 | $2.210,00 |
SI5330F-B00214-GM Übersicht
A clock buffer (also called a clock fanout buffer or clock driver) is a non-PLL timing component that reproduces one incoming clock reference into multiple low-skew copies. Within the timing hierarchy, clock buffers sit below clock generators and PLL-based synthesizers and above the load devices (processors, FPGAs, transceivers, memory). They are used whenever a single oscillator or PLL output must be distributed across a PCB with minimal additive jitter and tight output-to-output skew, without multiplying or dividing the frequency.
Key features of the SI5330F-B00214-GM include support for differential input clock signals (LVPECL, LVDS, HCSL) as well as single-ended CMOS/SSTL/HSTL inputs, four user-selectable output frequency dividers per output pair (÷1, ÷2, ÷4, ÷8), per-bank output voltage translation, and individual output enable pins. Its non-PLL architecture means ultra-low additive jitter (sub-ps RMS typical) and zero output-output skew between same-bank outputs. The 24-QFN exposed pad provides a thermal pad for low-impedance ground return and package-level bypassing.
Typical applications include high-performance PCB clock distribution in networking switches/routers, server and storage backplanes, telecommunications line cards, FPGA/ASIC reference clock fanout, PCIe Gen2/3 reference distribution, and industrial control backplanes. The flexible per-bank output voltage translation makes it suitable when downstream devices (e.g., an FPGA core and a DDR memory controller) operate at different logic levels on the same board.
When designing with this device, ensure the exposed pad is soldered to a continuous ground plane for thermal and electrical performance. Decouple each VDD pin with a 0.1 uF ceramic capacitor placed within 3 mm of the pin, and respect the 50 ohm transmission-line routing on each output if traces exceed approximately 25 mm.
Drop-in-Alternativen für SI5330F-B00214-GM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SI5330F-B00214-GM (gleiche Bauform und Footprint) – abweichend in Function, Number of Outputs, Package, Supply Voltage, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SI5330F-B00215-GMR
✅ Drop-In✓ Auf Lager
$2.55 / Stück
Datenblatt ansehen →SI5330L-B00230-GM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SI5338A-B02137-GM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PI6C557-03AQE
✅ Drop-In✓ Auf Lager
$0.74 / Stück
Datenblatt ansehen →PI49FCT3807AQE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SI5330F-B00214-GM Technische Daten
| Funktion | Clock Fanout Buffer, Level Translator |
| Number of Inputs | 1 |
| Anzahl der Ausgänge | 8 (single-ended) or 4 (differential) |
| Input Type | Single-ended CMOS/SSTL/HSTL or Differential LVPECL/LVDS/HCSL |
| Ausgangstyp | LVCMOS (single-ended) or LVPECL/LVDS/HCSL (differential) |
| Maximum Frequency | 200 MHz |
| Versorgungsspannung | 1.8 V, 2.5 V, or 3.3 V |
| Betriebstemperatur | -40 C to +85 C |
| Gehäuse | 24-pin QFN Exposed Pad (4x4 mm) |
| Montageart | Surface Mount |
| Additive Jitter | Sub-picosecond RMS typical (non-PLL architecture) |
| Output Dividers | ÷1, ÷2, ÷4, ÷8 selectable per output pair |
| Output Enable Pins | Yes, per output |
| RoHS-Status | Compliant |
SI5330F-B00214-GM Pin-Konfiguration
| Pin 1 | VDD_DIG — Digital supply (1.8/2.5/3.3 V) |
| Pin 2 | OE_Q0 — Output enable for Q0 (active high per Si5330 family) |
| Pin 3 | Q0 — Clock output 0 (LVCMOS or differential pair member) |
| Pin 4 | VDD_Q0 — Output supply bank Q0 |
| Pin 5 | Q1 — Clock output 1 |
| Pin 6 | OE_Q1 — Output enable for Q1 |
| Pin 7 | GND — Ground |
| Pin 8 | VDD_Q1 — Output supply bank Q1 |
| Pin 9 | Q2 — Clock output 2 |
| Pin 10 | OE_Q2 — Output enable for Q2 |
| Pin 11 | VDD_Q2 — Output supply bank Q2 |
| Pin 12 | Q3 — Clock output 3 |
| Pin 13 | OE_Q3 — Output enable for Q3 |
| Pin 14 | GND — Ground |
| Pin 15 | VDD_Q3 — Output supply bank Q3 |
| Pin 16 | CLK_IN+ — Differential clock input true |
| Pin 17 | CLK_IN- — Differential clock input complement |
| Pin 18 | VDD_IN — Input supply |
| Pin 19 | SDA/SA0 — Configuration strap (per Si5330 datasheet) |
| Pin 20 | SCL/SA1 — Configuration strap |
| Pin 21 | DIV_SEL0 — Output divider select 0 |
| Pin 22 | DIV_SEL1 — Output divider select 1 |
| Pin 23 | TEST — Factory test pin (per Si5330 datasheet) |
| Pin 24 | VDD_DIG — Digital supply |
Typische Anwendungen
SI5330F-B00214-GM ist geeignet für 6 Anwendungs: Networking Switch / Router Clock Distribution, Server / Storage Backplane Clock Fanout, Telecommunications Line Card Reference Clock, FPGA / ASIC Reference Clock Distribution, PCIe Gen2 / Gen3 Reference Clock Distribution, Industrial Control Backplane Clock Tree.
Networking Switch / Router Clock Distribution
The SI5330F-B00214-GM is well suited for distributing a single reference clock across a switch or router PCB. Its 1:8 fanout, sub-picosecond additive jitter, and up to 200 MHz operating range cover the typical 25-156.25 MHz Ethernet and PCIe reference frequencies used by switch ASICs and PHYs. Placed between a front-end oscillator and the line-card ASIC, it provides eight low-skew copies without adding PLL-induced jitter, simplifying PCB clock tree design.
Empfohlen
Server / Storage Backplane Clock Fanout
In server and storage platforms, the SI5330F-B00214-GM fans a system clock to multiple downstream devices (CPUs, DDR memory controllers, SAS/SATA controllers, BMC chips). Its 24-QFN EP package and per-bank output enable pins make it useful for staged power-up of backplane devices. The non-PLL architecture guarantees no clock drift between distributed outputs, critical for multi-source clocking in mission-critical servers.
Empfohlen
Telecommunications Line Card Reference Clock
Telecom line cards require a clean, low-jitter reference clock distributed to framer/mapper ASICs, SERDES, and DSP chips. The SI5330F-B00214-GM accepts an LVPECL/LVDS/HCSL reference and re-drives it as either LVCMOS or differential outputs, providing per-bank level translation. The device's 200 MHz upper limit accommodates 155.52 MHz and 161.13 MHz typical telecom reference frequencies used by SONET/SDH and OTN framers.
Empfohlen
FPGA / ASIC Reference Clock Distribution
An FPGA or ASIC on a high-speed board typically requires multiple low-skew reference clocks feeding its transceivers, PLLs, and logic fabric. The SI5330F-B00214-GM drives up to eight LVCMOS copies or four differential copies of a single reference, ideal when the FPGA's internal PLLs cannot tolerate high skew between multiple external input pins. The exposed-pad QFN package keeps the device close to the FPGA clock pins, minimizing trace length and transmission-line effects.
Empfohlen
PCIe Gen2 / Gen3 Reference Clock Distribution
PCIe reference clocks at 100 MHz must meet stringent jitter and skew requirements across multiple endpoints. The SI5330F-B00214-GM supports 100 MHz HCSL outputs with sub-picosecond additive jitter, well within PCIe Gen2 jitter envelopes. For multi-slot PCIe backplanes, place one Si5330F-B00214-GM per slot or use cascaded buffers; per-output enables also allow unused slots to be powered down without disrupting active endpoints.
Empfohlen
Industrial Control Backplane Clock Tree
Industrial backplanes with multiple microcontrollers, ADCs, and digital isolators often need synchronized sampling clocks distributed across long trace runs. The SI5330F-B00214-GM's 24-QFN EP package and per-bank output voltage translation allow a single oscillator to feed 3.3 V MCUs and 1.8 V ADCs simultaneously. The -40 C to +85 C industrial temperature grade supports factory-floor and outdoor cabinet installations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SI5330F-B00214-GM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SI5330F-B00215-GMR | SI5330L-B00230-GM | SI5338A-B02137-GM | PI6C557-03AQE | PI49FCT3807AQE |
|---|---|---|---|---|---|---|
| Package | QFN-24 EP (4x4 mm) | QFN-24 EP - same | QFN-24 EP - same | QFN-24 EP - same | QFN-24 EP - same | QFN-24 EP - same |
| Brand | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Diodes Incorporated | Diodes Incorporated |
| Fanout Ratio | 1:8 | 1:8 | 1:8 | 1:8 | 1:4 | 1:10 |
| Max Frequency | 200 MHz | 200 MHz | 200 MHz | 710 MHz | 200 MHz | 200 MHz |
| Output Type | LVCMOS / LVPECL / LVDS / HCSL | LVCMOS / LVPECL / LVDS / HCSL | LVCMOS / LVPECL / LVDS / HCSL | LVCMOS / LVPECL / LVDS / HCSL | LVDS / LVCMOS | LVCMOS |
| Supply Voltage | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 1.8 / 2.5 / 3.3 V | 2.5 / 3.3 V | 3.3 V |
| Output Dividers | ÷1, ÷2, ÷4, ÷8 per pair | ÷1, ÷2, ÷4, ÷8 per pair | ÷1, ÷2, ÷4, ÷8 per pair | ÷1, ÷2, ÷4, ÷8 per pair | ÷1 only | ÷1 only |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Wichtigste Unterscheidungsmerkmale
- Per-bank output voltage translation (vs. PI6C557-03AQE)
- Factory-selectable output dividers ÷1, ÷2, ÷4, ÷8 (vs. PI49FCT3807AQE)
- Both differential and CMOS output standards (vs. PI49FCT3807AQE)
Designhinweise
Solder the exposed thermal pad of the QFN-24 package to a continuous ground plane using a 4x4 thermal via array (0.3 mm drill, 0.5 mm pitch). Place four 0.1 uF X7R ceramic decoupling capacitors within 3 mm of each VDD pin (VDD_DIG, VDD_IN, VDD_Q0..Q3) and a 10 uF bulk capacitor nearby. Maintain 50 ohm characteristic impedance on all output traces and use length matching within each bank to keep output-to-output skew at the datasheet limit.
For LVCMOS outputs driving traces longer than 25 mm, use a 33 ohm series damping resistor at the output pin to suppress overshoot and ringing. For differential LVPECL/LVDS/HCSL outputs, route as 100 ohm differential pairs and AC-couple if the downstream device's common-mode voltage differs from VDD_Qx. Always terminate differential outputs at the receiver with a 100 ohm resistor across the pair, per the Si5330 datasheet typical application.
Do not leave the unused input pin of the differential input floating; tie CLK_IN- to VDD_IN through 10 kohm if unused. Output dividers and level-translation banks are strap-configured at the factory for the B00214 code; do not rewire SA0/SA1/DIV_SEL pins on a B00214 variant to obtain B00215 behavior - it will not meet datasheet specs. Confirm the SI5330F-B00214-GM's 200 MHz upper limit before using it for SERDES reference clocks above 161.13 MHz.
Compliance-Informationen
RoHS and REACH compliance per Skyworks product page. Not AEC-Q100 qualified (industrial grade only).
