SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
Teilenummer: SPAK56F803BU80 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $21.8 | $2.180,00 |
| 500 | $18.9 | $9.450,00 |
| 1.000 | $16.25 | $16.250,00 |
SPAK56F803BU80 Übersicht
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture is tuned for the repetitive, high-throughput numerical operations (multiply-accumulate, FIR/IIR filtering, FFTs, PID loops) that overwhelm a general-purpose MCU. The DSP56F803 unifies DSP and MCU functionality in a single C-efficient core, exposing bit-manipulation instructions, hardware DO/REP loops, a 14-addressing-mode instruction set, and a MAC unit so a single chip can run both control code and signal-processing kernels without a dual-core architecture.
Key features include a 40 MIPS core, on-chip program and data memory, integrated peripherals (PWMs, ADCs, timers, communication ports), and an industrial operating temperature range. The 100-pin LFQFP package provides ample I/O for motor-control and power-conversion designs while using a 1.0 mm or 0.5 mm gull-wing lead pitch compatible with standard reflow and fine-pitch assembly lines.
Technically, the DSP56F803 family is built on a Harvard-style architecture with separate program and data buses, dual on-chip RAM blocks, and a peripheral set including PWM modules for 3-phase motor control. Code development is supported by the Freescale/NXP CodeWarrior toolchain and the Processor Expert configuration environment, enabling rapid prototyping in C and assembly.
Typical applications include AC induction motor drives, BLDC/PMSM servo control, industrial inverters, uninterruptible power supplies (UPS), and audio/sensor signal conditioning. The industrial temperature grade and on-chip peripherals reduce BOM cost in motor-control designs.
Design consideration: when laying out the 100-pin LFQFP, place decoupling capacitors within 5 mm of each supply pin and provide a continuous ground pour beneath the package to keep switching-noise from coupling into the analog ADC inputs.
This page synthesizes distributor pricing for the SPAK56F803BU80, drop-in LFQFP-100 alternatives, and practical design notes not found in the manufacturer datasheet, making it easier to evaluate and source the part for new designs and legacy reorders.
Drop-in-Alternativen für SPAK56F803BU80 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SPAK56F803BU80 (gleiche Bauform und Footprint) – abweichend in Architecture, Package, Performance, Typical Applications.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSP56F803BU80E
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →DSP56F803BU100
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSP56F805BU80
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSP56F807BU80
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSP56F801FA80E
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.48 / Stück
Datenblatt ansehen →SPAK56F803BU80 Technische Daten
| Product Type | 16-bit Digital Signal Processor |
| Core Architecture | DSP56F803 (DSP + MCU unified core) |
| Core Frequency | 80 MHz |
| Core Performance | 40 MIPS |
| Instruction Set | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops |
| Addressing Modes | 14 addressing modes |
| Gehäuse | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) |
| Package Outline | 100 terminals, square, gull-wing lead form |
| Operating Temperature Grade | Industrial |
| Montageart | Surface Mount |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Typical Applications | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning |
SPAK56F803BU80 100 terminals, square, gull-wing lead form Pinbelegungsleitfaden
Pinbelegung für SPAK56F803BU80 (100 terminals, square, gull-wing lead form-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für SPAK56F803BU80.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SPAK56F803BU80 ist geeignet für 7 Anwendungs: AC Induction Motor Drive, BLDC / PMSM Servo Control, Industrial Inverter (Solar / Welding / UPS), Audio & Sensor Signal Conditioning, Power Factor Correction (PFC) Stage, Industrial Sensor Hub / Data Acquisition, Automotive Auxiliary Motor Control (Legacy).
AC Induction Motor Drive
The SPAK56F803BU80's 40 MIPS core, on-chip PWM modules, and integrated ADC make it well-suited to vector-control AC induction motor drives running field-oriented control (FOC) or V/Hz loops. Its DSP-style MAC and 14-addressing-mode ISA execute Park/Clarke transforms and PI current loops in microseconds, while the MCU-friendly instruction set handles supervisory state machines, fault handling, and CAN/serial comms on the same core. The 100-pin LFQFP exposes enough I/O for six IGBT gate-driver signals, three-phase current sensing via the ADC, and encoder/tachometer inputs. Industrial-temperature grading supports enclosed drive cabinets. The unified DSP+MCU architecture eliminates the dual-chip solution common in older motor controllers, reducing BOM cost.
Empfohlen
BLDC / PMSM Servo Control
Brushless DC and permanent-magnet synchronous motor servo drives use the SPAK56F803BU80's hardware DO/REP loops and MAC unit to run sinusoidal FOC at high PWM rates without taxing the core. The 80 MHz/40 MIPS throughput leaves headroom for cascaded position-velocity-current loops, encoder feedback, and trajectory planning in real time. The LFQFP-100 footprint provides pins for three-phase PWM, Hall/encoder inputs, brake/coast signals, and a serial interface to a higher-level controller. Freescale/NXP Processor Expert libraries include ready-to-port BLDC and PMSM reference designs for the DSP56F803 family. Industrial temperature rating is suitable for servo-amplifier enclosures.
Empfohlen
Industrial Inverter (Solar / Welding / UPS)
Industrial solar inverters, welding power sources, and uninterruptible power supplies use the SPAK56F803BU80 to implement grid-tie synchronization, MPPT, and current-mode control loops. The 40 MIPS core handles RMS calculations, PLL locking, and sine-PWM generation, while the on-chip timers trigger ADC sampling at precise switching instants. The LFQFP-100 provides enough GPIO for IGBT gate drivers, contactor/relay control, and isolated comms. The industrial temperature grade tolerates the elevated ambient inside sealed inverter cabinets. CodeWarrior and Processor Expert reference designs accelerate inverter firmware development.
Empfohlen
Audio & Sensor Signal Conditioning
The SPAK56F803BU80's DSP pipeline is well-suited to audio processing, active noise cancellation, and sensor-signal conditioning. Its 16-bit MAC and 14 addressing modes implement FIR/IIR filters, spectral analysis, and adaptive algorithms in real time, while the unified MCU ISA handles user-interface, comms, and housekeeping on the same core. The 100-pin LFQFP exposes serial audio ports, ADC inputs for microphones/sensors, and PWMs for class-D amplifier drive. Industrial temperature grading supports factory-floor audio/sensor installations. The same chip can run a single-channel ANC, a vibration analyzer, or a precision sensor linearizer without external DSP coprocessors.
Empfohlen
Power Factor Correction (PFC) Stage
Digital PFC stages in industrial power supplies use the SPAK56F803BU80 to execute average-current-mode control, run RMS/THD calculations, and synchronize to the AC line. Its 40 MIPS throughput handles the required multiply-accumulate math at typical 50/60 Hz line frequencies, while the on-chip ADC samples input voltage and current. The LFQFP-100 footprint supports the analog front-end, gate-driver control, and protection signals needed for a bridgeless PFC. Industrial temperature grading suits SMPS environments. The unified DSP+MCU ISA keeps supervisory logic and PFC math on one core.
Empfohlen
Industrial Sensor Hub / Data Acquisition
Multi-sensor industrial data-acquisition hubs leverage the SPAK56F803BU80's DSP core to perform on-board FFTs, FIR filtering, and statistical analysis on vibration, temperature, or strain-gauge data. The MCU-friendly instruction set handles the Modbus/CAN/Ethernet comms stack that delivers processed data to a higher-level PLC. The 100-pin LFQFP provides ample pins for multiple ADC inputs, SPI/I2C sensor buses, and isolated comms. Industrial temperature grading tolerates factory-floor installations. The single-chip DSP+MCU architecture replaces external DSP coprocessors used in older sensor hubs.
Empfohlen
Automotive Auxiliary Motor Control (Legacy)
Although the SPAK56F803BU80 is industrial-grade and not AEC-Q100 qualified, it is widely deployed in non-safety automotive auxiliary applications such as HVAC blowers, water pumps, and electric fans where industrial temperature grading suffices. The 40 MIPS core runs sensorless or Hall-sensor BLDC algorithms, while the on-chip peripherals drive the power stage. The LFQFP-100 is a proven automotive-assembly package. Note: AEC-Q100 is NOT applicable to this part - for safety-relevant designs, migrate to AEC-Q100-qualified MC56F8xxx or TMS320F280xx Piccolo. The same DSP56F803 toolchain and firmware patterns port directly.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPAK56F803BU80 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSP56F803BU80 | DSP56F803BU100 | DSP56F805BU80 | DSP56F807BU80 | DSP56F801FA80 |
|---|---|---|---|---|---|---|
| Package | LFQFP-100 (gull-wing) | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | DSP56F803 | DSP56F803 (identical die) | DSP56F803 (identical die) | DSP56F805 (sibling die, more memory) | DSP56F807 (higher-memory sibling) | DSP56F801 (lower-memory sibling) |
| Core Frequency | 80 MHz | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same |
| MIPS | 40 MIPS | 40 MIPS - same | 40 MIPS - same | 40 MIPS - same | 40-60 MIPS (family) | 40 MIPS - same |
| Temperature Grade | Industrial | Industrial - same | Industrial - same | Industrial - same | Industrial - same | Industrial - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Primary Use Case | Motor control + DSP | Motor control + DSP - same | Motor control + DSP - same | Motor control + DSP - same | Higher-end motor control | Lower-cost motor control |
Wichtigste Unterscheidungsmerkmale
- Unified DSP+MCU architecture eliminates dual-chip designs (vs. DSP56F801FA80)
- Established 100-pin LFQFP ecosystem (vs. DSP56F803BU80)
- Industrial temperature rating for harsh environments (vs. DSP56F807BU80)
Designhinweise
Estimated: Place 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pin pair of the SPAK56F803BU80's LFQFP-100 footprint. For the analog AVDD pins driving the on-chip ADC, use a 10 nF + 100 nF + 10 uF three-cap stack and route analog ground back to a dedicated AGND pour that ties to the main ground at a single point near the regulator. This keeps switching-noise from the digital core out of the ADC input paths, which is critical for motor-current sensing.
Estimated: the LFQFP-100 package on the SPAK56F803BU80 has a typical theta_JA of around 50-55 C/W on a standard 4-layer JEDEC PCB. At an industrial 85 C ambient, the chip can dissipate roughly 1.2 W without a heatsink. For motor-control designs running heavy ADC sampling and PWM at high duty, expose the thermal pad copper (if present) or stitch a copper pour under the package to keep junction rise under 25 C.
The SPAK56F803BU80 is NRND; do not design it into new production programs without a Rochester Electronics last-time-buy agreement. Also note that the LFQFP-100 fine-pitch lead spacing (typically 0.5 mm) requires precise stencil design - 6-mil stencil thickness over QFP pads is recommended for lead-free reflow to prevent solder shorts and head-in-pillow defects.
Route PWM outputs and ADC analog inputs on opposite sides of the package to minimize capacitive coupling. Place the JTAG/debug header within 50 mm of the JTAG pins to keep TCK rise times clean. Keep the crystal/oscillator traces short and surrounded by ground pour to avoid jitter in PWM timing critical for sinusoidal motor control.
Compliance-Informationen
RoHS and REACH compliance are not confirmed in the verified web data; verify with NXP product documentation. AEC-Q100 not applicable - this is an industrial-grade part; for automotive safety designs migrate to AEC-Q100-qualified MC56F8xxx. Lifecycle is NRND.
