SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
MPN: SPAK56F803BU80 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $21.8 | $2,180.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $16.25 | $16,250.00 |
SPAK56F803BU80 Overview
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture is tuned for the repetitive, high-throughput numerical operations (multiply-accumulate, FIR/IIR filtering, FFTs, PID loops) that overwhelm a general-purpose MCU. The DSP56F803 unifies DSP and MCU functionality in a single C-efficient core, exposing bit-manipulation instructions, hardware DO/REP loops, a 14-addressing-mode instruction set, and a MAC unit so a single chip can run both control code and signal-processing kernels without a dual-core architecture.
Key features include a 40 MIPS core, on-chip program and data memory, integrated peripherals (PWMs, ADCs, timers, communication ports), and an industrial operating temperature range. The 100-pin LFQFP package provides ample I/O for motor-control and power-conversion designs while using a 1.0 mm or 0.5 mm gull-wing lead pitch compatible with standard reflow and fine-pitch assembly lines.
Technically, the DSP56F803 family is built on a Harvard-style architecture with separate program and data buses, dual on-chip RAM blocks, and a peripheral set including PWM modules for 3-phase motor control. Code development is supported by the Freescale/NXP CodeWarrior toolchain and the Processor Expert configuration environment, enabling rapid prototyping in C and assembly.
Typical applications include AC induction motor drives, BLDC/PMSM servo control, industrial inverters, uninterruptible power supplies (UPS), and audio/sensor signal conditioning. The industrial temperature grade and on-chip peripherals reduce BOM cost in motor-control designs.
Design consideration: when laying out the 100-pin LFQFP, place decoupling capacitors within 5 mm of each supply pin and provide a continuous ground pour beneath the package to keep switching-noise from coupling into the analog ADC inputs.
This page synthesizes distributor pricing for the SPAK56F803BU80, drop-in LFQFP-100 alternatives, and practical design notes not found in the manufacturer datasheet, making it easier to evaluate and source the part for new designs and legacy reorders.
Drop-in alternatives for SPAK56F803BU80 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SPAK56F803BU80 (same form factor and footprint) — differing in Architecture, Package, Performance, Typical Applications.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSP56F803BU80E
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSP56F803BU100
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSP56F805BU80
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSP56F807BU80
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSP56F801FA80E
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.48 / Unit
View Datasheet →SPAK56F803BU80 Specifications
| Product Type | 16-bit Digital Signal Processor |
| Core Architecture | DSP56F803 (DSP + MCU unified core) |
| Core Frequency | 80 MHz |
| Core Performance | 40 MIPS |
| Instruction Set | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops |
| Addressing Modes | 14 addressing modes |
| Package | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) |
| Package Outline | 100 terminals, square, gull-wing lead form |
| Operating Temperature Grade | Industrial |
| Mounting Type | Surface Mount |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Typical Applications | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning |
SPAK56F803BU80 100 terminals, square, gull-wing lead form Pin Configuration Guide
Pin configuration for SPAK56F803BU80 (100 terminals, square, gull-wing lead form package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for SPAK56F803BU80.
Refer to the datasheet for full pin configuration.
Typical Applications
SPAK56F803BU80 is suitable for 7 applications: AC Induction Motor Drive, BLDC / PMSM Servo Control, Industrial Inverter (Solar / Welding / UPS), Audio & Sensor Signal Conditioning, Power Factor Correction (PFC) Stage, Industrial Sensor Hub / Data Acquisition, Automotive Auxiliary Motor Control (Legacy).
AC Induction Motor Drive
The SPAK56F803BU80's 40 MIPS core, on-chip PWM modules, and integrated ADC make it well-suited to vector-control AC induction motor drives running field-oriented control (FOC) or V/Hz loops. Its DSP-style MAC and 14-addressing-mode ISA execute Park/Clarke transforms and PI current loops in microseconds, while the MCU-friendly instruction set handles supervisory state machines, fault handling, and CAN/serial comms on the same core. The 100-pin LFQFP exposes enough I/O for six IGBT gate-driver signals, three-phase current sensing via the ADC, and encoder/tachometer inputs. Industrial-temperature grading supports enclosed drive cabinets. The unified DSP+MCU architecture eliminates the dual-chip solution common in older motor controllers, reducing BOM cost.
Recommended
BLDC / PMSM Servo Control
Brushless DC and permanent-magnet synchronous motor servo drives use the SPAK56F803BU80's hardware DO/REP loops and MAC unit to run sinusoidal FOC at high PWM rates without taxing the core. The 80 MHz/40 MIPS throughput leaves headroom for cascaded position-velocity-current loops, encoder feedback, and trajectory planning in real time. The LFQFP-100 footprint provides pins for three-phase PWM, Hall/encoder inputs, brake/coast signals, and a serial interface to a higher-level controller. Freescale/NXP Processor Expert libraries include ready-to-port BLDC and PMSM reference designs for the DSP56F803 family. Industrial temperature rating is suitable for servo-amplifier enclosures.
Recommended
Industrial Inverter (Solar / Welding / UPS)
Industrial solar inverters, welding power sources, and uninterruptible power supplies use the SPAK56F803BU80 to implement grid-tie synchronization, MPPT, and current-mode control loops. The 40 MIPS core handles RMS calculations, PLL locking, and sine-PWM generation, while the on-chip timers trigger ADC sampling at precise switching instants. The LFQFP-100 provides enough GPIO for IGBT gate drivers, contactor/relay control, and isolated comms. The industrial temperature grade tolerates the elevated ambient inside sealed inverter cabinets. CodeWarrior and Processor Expert reference designs accelerate inverter firmware development.
Recommended
Audio & Sensor Signal Conditioning
The SPAK56F803BU80's DSP pipeline is well-suited to audio processing, active noise cancellation, and sensor-signal conditioning. Its 16-bit MAC and 14 addressing modes implement FIR/IIR filters, spectral analysis, and adaptive algorithms in real time, while the unified MCU ISA handles user-interface, comms, and housekeeping on the same core. The 100-pin LFQFP exposes serial audio ports, ADC inputs for microphones/sensors, and PWMs for class-D amplifier drive. Industrial temperature grading supports factory-floor audio/sensor installations. The same chip can run a single-channel ANC, a vibration analyzer, or a precision sensor linearizer without external DSP coprocessors.
Recommended
Power Factor Correction (PFC) Stage
Digital PFC stages in industrial power supplies use the SPAK56F803BU80 to execute average-current-mode control, run RMS/THD calculations, and synchronize to the AC line. Its 40 MIPS throughput handles the required multiply-accumulate math at typical 50/60 Hz line frequencies, while the on-chip ADC samples input voltage and current. The LFQFP-100 footprint supports the analog front-end, gate-driver control, and protection signals needed for a bridgeless PFC. Industrial temperature grading suits SMPS environments. The unified DSP+MCU ISA keeps supervisory logic and PFC math on one core.
Recommended
Industrial Sensor Hub / Data Acquisition
Multi-sensor industrial data-acquisition hubs leverage the SPAK56F803BU80's DSP core to perform on-board FFTs, FIR filtering, and statistical analysis on vibration, temperature, or strain-gauge data. The MCU-friendly instruction set handles the Modbus/CAN/Ethernet comms stack that delivers processed data to a higher-level PLC. The 100-pin LFQFP provides ample pins for multiple ADC inputs, SPI/I2C sensor buses, and isolated comms. Industrial temperature grading tolerates factory-floor installations. The single-chip DSP+MCU architecture replaces external DSP coprocessors used in older sensor hubs.
Recommended
Automotive Auxiliary Motor Control (Legacy)
Although the SPAK56F803BU80 is industrial-grade and not AEC-Q100 qualified, it is widely deployed in non-safety automotive auxiliary applications such as HVAC blowers, water pumps, and electric fans where industrial temperature grading suffices. The 40 MIPS core runs sensorless or Hall-sensor BLDC algorithms, while the on-chip peripherals drive the power stage. The LFQFP-100 is a proven automotive-assembly package. Note: AEC-Q100 is NOT applicable to this part - for safety-relevant designs, migrate to AEC-Q100-qualified MC56F8xxx or TMS320F280xx Piccolo. The same DSP56F803 toolchain and firmware patterns port directly.
Recommended
Recommended Products Summary
Engineering reference data for SPAK56F803BU80 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSP56F803BU80 | DSP56F803BU100 | DSP56F805BU80 | DSP56F807BU80 | DSP56F801FA80 |
|---|---|---|---|---|---|---|
| Package | LFQFP-100 (gull-wing) | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same | LFQFP-100 (gull-wing) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | DSP56F803 | DSP56F803 (identical die) | DSP56F803 (identical die) | DSP56F805 (sibling die, more memory) | DSP56F807 (higher-memory sibling) | DSP56F801 (lower-memory sibling) |
| Core Frequency | 80 MHz | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same |
| MIPS | 40 MIPS | 40 MIPS - same | 40 MIPS - same | 40 MIPS - same | 40-60 MIPS (family) | 40 MIPS - same |
| Temperature Grade | Industrial | Industrial - same | Industrial - same | Industrial - same | Industrial - same | Industrial - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Primary Use Case | Motor control + DSP | Motor control + DSP - same | Motor control + DSP - same | Motor control + DSP - same | Higher-end motor control | Lower-cost motor control |
Key Differentiators
- Unified DSP+MCU architecture eliminates dual-chip designs (vs DSP56F801FA80)
- Established 100-pin LFQFP ecosystem (vs DSP56F803BU80)
- Industrial temperature rating for harsh environments (vs DSP56F807BU80)
Design Notes
Estimated: Place 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pin pair of the SPAK56F803BU80's LFQFP-100 footprint. For the analog AVDD pins driving the on-chip ADC, use a 10 nF + 100 nF + 10 uF three-cap stack and route analog ground back to a dedicated AGND pour that ties to the main ground at a single point near the regulator. This keeps switching-noise from the digital core out of the ADC input paths, which is critical for motor-current sensing.
Estimated: the LFQFP-100 package on the SPAK56F803BU80 has a typical theta_JA of around 50-55 C/W on a standard 4-layer JEDEC PCB. At an industrial 85 C ambient, the chip can dissipate roughly 1.2 W without a heatsink. For motor-control designs running heavy ADC sampling and PWM at high duty, expose the thermal pad copper (if present) or stitch a copper pour under the package to keep junction rise under 25 C.
The SPAK56F803BU80 is NRND; do not design it into new production programs without a Rochester Electronics last-time-buy agreement. Also note that the LFQFP-100 fine-pitch lead spacing (typically 0.5 mm) requires precise stencil design - 6-mil stencil thickness over QFP pads is recommended for lead-free reflow to prevent solder shorts and head-in-pillow defects.
Route PWM outputs and ADC analog inputs on opposite sides of the package to minimize capacitive coupling. Place the JTAG/debug header within 50 mm of the JTAG pins to keep TCK rise times clean. Keep the crystal/oscillator traces short and surrounded by ground pour to avoid jitter in PWM timing critical for sinusoidal motor control.
Compliance Information
RoHS and REACH compliance are not confirmed in the verified web data; verify with NXP product documentation. AEC-Q100 not applicable - this is an industrial-grade part; for automotive safety designs migrate to AEC-Q100-qualified MC56F8xxx. Lifecycle is NRND.
