SPAK56F803BU80 vs DSP56F803BU80E Vergleich
Detaillierter Direktvergleich von SPAK56F803BU80 von NXP Semiconductors und DSP56F803BU80E von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
SPAK56F803BU80 NrndNXP Semiconductors
DSP56F803BU80E - 16-bit DSC 80MHz 64KB Flash LQFP-100 | NXP
DSP56F803BU80E ✗ AbgekündigtSpezifikationsvergleich
| Parameter | SPAK56F803BU80 | DSP56F803BU80E |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16,25 | $0,00 |
| Product Type | 16-bit Digital Signal Processor | — |
| Core Architecture | DSP56F803 (DSP + MCU unified core) | — |
| Core Frequency | 80 MHz | — |
| Core Performance | 40 MIPS | — |
| Instruction Set | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops | — |
| Addressing Modes | 14 addressing modes | — |
| Program Memory | On-chip Flash (size [DATA_NEEDED: program memory size in KB]) | — |
| Data Memory | On-chip RAM (size [DATA_NEEDED: data memory size in KB]) | — |
| Gehäuse | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) | — |
| Package Outline | 100 terminals, square, gull-wing lead form | — |
| Operating Temperature Grade | Industrial | — |
| Montageart | Surface Mount | Surface Mount |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Typical Applications | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning | — |
| Core Processor | — | 56800 |
| Core Size | — | 16-bit |
| Series | — | 56F8xx |
| Maximale Taktfrequenz | — | 80 MHz |
| Performance | — | 40 MIPS (80MHz/40MIPS per Mouser) |
| Program Memory Size | — | 64 KB (32K x 16) |
| Program Memory Type | — | Flash |
| Architecture | — | Harvard-style, DSP + MCU hybrid |
| Connectivity | — | CANbus, EBI/EMI, SCI |
| Package Type | — | 100-LQFP (14x14 mm), LFQFP, square, gull wing |
| Number of Terminals | — | 100 |
| Temperature Grade | — | Industrial |
| Packaging | — | Tray |
| Product Status | — | End of Life (EOL) per NXP product page |
| Betriebsversorgungsspannung | — | [DATA_NEEDED: operating supply voltage] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |