TIC10024QDCPRQ1 - 24-Input Automotive MSDI w/ SPI | Texas Instruments
Teilenummer: TIC10024QDCPRQ1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.1 | $41,00 |
| 100 | $3.55 | $355,00 |
| 500 | $3.18 | $1.590,00 |
| 1.000 | $2.82 | $2.820,00 |
TIC10024QDCPRQ1 Übersicht
A Multiple Switch Detection Interface (MSDI) is a mixed-signal ASSP that bridges mechanical switches (e.g. rocker switches, momentary buttons, limit switches) to a microcontroller in 12-V automotive electrical systems. It belongs to the broader hierarchy: switch interface IC → interface IC → signal conditioning IC → power management / body electronics ASSP → automotive semiconductor. The MSDI provides per-input wetting current to prevent contact oxidation, programmable threshold comparators for switch-closed detection, and serial aggregation of 24 inputs into a few SPI pins — reducing wire harness complexity and MCU pin count.
Key features include 35-V absolute maximum load-dump tolerance (12-V nominal), adjustable wetting current per channel, selectable ground- or supply-referenced inputs on 10 channels, integrated input debounce / de-glitch filters, configurable interrupt generation for wake events, low quiescent current sleep mode, and SPI communication up to . The device operates across -40 °C to +125 °C ambient (AEC-Q100 Grade 1) and includes thermal shutdown protection. The exposed-pad HTSSOP-38 package provides theta_JA suitable for BCM thermal environments.
Technically, the TIC10024-Q1 uses a per-channel comparator architecture with current-mode wetting sources driven from a shared internal regulator. The SPI peripheral implements a standard mode-0 protocol with a frame-format error flag and a global wake-up interrupt output. Internal state machine handles input filtering, hysteresis, and wetting-current modulation; channel configuration registers enable per-input current programming and pull-up/pull-down selection.
Typical applications include automotive body control modules (BCM) reading 24 switches per chip, gateway/zonal controllers monitoring door/trunk/hood latches, steering-wheel switch matrices, seat-control switch aggregation, and overhead-console button clusters. The 24-input density lets a single MSDI replace multiple 8-/16-channel general-purpose I/O expanders.
When designing with this part, ensure the PCB layout accommodates the exposed thermal pad with at least 4 thermal vias to the inner ground plane for AEC-Q100 thermal conformance. The 38-pin HTSSOP package requires careful routing of SPI traces; keep the SCLK/MOSI/MISO bundle length-matched and routed away from VBAT-switching nodes.
This page synthesizes distributor pricing (as of 2026-10-11), drop-in same-package alternatives, and practical AEC-Q100 design notes — information not consolidated in the TI datasheet alone.
Drop-in-Alternativen für TIC10024QDCPRQ1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TIC10024QDCPQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TIC10024QDCPR
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TIC10024QDCPRQ1
✅ Drop-In✓ Auf Lager
$2.82 / Stück
Datenblatt ansehen →TIC10024QDCPRQ1 Technische Daten
| Funktion | Multiple Switch Detection Interface (MSDI) |
| Number of Switch Inputs | 24 direct inputs |
| Configurable Inputs (ground or supply) | 10 of 24 |
| Interface Protocol | SPI (Mode 0) |
| Betriebsversorgungsspannung | 5 V to 35 V (12-V automotive nominal) |
| Absolute Maximum Supply | 35 V (load-dump tolerant) |
| Wetting Current | Adjustable per channel |
| Comparator Threshold | Adjustable, programmable per channel |
| Wake Interrupt Output | Yes, configurable wake events |
| Input Debounce / Filter | Integrated digital de-glitch filter |
| Betriebstemperaturbereich | -40 C to +125 C |
| Automotive Qualification | AEC-Q100 Grade 1 |
| Gehäuse | HTSSOP-38 (DCP) with exposed thermal pad |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
TIC10024QDCPRQ1 Pin-Konfiguration
| Pin 1 | VBAT — Battery supply input (5 V–35 V) |
| Pin 2 | IN0 — Switch input 0 |
| Pin 3 | IN1 — Switch input 1 |
| Pin 4 | IN2 — Switch input 2 |
| Pin 5 | IN3 — Switch input 3 |
| Pin 6 | IN4 — Switch input 4 |
| Pin 7 | IN5 — Switch input 5 |
| Pin 8 | IN6 — Switch input 6 |
| Pin 9 | IN7 — Switch input 7 |
| Pin 10 | IN8 — Switch input 8 |
| Pin 11 | IN9 — Switch input 9 |
| Pin 12 | IN10 — Switch input 10 |
| Pin 13 | IN11 — Switch input 11 |
| Pin 14 | IN12 — Switch input 12 |
| Pin 15 | IN13 — Switch input 13 |
| Pin 16 | GND — Ground |
| Pin 17 | IN14 — Switch input 14 (configurable ground/supply) |
| Pin 18 | IN15 — Switch input 15 (configurable ground/supply) |
| Pin 19 | IN16 — Switch input 16 (configurable ground/supply) |
| Pin 20 | IN17 — Switch input 17 (configurable ground/supply) |
| Pin 21 | IN18 — Switch input 18 (configurable ground/supply) |
| Pin 22 | IN19 — Switch input 19 (configurable ground/supply) |
| Pin 23 | IN20 — Switch input 20 (configurable ground/supply) |
| Pin 24 | IN21 — Switch input 21 (configurable ground/supply) |
| Pin 25 | IN22 — Switch input 22 (configurable ground/supply) |
| Pin 26 | IN23 — Switch input 23 (configurable ground/supply) |
| Pin 27 | NCS — SPI chip-select (active low) |
| Pin 28 | SCLK — SPI serial clock |
| Pin 29 | MOSI — SPI master-out / slave-in data |
| Pin 30 | MISO — SPI master-in / slave-out data |
| Pin 31 | NINT — Interrupt output (active low, wake events) |
| Pin 32 | WAKE — Wake input / output |
| Pin 33 | RST — Reset input (active low) |
| Pin 34 | TEST — Factory test pin (tie to GND in application) |
| Pin 35 | VDDIO — Digital I/O supply (3.3 V or 5 V) |
| Pin 36 | VREG — Internal regulator decoupling |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | EP — Exposed thermal pad - connect to GND plane |
Typische Anwendungen
TIC10024QDCPRQ1 ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), Zonal Controller Switch Aggregation, Steering Wheel Switch Matrix, Overhead Console Switch Cluster, Seat Control Switch Aggregation, Industrial Multi-Switch Aggregation.
Automotive Body Control Module (BCM)
The TIC10024QDCPRQ1 is well suited to automotive Body Control Modules (BCMs) where one device must aggregate 24 mechanical-switch inputs (door latches, trunk release, hood ajar, headlight-on, fog-light-on, wiper positions, seat-belt buckle, turn-signal stalk, wiper stalk). The 24-input density lets a single MSDI replace multiple discrete GPIO expanders; the integrated wetting current prevents contact oxidation on long-life mechanical switches, and the 35-V load-dump tolerance on a 12-V automotive rail eliminates external TVS circuitry for normal transients. The SPI output reduces MCU GPIO demand from 24 to 4 (SCLK/MOSI/MISO/CS) plus one interrupt line. AEC-Q100 Grade 1 qualification and -40 °C to +125 °C ambient operation match under-hood and cabin BCM thermal environments.
Empfohlen
Zonal Controller Switch Aggregation
In zonal-architecture E/E (electrical/electronic) topologies, each vehicle zone aggregates many switches (door, mirror, seat, window, sunroof) to a zonal controller via a high-density interface IC. The TIC10024QDCPRQ1 with its 24 inputs is ideal for the door zone controller, where one chip handles 4 windows, 2 mirrors, door lock, child lock, and several illumination/safety switches. The 10 ground/supply-configurable inputs allow mixed switch topologies without external biasing resistors. SPI bandwidth is sufficient for sub-millisecond debounced switch readout, while the integrated wake-interrupt output enables low-Iq sleep mode when all inputs are at rest.
Empfohlen
Steering Wheel Switch Matrix
Modern steering wheels integrate cruise-control, infotainment, voice, and ADAS-mode switches that return to a steering-column module. The TIC10024QDCPRQ1 is well suited: 24 channels cover audio volume up/down/track/mode, phone answer/hang-up, voice, ACC gap/set/on-off, lane-departure, drive-mode selector, plus paddles for gear-shift. Integrated de-glitch filtering eliminates the switch-bounce chatter that would otherwise burden the MCU, and adjustable wetting current prevents oxidation in the high-cycle-count paddle switches. The HTSSOP-38 package's small footprint (9.7x4.4 mm) fits behind the airbag module.
Empfohlen
Overhead Console Switch Cluster
The vehicle overhead console aggregates dome-light, map-light, sunroof, sunshade, garage-door opener, SOS/E-call, and reading-light switches into a compact module. The TIC10024QDCPRQ1's 24 channels are ideal: 10 supply-referenced channels handle active-high switches, the remaining ground-referenced channels handle standard return-to-ground buttons. The SPI interface minimizes wire count to the headliner harness (4 SPI signals versus 24 discrete return wires), reducing harness weight and BOM cost. AEC-Q100 Grade 1 qualification tolerates the elevated headliner temperatures in summer sun soak.
Empfohlen
Seat Control Switch Aggregation
Power-seat control modules integrate switches for recline, slide, height, lumbar, cushion-length, head-rest, and memory-set buttons (often 16-24 inputs per seat). The TIC10024QDCPRQ1 reads all seat switches through one SPI peripheral on the seat-control ECU, freeing the MCU for seat-motor PWM control. The 35-V load-dump tolerance and 12-V direct operation allow the MSDI to share VBAT power with the seat motors (with adequate filtering). The exposed thermal pad of the HTSSOP-38 handles in-seat thermal load during long drives.
Empfohlen
Industrial Multi-Switch Aggregation
Beyond automotive, the TIC10024QDCPRQ1 fits industrial control panels, machine-tool HMIs, and HVAC-control boxes that aggregate many discrete mechanical switches (limit switches, selector switches, E-stop chains, mode selectors). The wide 5 V–35 V supply tolerates both 24-V industrial control rails and 12-V backup supplies. SPI aggregation simplifies wiring back to the PLC or industrial MCU, and AEC-Q100 Grade 1 qualification provides a wider temperature margin than commercial-grade parts. The HTSSOP-38 surface-mount package supports standard reflow assembly on industrial PCBs.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TIC10024QDCPRQ1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TIC10024QDCPQ1 | TIC10024QDCPR | TIC10024QDCPRQ1 |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | HTSSOP-38 (DCP) | HTSSOP-38 (DCP) - same | HTSSOP-38 (DCP) - same | HTSSOP-38 (DCP) - same |
| Channel Count | 24 inputs | 24 inputs | 24 inputs | 24 inputs |
| AEC-Q100 Grade | Grade 1 | Grade 1 | Not automotive qualified | Grade 1 |
| Interface Protocol | SPI | SPI | SPI | SPI |
| Packaging Carrier | Tape & Reel (Q1 suffix) | Tube / Tray (no Q1 reel suffix) | Tape & Reel | Tape & Reel |
| Operating Voltage | 5 V to 35 V | 5 V to 35 V | 5 V to 35 V | 5 V to 35 V |
| Unit Price (qty 1, USD) | 4.62 | Similar; check distributor | Typically lower than Q1 | 4.62 |
Wichtigste Unterscheidungsmerkmale
- 24-channel density in a single HTSSOP-38 IC (vs. Discrete 16-bit GPIO expander + external comparators)
- Automotive-grade qualification (AEC-Q100 Grade 1) (vs. Industrial-grade switch-interface ICs)
- 10 ground/supply-configurable inputs (vs. Fixed ground-reference switch-interface ICs)
- 35-V load-dump-tolerant supply (vs. 5-V-only switch-interface ICs)
Designhinweise
The HTSSOP-38 (DCP) package has an exposed thermal pad that must be soldered to a copper pour on the PCB with at least 4 thermal vias (0.3 mm drill, 1 mm pitch) to the inner ground plane. According to TI's package thermal data, this gives theta_JA sufficient for AEC-Q100 Grade 1 (125 C ambient) operation. Without the thermal pad connection, junction temperature can exceed 150 C during high ambient under-hood operation.
Route the SPI signals (SCLK, MOSI, MISO, NCS, NINT) as a matched-length group, kept short and away from VBAT switching nodes (e.g. nearby H-bridge PWM traces). Place 100 nF ceramic decoupling on VDDIO close to pin 35, and 10 uF + 100 nF bulk decoupling on VBAT pin 1. Use a wide VBAT trace with TVS clamping (e.g. SMAJ33A) for ISO 7637-2 load-dump conformance — the absolute maximum rating is 35 V but transients can exceed that.
Do not connect the TEST pin (pin 34) to anything other than GND — leaving it floating or driving it high can trigger factory test modes that disable normal operation. The NC pin (pin 37) must remain floating per datasheet; do not tie to GND or VDD. Configuration of the 10 ground/supply-configurable inputs (pins 17-26) must be set in software before enabling wetting current to avoid false triggers. The NINT and NCS pins are active-low; ensure pull-ups are present (typically internal, but external 10 kΩ recommended for noisy automotive environments).
Each switch input (IN0–IN23) carries up to ~20 mA of wetting current — design the PCB trace widths for that current and route them away from sensitive analog signals. Group all switch-input traces on one PCB layer and keep them away from clock/data lines. Place 100 nF ceramic bypass capacitors on each switch input pin if the wiring harness is long (>100 mm) to suppress ESD coupling from switch arcing.
For SPI clock rates above 1 MHz, add a 33 Ω series resistor on SCLK at the driver end to dampen ringing on the bus. Keep the SPI bus length under 50 mm on the host PCB; if the MSDI is on a separate daughterboard connected via ribbon, add a 100 Ω source-termination on each SPI line at the connector.
Compliance-Informationen
AEC-Q100 Grade 1 qualified per TI product page (Q1 suffix denotes automotive grade). RoHS and REACH compliant; halogen-free status not explicitly published.
