TJA1028TK/3V3/20/J - LIN Transceiver + 3.3V LDO SBC | NXP HVSON-8
Teilenummer: TJA1028TK/3V3/20/J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.18 | $2,18 |
| 10 | $1.95 | $19,50 |
| 100 | $1.62 | $162,00 |
| 500 | $1.31 | $655,00 |
| 1.000 | $1.08 | $1.080,00 |
| 3.000 | $0.92 | $2.760,00 |
TJA1028TK/3V3/20/J Übersicht
A LIN transceiver (Local Interconnect Network transceiver) is a physical-layer device that connects a microcontroller's UART/SCI to a single-wire LIN bus used widely in automotive body electronics. The TJA1028 belongs to the SBC (System Basis Chip) product category, integrating both the bus interface and a low-dropout (LDO) voltage regulator that powers a local MCU or sensor from the vehicle's 12 V supply. SBCs sit hierarchically above LIN transceivers and below broader automotive PMICs in the power-management IC taxonomy.
Key specifications include a wide battery supply range of 4.5 V to 28 V (with load-dump survival up to 42 V), an integrated 3.3 V LDO at up to 70 mA, strong ESD performance (greater than or equal to 8 kV HBM on the LIN pin), and support for both normal and low-power sleep modes. The 8-pin HVSON package offers a small 3x3 mm footprint with an exposed pad for low thermal resistance and robust PCB grounding.
Internally the device integrates a LIN bus driver/receiver compliant with the LIN physical layer, a low-drop post-regulator, and mode-control logic accessed via the EN/NSTB pin. The 3.3 V LDO is stable with ceramic, tantalum, and aluminum output capacitors, simplifying BOM and enabling direct connection to a 3.3 V MCU such as NXP's S08 or Kinetis E-series.
Typical applications include automotive body controllers, door/window/seat modules, HVAC sensors, steering-column switches, LIN sensor nodes (rain/light/temperature), and rear-view mirror controls. The integrated LDO eliminates an external regulator in each LIN node, reducing PCB area and BOM cost.
A primary design tip is to provide adequate decoupling on the battery pin (a 100 nF ceramic close to VBAT plus a bulk capacitor on the bus supply), tie the exposed pad to a clean ground island, and use the sleep mode aggressively to keep quiescent current below the LIN network spec for current-limited nodes.
This page synthesizes distributor pricing, drop-in package equivalents, and practical design notes not collated on the manufacturer datasheet alone.
Drop-in-Alternativen für TJA1028TK/3V3/20/J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TJA1028TK/3V3/20,1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TJA1028TK/3V3/10:1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TJA1028TK/5V/20/J
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TJA1028TK/5V/20,1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TJA1027TK/3V3/20
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TJA1028TK/3V3/20/J Grenzwerte & elektrische Eigenschaften
| Funktion | LIN Transceiver + Integrated LDO (System Basis Chip) |
| Protocol Compliance | LIN 2.0 / LIN 2.1 / SAE J2602 / ISO 17987-4:2016 (12 V) |
| Number of Drivers/Receivers | 1 / 1 |
| Datenrate | Up to 20 kbps (LIN) |
| Supply Voltage (VBAT) | 4.5 V to 28 V |
| Load Dump Protection | Up to 42 V |
| Integrated LDO Output Voltage | 3.3 V |
| Integrated LDO Output Current | Up to 70 mA |
| LDO Dropout | Low-dropout (per NXP datasheet) |
| ESD (LIN pin) | >= 8 kV HBM (per datasheet) |
| Betriebstemperaturbereich | -40 C to +125 C |
| Gehäuse | 8-pin HVSON (3x3 mm) with exposed pad |
| Montageart | Surface Mount |
| AEC-Q100 | Automotive qualified |
TJA1028TK/3V3/20/J Pin-Konfiguration
| Pin 1 | EN/NSTB — Enable / standby control input (active-high; pulled low for sleep mode) |
| Pin 2 | GND — Ground reference |
| Pin 3 | VBAT — Battery supply input (4.5 V to 28 V) |
| Pin 4 | LIN — LIN bus line (single-wire, 12 V) |
| Pin 5 | WAKE — Local wake-up input from LIN bus events |
| Pin 6 | VCC — 3.3 V LDO output (up to 70 mA) - powers local MCU |
| Pin 7 | TXD — Transmit data input from MCU (UART TX) |
| Pin 8 | RXD — Received data output to MCU (UART RX) |
Typische Anwendungen
TJA1028TK/3V3/20/J ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), Door / Window / Seat LIN Slave Module, HVAC Sensor Nodes (Temperature / Humidity / Pressure), Steering Column Switch / Stalk Module, Rear-View Mirror Control Unit, Rain / Light / Ambient Sensor Nodes.
Automotive Body Control Module (BCM)
The TJA1028TK/3V3/20/J fits body control modules because its LIN 2.1/SAE J2602 physical layer and integrated 3.3 V / 70 mA LDO let a single 3x3 mm HVSON-8 device handle both the LIN slave node and the local MCU rail. Body modules operate from 12 V battery with load-dump events to 42 V; the part's 4.5-28 V VBAT range and built-in load-dump protection remove TVS stages. Placed near each LIN connector with a 100 nF VBAT decoupling cap, the SBC replaces a discrete LIN transceiver plus an external 3.3 V LDO. Trade-off: the 70 mA LDO caps node-side MCU current, so high-current sub-modules still need a separate regulator.
Empfohlen
Door / Window / Seat LIN Slave Module
Door, window, and seat modules typically use one LIN slave per motor or switch cluster, where PCB area and BOM cost are tightly constrained. The TJA1028TK/3V3/20/J integrates the LIN physical layer and a 3.3 V LDO in one 8-pin HVSON, eliminating an external regulator and its capacitors in each node. Its 8 kV HBM ESD on LIN lets modules pass IEC 61000-4-2 without external TVS arrays, simplifying PCB layout. Used between the LIN bus and a small 3.3 V MCU like the S08PT family, the SBC handles bus wake-up and sleep mode autonomously. Trade-off: at -40 C cold-crank the LDO must stay in regulation, which the part guarantees per its 4.5 V minimum VBAT spec.
Empfohlen
HVAC Sensor Nodes (Temperature / Humidity / Pressure)
HVAC sensor clusters (in-cabin temperature, humidity, and pressure sensors) need a tiny LIN slave that draws microamps in standby. The TJA1028TK/3V3/20/J supports bus wake-up and a low-quiescent sleep mode, making it well-suited to always-on sensor nodes that spend most of their time asleep. The integrated 3.3 V / 70 mA LDO powers the sensor plus a small MCU directly from the 12 V battery rail, removing the need for an external regulator. Placed next to the LIN connector with the exposed pad soldered to a ground island, the SBC contributes minimal PCB area. Trade-off: the LDO's 70 mA ceiling means high-current actuators (blower motors) cannot share this part.
Empfohlen
Steering Column Switch / Stalk Module
Steering column switches and stalk modules route driver inputs (turn signals, wipers, lights) over LIN to the BCM. The TJA1028TK/3V3/20/J fits these modules because its small 3x3 mm HVSON package sits directly behind the switch housing, and the integrated 3.3 V LDO powers a small MCU that scans the switch matrix. LIN 2.1 / SAE J2602 compliance ensures interoperability with any modern BCM master. The 8 kV ESD on LIN protects the part against the ESD events typical in switch modules where the driver touches metal. Trade-off: the 8-pin package forces TXD/RXD/EN on adjacent pins, so the PCB must keep these traces short to avoid cross-talk.
Empfohlen
Rear-View Mirror Control Unit
Modern rear-view mirror units integrate turn signals, cameras, and electro-chromic dimming over LIN. The TJA1028TK/3V3/20/J suits mirror modules because the 8-pin HVSON package fits behind the mirror glass and the 3.3 V / 70 mA LDO powers a small MCU plus dimming driver directly from the 12 V mirror harness. Strong ESD performance on LIN protects the SBC against the static discharge events common when the mirror is adjusted or touched. With LIN 2.1 / SAE J2602 support, it interoperates with BCM masters from any Tier-1 supplier. Trade-off: at elevated mirror temperatures (+85 C ambient, +125 C junction), the LDO derating must be respected for continuous loads near 70 mA.
Empfohlen
Rain / Light / Ambient Sensor Nodes
Rain-light sensor modules sit on the LIN bus and need an extremely compact, low-power slave. The TJA1028TK/3V3/20/J fits these modules thanks to its 3x3 mm HVSON-8 footprint, integrated 3.3 V / 70 mA LDO, and bus wake-up capability. The LIN physical layer meets ISO 17987-4:2016, ensuring interoperability with global BCM platforms. Used between the optical sensor PCB and the LIN harness, the SBC replaces a discrete transceiver plus regulator pair. Trade-off: optical sensors can pull significant LED current during measurement, so the LDO must be sized against pulsed loads rather than average draw.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TJA1028TK/3V3/20/J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TJA1028TK/3V3/20,1 | TJA1028TK/3V3/10:1 | TJA1028TK/5V/20/J | TJA1028TK/5V/20,1 | TJA1027TK/3V3/20 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HVSON-8 (3x3 mm) | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same |
| LIN Protocol Compliance | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/SAE J2602 (no ISO 17987-4) |
| Integrated LDO Output | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V | 3.3 V |
| LDO Output Current | 70 mA | 70 mA | 70 mA | 70 mA | 70 mA | 70 mA |
| LIN Data Rate | Up to 20 kbps | Up to 20 kbps | Up to 10 kbps (-50%) | Up to 20 kbps | Up to 20 kbps | Up to 20 kbps |
| Battery Supply Range | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 27 V (narrower) |
| Reel / Packaging Suffix | /J | /1 | /1 | /J | /1 | no suffix |
Wichtigste Unterscheidungsmerkmale
- Integrated 70 mA LDO in the same package (vs. TJA1057T/1Z)
- Higher LIN data rate variant available (vs. TJA1028TK/3V3/10:1)
- Newer generation with stricter EMC and ESD margins (vs. TJA1027TK/3V3/20)
Designhinweise
Place a 100 nF X7R ceramic capacitor as close as possible to the VBAT pin (pin 3) and a 1-10 uF ceramic plus a 100 nF cap on the VCC pin (pin 6) to stabilize the integrated 3.3 V LDO. The exposed thermal pad on the HVSON-8 package MUST be soldered to a continuous ground island with multiple thermal vias to keep the die within its -40 C to +125 C operating range; do not route signal traces under the pad.
Do not connect the LIN bus wire directly to the LIN pin without an external reverse-polarity and load-dump network if the harness is routed near actuators with high inductive kick. Although the TJA1028TK/3V3/20/J tolerates 42 V load dump, sustained transients above 28 V on the LIN pin can still damage the LIN driver. Add a series resistor and a clamping diode as recommended in the NXP application hints section of the datasheet for harsh environments.
Use the EN/NSTB pin (pin 1) to enter low-quiescent sleep mode when the LIN bus is idle; this disables the integrated 3.3 V LDO and drops MCU supply current. A wake-up event on the LIN bus or on the WAKE pin (pin 5) automatically re-enables the LDO and brings the part back to normal mode, allowing sensor nodes to meet the LIN network current-limit budget during parking.
Compliance-Informationen
AEC-Q100 qualified per NXP/Arrow listing. RoHS/REACH compliant. Halogen-free status not stated in the verified web data and marked [DATA_NEEDED].
