TJA1028TK/3V3/20/J - LIN Transceiver + 3.3V LDO SBC | NXP HVSON-8
部品番号: TJA1028TK/3V3/20/J ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.18 | $2.18 |
| 10 | $1.95 | $19.50 |
| 100 | $1.62 | $162.00 |
| 500 | $1.31 | $655.00 |
| 1,000 | $1.08 | $1,080.00 |
| 3,000 | $0.92 | $2,760.00 |
TJA1028TK/3V3/20/J 概要
A LIN transceiver (Local Interconnect Network transceiver) is a physical-layer device that connects a microcontroller's UART/SCI to a single-wire LIN bus used widely in automotive body electronics. The TJA1028 belongs to the SBC (System Basis Chip) product category, integrating both the bus interface and a low-dropout (LDO) voltage regulator that powers a local MCU or sensor from the vehicle's 12 V supply. SBCs sit hierarchically above LIN transceivers and below broader automotive PMICs in the power-management IC taxonomy.
Key specifications include a wide battery supply range of 4.5 V to 28 V (with load-dump survival up to 42 V), an integrated 3.3 V LDO at up to 70 mA, strong ESD performance (greater than or equal to 8 kV HBM on the LIN pin), and support for both normal and low-power sleep modes. The 8-pin HVSON package offers a small 3x3 mm footprint with an exposed pad for low thermal resistance and robust PCB grounding.
Internally the device integrates a LIN bus driver/receiver compliant with the LIN physical layer, a low-drop post-regulator, and mode-control logic accessed via the EN/NSTB pin. The 3.3 V LDO is stable with ceramic, tantalum, and aluminum output capacitors, simplifying BOM and enabling direct connection to a 3.3 V MCU such as NXP's S08 or Kinetis E-series.
Typical applications include automotive body controllers, door/window/seat modules, HVAC sensors, steering-column switches, LIN sensor nodes (rain/light/temperature), and rear-view mirror controls. The integrated LDO eliminates an external regulator in each LIN node, reducing PCB area and BOM cost.
A primary design tip is to provide adequate decoupling on the battery pin (a 100 nF ceramic close to VBAT plus a bulk capacitor on the bus supply), tie the exposed pad to a clean ground island, and use the sleep mode aggressively to keep quiescent current below the LIN network spec for current-limited nodes.
This page synthesizes distributor pricing, drop-in package equivalents, and practical design notes not collated on the manufacturer datasheet alone.
ドロップイン代替品: TJA1028TK/3V3/20/J — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
TJA1028TK/3V3/20,1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1028TK/3V3/10:1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1028TK/5V/20/J
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1028TK/5V/20,1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1027TK/3V3/20
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
TJA1028TK/3V3/20/J 最大定格＆電気的特性
| 機能 | LIN Transceiver + Integrated LDO (System Basis Chip) |
| Protocol Compliance | LIN 2.0 / LIN 2.1 / SAE J2602 / ISO 17987-4:2016 (12 V) |
| Number of Drivers/Receivers | 1 / 1 |
| データレート | Up to 20 kbps (LIN) |
| Supply Voltage (VBAT) | 4.5 V to 28 V |
| Load Dump Protection | Up to 42 V |
| Integrated LDO Output Voltage | 3.3 V |
| Integrated LDO Output Current | Up to 70 mA |
| LDO Dropout | Low-dropout (per NXP datasheet) |
| ESD (LIN pin) | >= 8 kV HBM (per datasheet) |
| 動作温度範囲 | -40 C to +125 C |
| パッケージ | 8-pin HVSON (3x3 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| AEC-Q100 | Automotive qualified |
TJA1028TK/3V3/20/J ピン構成
| ピン 1 | EN/NSTB — Enable / standby control input (active-high; pulled low for sleep mode) |
| ピン 2 | GND — Ground reference |
| ピン 3 | VBAT — Battery supply input (4.5 V to 28 V) |
| ピン 4 | LIN — LIN bus line (single-wire, 12 V) |
| ピン 5 | WAKE — Local wake-up input from LIN bus events |
| ピン 6 | VCC — 3.3 V LDO output (up to 70 mA) - powers local MCU |
| ピン 7 | TXD — Transmit data input from MCU (UART TX) |
| ピン 8 | RXD — Received data output to MCU (UART RX) |
主な用途
TJA1028TK/3V3/20/J の用途: 6 件s: Automotive Body Control Module (BCM), Door / Window / Seat LIN Slave Module, HVAC Sensor Nodes (Temperature / Humidity / Pressure), Steering Column Switch / Stalk Module, Rear-View Mirror Control Unit, Rain / Light / Ambient Sensor Nodes.
Automotive Body Control Module (BCM)
The TJA1028TK/3V3/20/J fits body control modules because its LIN 2.1/SAE J2602 physical layer and integrated 3.3 V / 70 mA LDO let a single 3x3 mm HVSON-8 device handle both the LIN slave node and the local MCU rail. Body modules operate from 12 V battery with load-dump events to 42 V; the part's 4.5-28 V VBAT range and built-in load-dump protection remove TVS stages. Placed near each LIN connector with a 100 nF VBAT decoupling cap, the SBC replaces a discrete LIN transceiver plus an external 3.3 V LDO. Trade-off: the 70 mA LDO caps node-side MCU current, so high-current sub-modules still need a separate regulator.
おすすめ
Door / Window / Seat LIN Slave Module
Door, window, and seat modules typically use one LIN slave per motor or switch cluster, where PCB area and BOM cost are tightly constrained. The TJA1028TK/3V3/20/J integrates the LIN physical layer and a 3.3 V LDO in one 8-pin HVSON, eliminating an external regulator and its capacitors in each node. Its 8 kV HBM ESD on LIN lets modules pass IEC 61000-4-2 without external TVS arrays, simplifying PCB layout. Used between the LIN bus and a small 3.3 V MCU like the S08PT family, the SBC handles bus wake-up and sleep mode autonomously. Trade-off: at -40 C cold-crank the LDO must stay in regulation, which the part guarantees per its 4.5 V minimum VBAT spec.
おすすめ
HVAC Sensor Nodes (Temperature / Humidity / Pressure)
HVAC sensor clusters (in-cabin temperature, humidity, and pressure sensors) need a tiny LIN slave that draws microamps in standby. The TJA1028TK/3V3/20/J supports bus wake-up and a low-quiescent sleep mode, making it well-suited to always-on sensor nodes that spend most of their time asleep. The integrated 3.3 V / 70 mA LDO powers the sensor plus a small MCU directly from the 12 V battery rail, removing the need for an external regulator. Placed next to the LIN connector with the exposed pad soldered to a ground island, the SBC contributes minimal PCB area. Trade-off: the LDO's 70 mA ceiling means high-current actuators (blower motors) cannot share this part.
おすすめ
Steering Column Switch / Stalk Module
Steering column switches and stalk modules route driver inputs (turn signals, wipers, lights) over LIN to the BCM. The TJA1028TK/3V3/20/J fits these modules because its small 3x3 mm HVSON package sits directly behind the switch housing, and the integrated 3.3 V LDO powers a small MCU that scans the switch matrix. LIN 2.1 / SAE J2602 compliance ensures interoperability with any modern BCM master. The 8 kV ESD on LIN protects the part against the ESD events typical in switch modules where the driver touches metal. Trade-off: the 8-pin package forces TXD/RXD/EN on adjacent pins, so the PCB must keep these traces short to avoid cross-talk.
おすすめ
Rear-View Mirror Control Unit
Modern rear-view mirror units integrate turn signals, cameras, and electro-chromic dimming over LIN. The TJA1028TK/3V3/20/J suits mirror modules because the 8-pin HVSON package fits behind the mirror glass and the 3.3 V / 70 mA LDO powers a small MCU plus dimming driver directly from the 12 V mirror harness. Strong ESD performance on LIN protects the SBC against the static discharge events common when the mirror is adjusted or touched. With LIN 2.1 / SAE J2602 support, it interoperates with BCM masters from any Tier-1 supplier. Trade-off: at elevated mirror temperatures (+85 C ambient, +125 C junction), the LDO derating must be respected for continuous loads near 70 mA.
おすすめ
Rain / Light / Ambient Sensor Nodes
Rain-light sensor modules sit on the LIN bus and need an extremely compact, low-power slave. The TJA1028TK/3V3/20/J fits these modules thanks to its 3x3 mm HVSON-8 footprint, integrated 3.3 V / 70 mA LDO, and bus wake-up capability. The LIN physical layer meets ISO 17987-4:2016, ensuring interoperability with global BCM platforms. Used between the optical sensor PCB and the LIN harness, the SBC replaces a discrete transceiver plus regulator pair. Trade-off: optical sensors can pull significant LED current during measurement, so the LDO must be sized against pulsed loads rather than average draw.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: TJA1028TK/3V3/20/J — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | TJA1028TK/3V3/20,1 | TJA1028TK/3V3/10:1 | TJA1028TK/5V/20/J | TJA1028TK/5V/20,1 | TJA1027TK/3V3/20 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HVSON-8 (3x3 mm) | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same | HVSON-8 (3x3 mm) - same |
| LIN Protocol Compliance | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/2.1/SAE J2602/ISO 17987-4:2016 | LIN 2.0/SAE J2602 (no ISO 17987-4) |
| Integrated LDO Output | 3.3 V | 3.3 V | 3.3 V | 5 V | 5 V | 3.3 V |
| LDO Output Current | 70 mA | 70 mA | 70 mA | 70 mA | 70 mA | 70 mA |
| LIN Data Rate | Up to 20 kbps | Up to 20 kbps | Up to 10 kbps (-50%) | Up to 20 kbps | Up to 20 kbps | Up to 20 kbps |
| Battery Supply Range | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 28 V | 4.5 V to 27 V (narrower) |
| Reel / Packaging Suffix | /J | /1 | /1 | /J | /1 | no suffix |
主な差別化要因
- Integrated 70 mA LDO in the same package （vs TJA1057T/1Z)
- Higher LIN data rate variant available （vs TJA1028TK/3V3/10:1)
- Newer generation with stricter EMC and ESD margins （vs TJA1027TK/3V3/20)
設計ノート
Place a 100 nF X7R ceramic capacitor as close as possible to the VBAT pin (pin 3) and a 1-10 uF ceramic plus a 100 nF cap on the VCC pin (pin 6) to stabilize the integrated 3.3 V LDO. The exposed thermal pad on the HVSON-8 package MUST be soldered to a continuous ground island with multiple thermal vias to keep the die within its -40 C to +125 C operating range; do not route signal traces under the pad.
Do not connect the LIN bus wire directly to the LIN pin without an external reverse-polarity and load-dump network if the harness is routed near actuators with high inductive kick. Although the TJA1028TK/3V3/20/J tolerates 42 V load dump, sustained transients above 28 V on the LIN pin can still damage the LIN driver. Add a series resistor and a clamping diode as recommended in the NXP application hints section of the datasheet for harsh environments.
Use the EN/NSTB pin (pin 1) to enter low-quiescent sleep mode when the LIN bus is idle; this disables the integrated 3.3 V LDO and drops MCU supply current. A wake-up event on the LIN bus or on the WAKE pin (pin 5) automatically re-enables the LDO and brings the part back to normal mode, allowing sensor nodes to meet the LIN network current-limit budget during parking.
コンプライアンス情報
AEC-Q100 qualified per NXP/Arrow listing. RoHS/REACH compliant. Halogen-free status not stated in the verified web data and marked [DATA_NEEDED].
