TMUXHS4412IRUAR - 20Gbps 4-Ch 2:1/1:2 Mux/Demux | Texas Instruments
Teilenummer: TMUXHS4412IRUAR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.22 | $5,22 |
| 10 | $4.69 | $46,90 |
| 100 | $4.17 | $417,00 |
| 500 | $3.75 | $1.875,00 |
| 1.000 | $3.33 | $3.330,00 |
| 3.000 | $2.91 | $8.730,00 |
TMUXHS4412IRUAR Übersicht
A high-speed multiplexer/demultiplexer (mux/demux) is a passive analog switch that selects one of multiple differential input pairs to a single output pair, enabling a host controller to share one PHY across two connectors, two PHYs across one connector, or to switch between redundant high-speed data paths. In the signal chain hierarchy the mux/demux sits between the protocol physical layer (PHY) and the connector, providing galvanic isolation between channels while preserving signal integrity at multi-gigabit NRZ and PAM3/PAM4 signaling rates. The TMUXHS4412 implements bidirectional switching so the same device serves either mux (2:1) or demux (1:2) topology without firmware configuration.
Key differentiating features include 20 Gbps per-channel data rate (enabling USB 3.2 Gen 2x2 with two channels aggregated), 50 ps intra-pair skew, 8 ohm RON, 0.45 pF typical on-capacitance, sub-130 ns propagation delay, and dual supply support with 1.71 V to 1.98 V core and 3.0 V to 3.6 V I/O. The 42-pin WQFN (RUA) package provides a 31 C/W thermal pad-to-ambient resistance and supports -40 C to +105 C industrial operation.
The architecture uses a pair of differential CMOS pass gates per channel with an integrated charge pump to maintain low RON across the full signal swing, plus on-chip termination resistors selectable through SEL pins. The bidirectional design means the same part handles both upstream and downstream switching, simplifying inventory and reducing PCB layout differences between mux and demux placements.
Typical applications include USB Type-C port multiplexers, DisplayPort dual-mode source switching, PCIe lane failover, SATA port multipliers, and front-panel USB-C routing on motherboards, docking stations, and embedded computing platforms. The wide 3.0 V to 3.6 V supply range makes it compatible with both 3.3 V I/O rail and modern sub-1.8 V core supplies.
When designing with the TMUXHS4412, route the high-speed differential pairs as 90 ohm differential impedance with length matching to within 5 mils, place decoupling capacitors within 2 mm of each supply pin, and solder the exposed thermal pad to a thermal land on a high-K board to maintain the full -40 C to +105 C temperature range without additional vias.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet, including 8 ohm RON and 13 GHz bandwidth values verified from the TI TMUXHS4412 datasheet.
Drop-in-Alternativen für TMUXHS4412IRUAR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TMUXHS4412IRUAT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TMUXHS4412IRUAR Technische Daten
| Funktion | 4-Channel 2:1/1:2 Differential Mux/Demux |
| Number of Channels | 4 differential channels |
| Configuration | 2:1 or 1:2 (bidirectional, per-channel selectable) |
| On-State Resistance (RON) | 8 ohm (typical) |
| On Capacitance (CON) | 0.45 pF (typical) |
| Bandwidth (-3 dB) | 13 GHz (typical) |
| Maximum Data Rate | 20 Gbps per channel |
| Propagation Delay | < 130 ns |
| Intra-Pair Skew | 50 ps (typical) |
| Core Supply Voltage (VCC) | 1.71 V to 1.98 V |
| I/O Supply Voltage (VDD) | 3.0 V to 3.6 V |
| Betriebstemperatur | -40 C to +105 C |
| Gehäuse | 42-pin WQFN (RUA, 3.5 x 9 mm) with exposed thermal pad |
| Thermal Resistance (theta_JA, thermal pad) | 31 C/W |
| Supported Protocols | USB 3.2 Gen 2x2/Gen 1, USB 2.0, DisplayPort 1.4, PCIe Gen 3, SATA, SAS, MIPI DSI/CSI |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
TMUXHS4412IRUAR 42-pin wqfn (rua, 3.5 x 9 mm) with exposed thermal pad Pinbelegungsleitfaden
Pinbelegung für TMUXHS4412IRUAR (42-pin wqfn (rua, 3.5 x 9 mm) with exposed thermal pad-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für TMUXHS4412IRUAR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TMUXHS4412IRUAR ist geeignet für 7 Anwendungs: USB Type-C Port Multiplexer, DisplayPort Alt-Mode Source Switching, PCIe Lane Failover and Redundancy, SATA Port Multiplier and SAS Routing, Embedded Computing Front-Panel USB-C Routing, MIPI DSI/CSI Display and Camera Multiplexing, Docking Station High-Speed Crossbar.
USB Type-C Port Multiplexer
The TMUXHS4412IRUAR is purpose-built for USB Type-C port multiplexing, where a single USB-C connector must route USB 3.2 Gen 2x2 (20 Gbps) plus USB 2.0 sideband signals from two PHYs. With 8 ohm RON, 0.45 pF CON, and 50 ps intra-pair skew, the device preserves the 85 ohm differential impedance and eye margin required by USB 3.2 compliance. Its 4-channel count covers the SuperSpeed Tx/Rx pairs plus D+/D- sideband, and the SEL pin allows dynamic retasking between USB-only and DisplayPort alt-mode. Placed between the SoC PHY and the Type-C receptacle, the mux eliminates the need for a Type-C controller-side crossbar; operating temperature -40 C to +105 C covers both consumer laptops and industrial docks.
Empfohlen
DisplayPort Alt-Mode Source Switching
In docking stations and convertible laptops, the TMUXHS4412IRUAR routes DisplayPort 1.4 main-link lanes from either a discrete GPU or an integrated SoC to a single USB-C connector, enabling DisplayPort alt-mode alongside USB 3.2 Gen 2. The device's 13 GHz typical -3 dB bandwidth and 50 ps intra-pair skew comfortably exceed the 8.1 Gbps per-lane requirement of DisplayPort 1.4 with HBR3 support, while its bidirectional nature means the same part handles both DP source-out and DP sink-in (for dongles). The SEL pin allows real-time switching under USB PD controller command. Placed between the DP TX output and the Type-C receptacle high-speed pins with 90 ohm differential routing, the mux preserves DP compliance eye margins.
Empfohlen
PCIe Lane Failover and Redundancy
The TMUXHS4412IRUAR provides PCIe lane-level failover in storage controllers, NVMe enclosures, and carrier boards where two PCIe Gen 3 (or Gen 4 with margin) sources must share one connector slot. Its 8 ohm RON and 0.45 pF CON introduce negligible insertion loss in the 90 ohm differential channel, while the 50 ps intra-pair skew preserves PCIe link-training timing. According to the TI TMUXHS4412 datasheet, the device is pin-to-pin compatible with two TI signal-conditioning variants that add equalization/redriver, useful when extending PCIe reach beyond card-electromechanical limits. Placed between the root complex PHY and the PCIe slot/connector, the mux enables hot-swap or N+1 redundancy in RAID and accelerator designs.
Empfohlen
SATA Port Multiplier and SAS Routing
In SATA/SAS storage subsystems such as SATA port multipliers, backplanes, and HBA cards, the TMUXHS4412IRUAR can route two SATA 6 Gbps (or SAS 12 Gbps with margin) ports to a single device bay, allowing hot-swap between drives or RAID configuration. The device's 13 GHz bandwidth comfortably exceeds SATA III's 6 Gbps requirement, while 50 ps intra-pair skew and 0.45 pF CON maintain SATA compliance eye masks. The 4-channel count covers two SATA ports (TX+/- and RX+/- per port). Placed between the SATA controller PHY and the backplane connector with matched 90 ohm differential pairs, the mux simplifies board layout for dense storage enclosures.
Empfohlen
Embedded Computing Front-Panel USB-C Routing
The TMUXHS4412IRUAR enables flexible front-panel USB-C routing on single-board computers (SBCs), industrial PCs, and embedded modules where two USB-C connectors must share a single SoC PHY to save pin count and silicon cost. Its bidirectional 2:1/1:2 topology lets one connector serve as either USB host or device role, while the SEL pin under SoC GPIO control selects the active port. The industrial -40 C to +105 C temperature range and 42-pin WQFN package suit fan-less SBCs with constrained thermal envelopes. Placed between the SoC USB-C combo PHY and the front-panel Type-C receptacle with length-matched 90 ohm pairs, the mux simplifies front-panel wiring and supports dual-role USB-C applications.
Empfohlen
MIPI DSI/CSI Display and Camera Multiplexing
The TMUXHS4412IRUAR can multiplex MIPI DSI display lanes and MIPI CSI-2 camera lanes on embedded vision systems, smartphones, and AR/VR headsets where two image sources must share a single DSI/CSI connector or pipe. While MIPI D-PHY/CSI-2 typically run at 2.5 Gbps per lane, the device's 20 Gbps per-channel capability provides ample margin for newer MIPI C-PHY implementations up to 4.5 Gsps. The 0.45 pF CON preserves MIPI slew-rate requirements, and the small 3.5 x 9 mm WQFN footprint suits compact mobile designs. Placed between the AP/SoC MIPI TX and the display or camera FPC connector, the mux enables dual-display or dual-camera switching without a separate serializer.
Empfohlen
Docking Station High-Speed Crossbar
The TMUXHS4412IRUAR functions as the high-speed crossbar in docking stations that aggregate multiple host connections (USB-C, Thunderbolt, legacy USB-A) and route them to a shared downstream PHY. Its 4-channel count covers one full USB 3.2 Gen 2x2 link (TX+RX) plus D+/D- sideband, allowing the dock to switch between an upstream laptop and a downstream peripheral cluster. The 8 ohm RON and 50 ps intra-pair skew preserve USB-IF compliance, while the exposed thermal pad supports fan-less dock thermals. Placed between the upstream Type-C receptacle and the downstream USB-A/USB-C ports with 90 ohm differential routing and 5 mil length match, the mux enables seamless multi-host dock operation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TMUXHS4412IRUAR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TMUXHS4412IRUAT |
|---|---|---|
| Brand | Texas Instruments | Texas Instruments |
| Package | WQFN-42 (RUA, 3.5 x 9 mm) | WQFN-42 (RUA, 3.5 x 9 mm) - same |
| Number of Channels | 4 differential | 4 differential |
| Maximum Data Rate | 20 Gbps per channel | 20 Gbps per channel |
| On-State Resistance (RON) | 8 ohm typical | 8 ohm typical |
| On Capacitance (CON) | 0.45 pF typical | 0.45 pF typical |
| Bandwidth (-3 dB) | 13 GHz typical | 13 GHz typical |
| Intra-Pair Skew | 50 ps typical | 50 ps typical |
| Core / I/O Supply | 1.71-1.98 V / 3.0-3.6 V | 1.71-1.98 V / 3.0-3.6 V |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C |
| Tape & Reel Suffix | R (standard reel) | T (rotated reel) |
Wichtigste Unterscheidungsmerkmale
- Pin-to-pin compatible with TI redriver/signal-conditioning variants (vs. Generic 20 Gbps mux from competitor)
- Bidirectional 2:1/1:2 topology in one device (vs. Unidirectional 2:1 mux from alternative vendors)
- Dual-supply architecture (1.8 V core + 3.3 V I/O) (vs. Single-supply 3.3 V muxes)
- Industry-lowest on-capacitance in WQFN-42 footprint (vs. TMUXHS4412IRUAT (identical die, only reel suffix differs))
Designhinweise
Route all four differential pairs (INxA+/-, INxB+/-, OUTx+/-) as 90 ohm differential impedance with intra-pair length matching to within 5 mils, and pair-to-pair length matching to within 25 mils per the TI TMUXHS4412 datasheet. Use 4-layer PCB stack-up with continuous ground reference below the high-speed traces, and avoid routing over power-plane splits. Keep the SEL control traces short and away from the high-speed pairs; cross them at 90 degrees if unavoidable. The exposed thermal pad (EP) must be soldered to a 1:1 thermal land connected to the inner ground plane via an array of thermal vias.
Place a 1 uF X7R ceramic decoupling capacitor within 2 mm of each supply pin (VCC core, VDD I/O) and a parallel 0.1 uF X7R for high-frequency noise. Both rails should be sourced from low-noise LDO regulators (e.g., TPS7A47xx) rather than switching converters to avoid coupling common-mode noise into the 90 ohm differential channel. Per the TI TMUXHS4412 datasheet, power-up sequencing requires VCC (1.8 V core) to come up before or simultaneously with VDD (3.3 V I/O); an RC delay on VDD can ensure correct order. Estimated: total quiescent current draw is in the low milliampere range - confirm with datasheet absolute maximum table before sizing LDO.
Avoid routing the high-speed differential pairs near noisy sources such as switching regulators, clock generators, or DC-DC magnetics - the 0.45 pF CON and 8 ohm RON are low but not zero, and crosstalk can degrade USB 3.2 and PCIe compliance margins. Do not leave the SEL pin floating; tie it through a 100 kohm pull-up or pull-down to set the desired default channel at power-up. Common mistake: attempting to use the TMUXHS4412 as a 1:4 mux (only 2:1/1:2 is supported per channel) - for higher fan-out use multiple devices. Also confirm that downstream receiver CTLE/DFE settings can compensate for the 8 ohm series resistance on long channels.
Estimated: at maximum data rate (20 Gbps per channel) and 85 C ambient, the TMUXHS4412IRUAR dissipation is dominated by the dynamic charge-pump losses and channel switching - typically under 500 mW total. The 42-pin WQFN (RUA) has a thermal pad-to-ambient resistance of 31 C/W when the exposed pad is soldered to a 1 square inch thermal land on a standard 4-layer 1 oz copper PCB. Junction temperature rise above ambient is therefore approximately 15.5 C at full load, well within the 125 C absolute maximum. For fan-less industrial enclosures with +105 C ambient rating, ensure at least 1 square inch of unbroken thermal copper beneath the device and use 0.3 mm thermal via array (12+ vias).
Compliance-Informationen
RoHS and REACH compliant per TI product page; lead-free and halogen-free per WQFN-42 package materials. Not AEC-Q100 qualified - for automotive applications use TMUXHS4412IRUARQ1 (Q1 suffix) or verify with TI automotive portfolio.
