TPD4S009DBVRG4 - 4ch 0.8pF ±8kV ESD TVS Array | TI
Teilenummer: TPD4S009DBVRG4 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.05 | $0,05 |
| 10 | $0.045 | $0,45 |
| 100 | $0.04 | $4,00 |
| 500 | $0.035 | $17,50 |
| 1.000 | $0.0312 | $31,20 |
TPD4S009DBVRG4 Übersicht
An ESD protection diode array, also called a TVS (transient voltage suppressor) array, is a circuit-protection component that clamps electrostatic-discharge and cable-discharge events before they reach sensitive transceiver silicon. Within the protection hierarchy, it sits at board level between the external connector and the protected IC, downstream of system-level surge arrestors and upstream of the chip's internal ESD structures, which it offloads.
Key features include the 0.8-pF ultra-low channel capacitance that preserves high-speed signal integrity on differential pairs, ±8-kV IEC 61000-4-2 contact and ±15-kV-class air-gap robustness per the device family rating, and an integrated VCC pin that lets the array clamp against the supply rail for bidirectional line protection. Excellent channel-to-channel matching keeps skew on differential pairs minimal, and the flow-through pinout simplifies routing from connector to transceiver.
The device uses a clamp-type TVS architecture with low dynamic resistance, so clamping voltage during an 8-kV contact strike stays low enough to protect typical high-speed transceivers. According to the TI datasheet, the TPD4S009 family is specifically characterized for high-speed differential interfaces where capacitance and symmetry dominate signal-eye performance.
Typical applications include HDMI and DisplayPort port protection, USB differential-line ESD clamping, and general high-speed interface protection in consumer electronics and connectivity equipment. The four-channel arrangement protects a full differential pair pair, or several single-ended lines, in one small package.
Design consideration: keep the array within millimeters of the connector and route symmetrically through the device; series inductance before the TVS dominates clamp performance more than the diode specification itself.
This page synthesizes verified distributor listings, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für TPD4S009DBVRG4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TPD4S009DBVR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TPD4S010DBVR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TPD4S009DBVRG4 Technische Daten
| Kanäle | 4 |
| Technology | TVS diode array (clamp type) |
| ESD Rating (Contact) | ±8 kV (IEC 61000-4-2 Level 4) |
| Line Capacitance | 0.8 pF |
| Reverse Standoff Voltage | 5.5 V |
| VCC Pin | Yes (rail-clamp bidirectional protection) |
| Application | High-speed differential interfaces (Display/HDMI port) |
| Gehäuse | SOT-23-6 (DBV) |
| Montageart | Surface Mount |
| Channel Matching | Excellent channel-to-channel capacitance matching |
| Typical Application Voltage Class | 5.5 V max operating line voltage |
| RoHS-Status | Compliant |
| Packaging | Tape & Reel (R suffix) |
TPD4S009DBVRG4 Pin-Konfiguration
| Pin 1 | IO1 — Protected I/O channel 1 (ESD clamp to GND/VCC) |
| Pin 2 | GND — Ground reference for ESD current discharge |
| Pin 3 | IO3 — Protected I/O channel 3 (ESD clamp to GND/VCC) |
| Pin 4 | IO4 — Protected I/O channel 4 (ESD clamp to GND/VCC) |
| Pin 5 | VCC — Supply-rail clamp pin (5.5 V max) for bidirectional protection |
| Pin 6 | IO2 — Protected I/O channel 2 (ESD clamp to GND/VCC) |
Typische Anwendungen
TPD4S009DBVRG4 ist geeignet für 6 Anwendungs: HDMI Port ESD Protection, USB Differential Line Protection, DisplayPort High-Speed Interface Protection, Consumer Electronics Board-Level Protection, Industrial Connectivity and Control Interfaces, Networking Equipment Port Protection.
HDMI Port ESD Protection
HDMI connectors are directly exposed to user handling, making them prime entry points for electrostatic discharge that can destroy TMDS transmitters and receivers. The TPD4S009DBVRG4 fits this role because its 0.8-pF channel capacitance keeps insertion loss low enough for multi-gigabit TMDS eye diagrams, and its excellent channel-to-channel matching minimizes intra-pair skew on the differential pairs. Mouser categorizes the part specifically as 4-channel Display/HDMI port ESD protection. In use, two TPD4S009DBVRG4 devices protect the high-speed lane pairs of an HDMI port, with each array placed within millimeters of the connector and its VCC pin tied to the port supply (max 5.5 V) so positive-going strikes clamp into the rail. The ±8-kV IEC 61000-4-2 Level 4 contact rating covers worst-case human-touch events at the shield and pins, offloading protection from the transceiver's fragile internal ESD structures and improving long-term field reliability.
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USB Differential Line Protection
USB ports on consumer and connectivity devices face repeated connector mating, ungrounded chargers, and user contact, all of which inject ESD into the D+/D- differential pair and VBUS line. The TPD4S009DBVRG4 suits this application because the 0.8-pF capacitance is low enough to preserve USB 2.0 high-speed (480 Mbps) eye margins, and the flow-through SOT-23-6 pinout allows straight-through routing of the pair with minimal stub length. One device covers the D+/D- pair plus adjacent lines, with the VCC pin (5.5 V standoff) referenced to VBUS-adjacent logic supply for bidirectional clamping. Per the TI datasheet, the ±8-kV IEC 61000-4-2 Level 4 contact rating exceeds typical port-level ESD test requirements, so systems can pass certified ESD immunity testing on the first design pass. Placing the array at the connector rather than at the transceiver is the key layout decision - shunting strike current before it propagates along the board prevents both silicon damage and radiated EMI coupling into neighboring circuits.
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DisplayPort High-Speed Interface Protection
DisplayPort main links run at 1.6 to 8.1 Gbps per lane, a speed regime where even 1 pF of added capacitance visibly closes the eye diagram. The TPD4S009DBVRG4 is appropriate here precisely because its 0.8-pF per-channel capacitance and excellent channel-to-channel matching keep differential insertion loss and intra-pair skew within budget, as characterized in the TI datasheet for high-speed differential interfaces. Each SOT-23-6 device protects one differential lane pair (two channels) or two single-ended auxiliary lines, so a full four-lane DisplayPort link uses several arrays clustered at the connector. The ±8-kV IEC 61000-4-2 contact rating (Level 4, the standard's maximum) protects the link transceiver against hot-plug and handling discharges, and the 5.5-V VCC-referenced architecture clamps positive strikes into the supply rail for lower residual voltage at the IC. Designers should verify eye-mask compliance at the maximum link rate in simulation, since total node capacitance includes package, trace, and connector contributions beyond the array itself.
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Consumer Electronics Board-Level Protection
Smartphones, tablets, set-top boxes, and accessories expose multiple external connectors to uncontrolled ESD environments during daily use and service. The TPD4S009DBVRG4 fits consumer BOMs because the SOT-23-6 package occupies minimal board area and cost (sub-dollar pricing, about $0.03 at volume per cross-referenced LCSC data), while the RoHS-compliant G4 ordering variant satisfies environmental compliance flows. Per the TI datasheet, the four-channel array with ±8-kV IEC 61000-4-2 Level 4 robustness lets one small device cover a connector's full line set, reducing component count versus single-line diodes. The 0.8-pF capacitance means the same part protects both slow control lines and high-speed data lines, simplifying procurement with one MPN across the board. In assembly, the array is placed at each external connector footprint with short ground vias; production ESD testing at the port then exercises the TVS rather than the application processor or bridge IC, cutting field-return rates for dead ports and intermittent connections.
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Industrial Connectivity and Control Interfaces
Industrial equipment with operator-accessible connectors - control panels, sensor cabling, field-serviceable I/O - encounters ESD from personnel and charged tooling even in grounded environments. The TPD4S009DBVRG4 addresses this because IEC 61000-4-2 Level 4 (±8-kV contact) is the immunity level many industrial test plans specify, and the array is rated to dissipate strikes at that maximum level per the TI datasheet. Its 5.5-V standoff suits 3.3-V and 5-V logic signaling common on industrial control lines, and the VCC pin provides rail-referenced bidirectional clamping for lines that swing to the positive rail. The 0.8-pF capacitance leaves margin for communication interfaces such as SPI, I2C, or high-speed serial links between modules. In practice, the array is fitted at the connector side of isolation or transceiver ICs, with a solid ground connection to chassis-bonded plane. Placing protection here extends maintenance intervals: ESD events are absorbed at the port instead of degrading transceiver junctions cumulatively over years of service.
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Networking Equipment Port Protection
Routers, switches, and gateways expose many RJ45, USB, and console ports to ESD in office and home environments, and each port failure means a service call or RMA. The TPD4S009DBVRG4 serves the low-voltage data lines of these ports where its 0.8-pF capacitance preserves signal integrity on high-speed management and console interfaces, while the ±8-kV IEC 61000-4-2 Level 4 contact rating handles certification-level ESD immunity testing per the TI datasheet description. On a typical design, arrays sit between the magnetics or connector and the PHY or switch IC, with the VCC pin tied to the port's 3.3-V supply for bidirectional clamping. The four-channel density keeps per-port protection component count low, which matters when a switch multiplies the circuit by eight or more ports. Cost is negligible relative to board value (about $0.03 at volume per cross-referenced LCSC pricing), yet eliminating a single ESD-related PHY failure pays for protection across the entire production run.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TPD4S009DBVRG4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TPD4S009DBVR | TPD4S010DBVR |
|---|---|---|---|
| Package | SOT-23-6 (DBV) | SOT-23-6 (DBV) - same | SOT-23-6 (DBV) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments |
| Channels | 4 | 4 | 4 |
| Line Capacitance | 0.8 pF | 0.8 pF | 0.8 pF (family rating) |
| ESD Contact Rating (IEC 61000-4-2) | ±8 kV (Level 4) | ±8 kV (Level 4) | ±8 kV (Level 4) |
| Reverse Standoff Voltage | 5.5 V | 5.5 V | 5.5 V |
| VCC Pin | Yes | Yes | Yes |
| Ordering Suffix | G4 (Green/RoHS designation) | No G4 suffix | TPD4S010 ordering family |
Wichtigste Unterscheidungsmerkmale
- Ordering-code-level compliance designation (vs. TPD4S009DBVR)
- Rail-referenced bidirectional clamping via VCC pin (vs. TPD4S010DBVR)
- Ultra-low 0.8-pF capacitance for multi-gigabit links (vs. TPD4S010DBVR)
Designhinweise
Place the TPD4S009DBVRG4 as close to the protected connector as possible - within a few millimeters of the pins. ESD strike current rises in nanoseconds, and any series trace inductance between the connector and the TVS develops an L*di/dt voltage overshoot that adds to the diode clamping voltage, defeating the protection. Route the protected IC behind the array, never on the connector side. Use short, multiple GND vias from pin 2 directly to the ground plane to minimize the return-path inductance during a strike.
On differential pairs, route symmetrically through the device so both lines of a pair see identical trace lengths and via counts; the array's excellent channel-to-channel capacitance matching (0.8-pF typical) is wasted if board-level asymmetry dominates intra-pair skew. For multi-gigabit links (HDMI TMDS, DisplayPort), account for total node capacitance - array package plus trace stubs plus connector - and verify eye-mask compliance in simulation before committing the layout. Avoid stubs; the flow-through pinout supports straight-through routing.
Do not exceed the 5.5-V reverse standoff voltage on any IO line or the VCC pin, or the array conducts continuously and may be damaged. Do not omit the VCC connection when protecting rail-referenced bidirectional lines - floating VCC leaves positive-going strikes without a low-impedance shunt path and raises effective clamping voltage. Finally, when substituting the non-G4 TPD4S009DBVR or family part TPD4S010DBVR, confirm the VCC pin connection matches your board since the pinout must match exactly for a true drop-in swap.
Compliance-Informationen
PartGenie compliance data for TPD4S009DBVRG4 lists RoHS Compliant; the G4 suffix denotes TI Green/RoHS ordering designation. REACH, halogen-free and conflict-minerals declarations not present in provided data - request certificates from TI.
