TPS62160DGKT - 3-17V 1A Step-Down Converter | Texas Instruments
Teilenummer: TPS62160DGKT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.32 | $2,32 |
| 10 | $1.98 | $19,80 |
| 100 | $1.62 | $162,00 |
| 500 | $1.31 | $655,00 |
| 1.000 | $1.07 | $1.070,00 |
TPS62160DGKT Übersicht
A buck converter is a switched-mode power supply topology that steps a higher DC input voltage down to a lower DC output voltage by chopping the input with a switch and smoothing the resulting pulsed waveform through an LC filter. Within the broader power-management IC hierarchy, the buck converter sits under DC/DC switching regulators, voltage regulators, and ultimately power-management ICs; it is preferred over linear (LDO) regulators whenever the input-to-output voltage differential is large because switching conversion wastes far less power as heat. The TPS62160 belongs to TI's TPS6216x family, optimized for high power density and small solution size.
Key features include DCS-Control (Direct Control with Seamless transition into power-save mode) topology for high efficiency across light and full load, up to 1 A continuous output current, output discharge and power-good indication, an enable pin for power sequencing, and pin-to-pin compatibility with the TPS62170 (higher current) and TPS62125 (different feature set) families. The device operates over a junction temperature range of -40 C to +125 C and offers over-temperature and over-current protection. The 8-pin VSSOP PowerPAD package provides a low thermal resistance path, enabling up to 1 A continuous load without external heat sinking.
Typical applications include standard 12 V rail supplies (such as those found in industrial PCs, factory automation, and embedded computing), point-of-load (POL) supplies from single or multiple Li-ion battery stacks in portable equipment, and as a high-efficiency replacement for LDOs when the input-to-output voltage drop would otherwise dissipate excessive power. The small solution size makes the part attractive for space-constrained designs such as solid-state drives, portable instruments, and USB-powered peripherals.
When designing with this device, choose an inductor with low DCR rated for the peak inductor current; verify output ripple with the selected output capacitor's ESR and capacitance value. Place the input capacitor as close as possible to the VIN and PGND pins to minimize switching-node ringing and EMI. Do not exceed the absolute maximum VIN of 17 V and keep the SW trace short and narrow to limit parasitic capacitance.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet. Engineers can compare alternatives with confidence because every replacement shares the same VSSOP-8 footprint and within 30 percent of key parameters.
Drop-in-Alternativen für TPS62160DGKT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TPS62160DGKR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TPS62170DGKT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TPS62125DRCR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TPS62160QDGKRQ1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TPS62160DGKT Grenzwerte & elektrische Eigenschaften
| Topologie | Synchronous Buck (Step-Down) with DCS-Control |
| Input Voltage Range (VIN) | 3 V to 17 V |
| Output Voltage Range (VOUT) | 0.9 V to 6 V (adjustable) |
| Maximaler Ausgangsstrom | 1 A |
| Switching Frequency (typical) | 2.25 MHz |
| Quiescent Current (typical) | 17 uA |
| Betriebstemperaturbereich | -40 C to +125 C |
| Gehäuse | VSSOP-8 PowerPAD (DGK), 3.00 mm x 3.00 mm |
| Anzahl der Pins | 8 |
| Montageart | Surface Mount |
| Enable-Pin | Yes (active-high) |
| Power-Good-Ausgang | Yes |
| Output Discharge | Yes |
| MSL-Level | 2 |
| RoHS-Status | Compliant |
| Pin-to-Pin Compatible Family | TPS62170, TPS62125 |
TPS62160DGKT Pin-Konfiguration
| Pin 1 | PGND — Power ground return for the high-current switching path |
| Pin 2 | VIN — Input supply voltage, 3 V to 17 V |
| Pin 3 | EN — Enable input, active high; drive high to enable the converter |
| Pin 4 | FB — Feedback input for adjustable output voltage, 0.9 V reference |
| Pin 5 | AGND — Analog ground for the control circuitry |
| Pin 6 | VOS — Voltage input to internal feedback divider for fixed-output variants |
| Pin 7 | NC — Not connected (per datasheet); leave floating or tie to ground |
| Pin 8 | SW — Switch node, connects to external inductor |
| Pin 9 | PowerPAD (PGND) — Exposed thermal pad, must be soldered to PGND copper for heat dissipation |
Typische Anwendungen
TPS62160DGKT ist geeignet für 6 Anwendungs: 12 V Industrial Rail Point-of-Load Supply, Li-Ion Battery Powered Portable Equipment, LDO Replacement for Power Density, USB-Powered Peripherals and Docking Stations, Solid-State Drive (SSD) Power Rails, Embedded Computing and Single-Board Computers.
12 V Industrial Rail Point-of-Load Supply
The TPS62160DGKT's 3-17 V input range and 1 A continuous output capability fit 12 V industrial bus rails directly without pre-regulation. DCS-Control topology sustains above 90 percent efficiency at 12 V to 3.3 V conversion at moderate loads, allowing the part to replace LDOs that would otherwise dissipate 8.7 W at 1 A. The exposed PowerPAD thermal pad keeps junction temperature within rating when the PCB copper area exceeds 1 square inch. Place input ceramic capacitance (10 uF X7R) close to VIN and PGND to suppress switching-node ringing typical of high-frequency buck converters.
Empfohlen
Li-Ion Battery Powered Portable Equipment
With 3-17 V input and 17 uA quiescent current, the TPS62160DGKT operates directly from one to three Li-ion cells in series while drawing negligible standby current. At 5 V to 3.3 V conversion and 100 uA load, DCS-Control power-save mode keeps efficiency above 60 percent, extending battery life in sleep-dominant IoT devices. The 2.25 MHz switching frequency allows a 1 uH inductor, enabling a total solution under 25 mm squared. Use a low-Iq battery monitor like the BQ27441 to track remaining capacity without loading the cell.
Empfohlen
LDO Replacement for Power Density
When a linear regulator would dissipate excessive heat (for example 12 V to 3.3 V at 1 A dissipates 8.7 W), the TPS62160DGKT replaces it with above 90 percent efficiency and a fraction of the thermal rise. Switching at 2.25 MHz, the part needs only a small inductor and ceramic capacitors, fitting in a footprint similar to a TO-220 LDO plus heatsink. Output ripple of approximately 10 mVpp is acceptable for digital logic, microcontrollers, and most analog blocks; add a small LC filter if powering noise-sensitive RF or audio stages.
Empfohlen
USB-Powered Peripherals and Docking Stations
USB 5 V supplies fall within the TPS62160DGKT's input range and the part down-converts to 3.3 V or 1.8 V rails for hub controllers, microcontrollers, and peripheral ASICs. The 17 uA quiescent current meets USB suspend current requirements. Output discharge on disable prevents residual voltage from latching downstream devices into an unknown state when USB power is removed. Place a TVS diode such as SMBJ5.0A on the USB VBUS line to protect the converter from ESD and surge transients.
Empfohlen
Solid-State Drive (SSD) Power Rails
The small 3 mm x 3 mm VSSOP footprint and high switching frequency make the TPS62160DGKT a strong fit for compact M.2 SSDs and portable SSDs where PCB area is severely constrained. The 1 A output covers NAND package power and controller core rails at 3.3 V and 1.8 V. Power-good output enables sequencing with other rails and provides a reset signal for the SSD controller. Use low-ESR ceramic output capacitors (X7R 10 uF) to keep ripple under 30 mVpp for reliable NAND operation.
Empfohlen
Embedded Computing and Single-Board Computers
Single-board computers, IoT gateways, and edge-AI modules frequently derive multiple voltages from a 5 V or 12 V supply; the TPS62160DGKT provides an efficient 3.3 V or 1.8 V rail for SoC I/O and peripheral chips. The exposed thermal pad supports sustained 1 A operation on a 2-layer board with adequate copper pours. Combined with the enable pin for sequencing and the power-good signal for reset generation, the part serves as a complete point-of-load solution. Pair with a higher-current buck for the SoC core rail and an LDO for analog rails.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TPS62160DGKT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TPS62160DGKR | TPS62170DGKT | TPS62125DRCR | TPS62160QDGKRQ1 |
|---|---|---|---|---|---|
| Package | VSSOP-8 PowerPAD (DGK) | VSSOP-8 PowerPAD (DGK) - same | VSSOP-8 PowerPAD (DGK) - same | VSSOP-8 PowerPAD (DGK) - same | VSSOP-8 PowerPAD (DGK) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Automotive Grade (AEC-Q100) | No | No | No | No | Yes |
| Pin-to-Pin Compatible | Yes (TPS62170 family) | Yes (identical die) | Yes (1.5 A upgrade) | Yes (per datasheet) | Yes (automotive qualified) |
Wichtigste Unterscheidungsmerkmale
- Pin-to-pin upgrade path to 1.5 A without PCB changes (vs. TPS62160DGKR)
- AEC-Q100 automotive qualification option exists in same footprint (vs. TPS62160QDGKRQ1)
- Higher switching frequency enables smaller inductor and capacitors (vs. TPS62125DRCR)
Designhinweise
Place the input ceramic capacitor (10 uF X7R, 25 V or higher) as close as possible to the VIN and PGND pins to minimize parasitic inductance in the high-frequency switching loop. Keep the SW trace short and narrow to limit radiated EMI, and route it away from sensitive analog traces. The exposed PowerPAD must be soldered to a PGND copper pour with multiple thermal vias to a bottom-side copper plane; without this, junction temperature will exceed 125 C at full 1 A load.
Estimated: At 12 V input and 3.3 V output at 1 A continuous load, the converter dissipates roughly 0.3 W at 90 percent efficiency, easily handled by the VSSOP-8 PowerPAD on a standard 2-layer board. At higher VIN (17 V in, 3.3 V out) efficiency drops to about 85 percent and dissipation rises to about 0.55 W. Adequate copper pours of at least 1 square inch on the PowerPAD are required to keep the junction temperature rise below 50 C above ambient at full load.
Do not exceed the absolute maximum VIN of 17 V; transients on 12 V industrial rails can spike higher and require a TVS diode such as SMBJ16A at the input. Avoid using the FB pin for fixed-output variants by tying it to VOS correctly per the schematic in the datasheet. Do not omit the bootstrap capacitor on SW (internal to most TPS6216x variants) or the output discharge resistor path will leave residual voltage on the rail after disable.
Keep the feedback (FB) trace away from the SW node and shielded by a ground pour to prevent noise coupling that would otherwise appear as output ripple or instability. Place the inductor close to the SW pin and orient it perpendicular to the FB trace to minimize magnetic coupling. The AGND and PGND pins should be connected at a single point under the IC to avoid ground-loop noise on the sensitive analog reference.
Compliance-Informationen
Standard TPS62160DGKT is not AEC-Q100 qualified; for automotive, use TPS62160QDGKRQ1 (AEC-Q100). RoHS and REACH compliance per TI product page.
