TPSM82901SISR - 1A 17V Buck Power Module | TI MicroSiP
Teilenummer: TPSM82901SISR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.2 | $22,00 |
| 100 | $1.85 | $185,00 |
| 500 | $1.58 | $790,00 |
| 1.000 | $1.36 | $1.360,00 |
TPSM82901SISR Übersicht
A buck power module is a complete DC-DC point-of-load converter that integrates the power semiconductor switches, control IC, and magnetics into a single encapsulated surface-mount package. Power modules sit at the top of the power management IC hierarchy (power module > switching regulator > voltage regulator > power management IC), trading a modest cost premium for dramatically reduced design effort, smaller solution footprint, and guaranteed magnetics integration.
Key features of the TPSM82901SISR include its wide 3 V to 17 V input range covering 5 V, 12 V, and buffered industrial rails, its 0.4 V to 5.5 V adjustable output capable of powering modern microcontrollers and FPGAs, its integrated inductor that eliminates magnetics selection, and its high 2.5 MHz switching frequency that enables the compact MicroSiP footprint and fast transient response. Per TI's product page, the module targets high efficiency and low quiescent current (IQ) operation, making it attractive for always-on and battery-backed systems.
The device uses a synchronous buck topology with internal power MOSFETs and an integrated shielded inductor, packaged using TI's MicroSiP technology that co-packages silicon and passives in a rectangular HSON-style 11-terminal outline. The SIS package is the smallest buck power module format TI offers, enabling point-of-load conversion in space-constrained boards where a discrete inductor would not fit. According to Partstack data, the 2.5 MHz switching frequency permits small external input and output capacitors.
Typical applications include point-of-load power for microcontrollers and DSPs (such as NXP S12 and Kinetis families), sensors and IoT edge nodes powered from 12 V rails, communication modules, and industrial auxiliary supplies where a compact, low-IQ step-down converter is required. The wide input range means one module design can serve 5 V USB, 12 V industrial, and 13.5 V automotive intermediate buses.
Design considerations: although the inductor is integrated, input ceramic capacitance and careful PCB layout around the VIN, SW, and GND pins remain essential for EMI and stability; always follow the layout guidance in the manufacturer datasheet.
This page synthesizes distributor pricing context, alternative-part analysis, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für TPSM82901SISR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TPSM82936SISLRR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TPSM82901SISR Grenzwerte & elektrische Eigenschaften
| Topologie | Synchronous buck (step-down) module |
| Eingangsspannungsbereich | 3 V to 17 V |
| Ausgangsspannungsbereich | 0.4 V to 5.5 V |
| Output Current | 1 A |
| Anzahl der Ausgänge | 1 |
| Schaltfrequenz | 2500 kHz (2.5 MHz) |
| Integrated Inductor | Yes (MicroSiP integrated inductor) |
| Isolation | Non-Isolated |
| Gehäuse | MicroSiP, 11 terminals (SIS), rectangular HSON-style |
| Montageart | Surface Mount |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 2 |
| Eigenschaften | High efficiency, low IQ |
| Series | TPSM (power module) |
TPSM82901SISR microsip, 11 terminals (sis), rectangular hson-style Pinbelegungsleitfaden
Pinbelegung für TPSM82901SISR (microsip, 11 terminals (sis), rectangular hson-style-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für TPSM82901SISR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TPSM82901SISR ist geeignet für 6 Anwendungs: Microcontroller Point-of-Load Power, Industrial 12V Rail Point-of-Load Conversion, IoT and Battery-Backed Sensor Nodes, Communication and Networking Modules, Compact Space-Constrained Designs, Automotive-Adjacent and 13.5V Bus Supplies.
Microcontroller Point-of-Load Power
The TPSM82901SISR is a natural fit for microcontroller power rails: its 0.4 V to 5.5 V adjustable output covers 1.2 V core, 1.8 V, 2.5 V, and 3.3 V I/O rails, and its 1 A rating comfortably supplies MCUs such as NXP S12, Kinetis, or ARM Cortex-M devices drawing tens to hundreds of milliamps. The 3 V to 17 V input range means the same module works from 5 V or 12 V system rails. With the inductor integrated in the 11-terminal MicroSiP package and 2.5 MHz switching, the complete converter fits beside the MCU without consuming surrounding board area, and fast transient response handles sleep-to-active current steps. Compared to a discrete regulator plus inductor, the module reduces BOM count and removes magnetics risk entirely.
Empfohlen
Industrial 12V Rail Point-of-Load Conversion
Industrial control boards commonly distribute a 12 V bus that must be stepped down to logic-level rails. The TPSM82901SISR accepts up to 17 V input, covering 12 V rails plus tolerance and transients, and delivers an adjustable 0.4 V to 5.5 V output at 1 A for sensors, isolators, and interface ICs. The module's low quiescent current suits continuously powered auxiliary circuits, while high efficiency at 2.5 MHz minimizes heat in sealed industrial enclosures with limited airflow. Because the inductor is integrated, the converter footprint stays small on dense PLC or motor-control boards, and the guaranteed internal loop geometry simplifies EMI qualification compared with hand-wound magnetics layouts. Thermal derating per the datasheet should be checked at full load in high ambient temperatures.
Empfohlen
IoT and Battery-Backed Sensor Nodes
Always-on IoT nodes benefit from the TPSM82901SISR's low quiescent current (IQ) design goal stated by TI, which extends standby time in battery-backed or energy-harvesting systems. The 3 V minimum input allows operation directly from a 3.3 V or Li-ion-adjacent rail, while the 17 V maximum also accepts adapters and 12 V supplies for mains-powered gateways. The single 0.4 V to 5.5 V output at 1 A powers a wireless MCU, sensor front end, and memory simultaneously. The compact MicroSiP footprint fits inside small sensor enclosures, and the integrated shielded inductor reduces radiated emissions near sensitive RF receivers. Designers should size input and output ceramic capacitors per the datasheet to maintain stability at light load.
Empfohlen
Communication and Networking Modules
Networking line cards and communication modules typically regulate a 12 V intermediate bus down to point-of-load rails for PHYs, microcontrollers, and memory. The TPSM82901SISR's 17 V input ceiling and 1 A output make it suitable for powering individual low-current subsystems such as EEPROM configuration storage, clock circuits, or management controllers. Its 2.5 MHz switching frequency places switching harmonics well above sensitive communication bands, easing filtering, and the integrated inductor's shielded construction limits magnetic coupling to nearby high-speed differential pairs. The adjustable output supports the mix of 1.0 V, 1.8 V, 2.5 V, and 3.3 V rails common in communication silicon. Layout per the TI datasheet keeps hot-loop parasitics minimal.
Empfohlen
Compact Space-Constrained Designs
Where board area is the binding constraint - dongles, adapter cards, sensor tags, and dense mixed-signal boards - the TPSM82901SISR's MicroSiP package is among the smallest complete 1 A buck solutions available from TI. The integrated inductor removes the single largest component from a discrete buck design, and the 2.5 MHz frequency keeps external input/output capacitors small. The module's rectangular HSON-style 11-terminal outline reflows on standard SMT lines with no special handling beyond MSL 2 baking rules. Compared with a switching regulator IC plus external inductor, this module typically saves significant PCB area and eliminates the risk of inductor saturation mis-selection. Verify height clearance in thin enclosures against the datasheet package drawing.
Empfohlen
Automotive-Adjacent and 13.5V Bus Supplies
A 13.5 V automotive intermediate bus sits just under the TPSM82901SISR's 17 V absolute input limit, making the module usable for non-critical, module-internal loads such as sensor conditioning, display bias for small panels, and auxiliary microcontroller power in body electronics. Note that the verified data does not state AEC-Q100 qualification for this part, so it should not be assumed automotive-grade without confirming the TI quality documentation; check the TPSM82901 product page for qualification status. Within its rating, the module provides a clean adjustable rail from 0.4 V to 5.5 V at 1 A with the compactness and low IQ that clustered body modules demand.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TPSM82901SISR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TPSM82936SISLRR |
|---|---|---|
| Package | MicroSiP (SIS), 11-terminal | MicroSiP (uSiP-11) - same outline family |
| Brand | Texas Instruments | Texas Instruments |
| Output Current | 1 A | 3 A |
| Input Voltage Range | 3 V to 17 V | 3 V to 17 V |
| Output Voltage Range | 0.4 V to 5.5 V | 0.6 V to 5.5 V |
| Topology | Synchronous buck module, integrated inductor | Synchronous buck module, integrated inductor |
| Match Type | Reference part | Drop-in footprint family, current rating 3x (not exact parametric match) |
Wichtigste Unterscheidungsmerkmale
- Smallest solution footprint via integrated inductor (vs. TPSM63604RDLR)
- Wider input range for flexible rails (vs. TPSM63604RDLR)
- Low IQ operation for always-on loads (vs. TPSM63604RDLR)
Designhinweise
Even though the inductor is integrated, place the input ceramic capacitor as close as possible to the VIN and GND pins to minimize the hot-loop area; the datasheet layout section provides a reference layout for the SIS package. Use a low-ESR X5R/X7R ceramic on the input and follow the recommended output capacitance range rather than maximizing it, since excessive output capacitance can affect loop stability in fixed-compensation modules. Keep the feedback trace short and away from the switch node, and connect the exposed ground terminals directly to a solid ground plane with multiple vias for thermal and EMI performance.
Estimated: at VIN = 12 V, VOUT = 3.3 V, and a full 1 A load, output power is 3.3 W and dissipation equals input power minus output power; at a typical 85-90% module efficiency this is roughly 0.4-0.6 W dissipated in the package. The MicroSiP package relies on PCB copper for heat spreading, so provide adequate ground-plane area under and around the module and consult the datasheet thermal derating curves for your board stack-up before committing to full-load operation in elevated ambient temperatures.
Do not exceed the 17 V absolute input rating - 12 V nominal buses with unclamped transients can exceed it, so verify worst-case rail excursions or add local input protection. Ensure the input voltage never drops below the 3 V minimum while loaded, and observe the adjustable output minimum of 0.4 V. The SIS MicroSiP package is MSL 2 rated per distributor data (Vyrian): respect floor-life limits and bake per JESD-type floor-life rules if the reel bag is left open. Finally, this part is not pin-compatible with any cross-brand module - do not assume footprint substitution without datasheet-level verification.
Compliance-Informationen
Verified web data does not explicitly state RoHS/REACH/lead-free status for TPSM82901SISR; marked unknown rather than assumed. Confirm on TI.com product page before production release.
