VTM1408S52Z0250T00 - 67.5A Sine Amplitude Converter | Vicor
Teilenummer: VTM1408S52Z0250T00 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
VTM1408S52Z0250T00 Übersicht
What is a Sine Amplitude Converter (SAC)? A VTM/SAC is a non-isolated, zero-voltage-switching DC-DC converter that operates as a current multiplier driven by an upstream sine-wave source. SACs sit in the power management hierarchy below pre-regulator modules (PRMs) and above point-of-load regulators (PoLs), serving as efficient low-impedance bus converters in the Factorized Power Architecture (FPA). Their very low AC output impedance extends beyond the bandwidth of most downstream regulators, allowing load decoupling capacitance to be relocated to the input of the VTM — a major PCB-area savings in high-current digital systems.
Key features of the VTM1408S52Z0250T00 include 67.5A continuous output current, 1.2V nominal output voltage, and SAC topology that enables >95% efficiency at full load. The SM-ChiP co-molded package provides an enhanced thermal interface area with superior thermal conductivity, allowing the part to dissipate significant power while remaining compatible with standard pick-and-place assembly. The device targets high-current, low-voltage CPU/GPU/ASIC core rails in computing, AI accelerator, and high-end data-center applications.
Typical applications for the VTM1408S52Z0250T00 include powering high-current processors, ASICs, and FPGAs in advanced computing platforms, data-center CPU cores, AI accelerator cards, GPU core rails, telecom base-station digital cards, and high-density server voltage regulator modules. It is typically used downstream of a Vicor PRM that provides the regulated sine-amplitude input.
When designing with this VTM, plan the upstream PRM stage to deliver a clean, regulated DC input matched to the VTM K-factor, and place input bypass capacitance close to the SAC input pads to take advantage of the relocated bulk-capacitance topology. Confirm that the VTM output is followed by a fast point-of-load regulator for sub-1V rails and that thermal copper area meets the chiP package dissipation requirements.
This page synthesizes distributor pricing, parametric comparison with related VTM/SAC variants, and practical design considerations for Factorized Power Architecture not found in a single Vicor datasheet excerpt.
Drop-in-Alternativen für VTM1408S52Z0250T00 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
VTM1408S52Z0150T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VTM1408S52Z0350T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VTM1408S53Z0250T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PRM1408S52Z0250T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VTM1308S52Z0250T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VTM1408S52Z0250T00 Grenzwerte & elektrische Eigenschaften
| Manufacturer | Vicor Corporation |
| Product Type | Non-Isolated PoL Module DC-DC Converter (VTM/SACTM current multiplier) |
| Anzahl der Ausgänge | 1 |
| Ausgangsspannung | 1.2 V |
| Maximaler Ausgangsstrom | 67.5 A |
| Eingangsspannungsbereich | 38.4 V to 55 V |
| Topologie | Sine Amplitude Converter (SAC) / Voltage Transformation Module (VTM) |
| Isolation | Non-Isolated |
| Montageart | Surface Mount (SM-ChiP) |
| Gehäuse | SM-ChiP (Vicor co-molded ChiP) |
| Pick-and-Place Compatible | Yes |
| Efficiency at Full Load | >95% typical (SACTM family) |
| K-factor (Vout/Vin ratio) | 1/32 (nominal) |
| RoHS-Status | Compliant |
| Safety Approvals | UL/CUL NRTL recognized (per datasheet cover) |
VTM1408S52Z0250T00 Pin-Konfiguration
| Pin 1 | VIN+ — Positive input power pad (SACTM input) |
| Pin 2 | VIN- — Negative input power / ground return pad |
| Pin 3 | VOUT+ — Positive output power pad (1.2V nominal) |
| Pin 4 | VOUT- — Negative output power / ground return pad |
| Pin 5 | VC — [DATA_NEEDED: control pad; refer to datasheet mechanical drawing] |
Typische Anwendungen
VTM1408S52Z0250T00 ist geeignet für 6 Anwendungs: AI Accelerator / GPU Core Rails, High-Density Server Voltage Rails, Telecom Base Station Digital Cards, FPGA and ASIC Core Power, Industrial High-Performance Computing, Datacenter Intermediate Bus Conversion.
AI Accelerator / GPU Core Rails
The VTM1408S52Z0250T00 is well matched to high-current GPU and AI accelerator core rail requirements. With 1.2V nominal output and 67.5A continuous current, it can supply roughly 81W from a compact SM-ChiP package — enough for many accelerator silicon core domains when followed by a fast point-of-load stage. Its >95% full-load efficiency in the SACTM family reduces thermal load versus a buck regulator at the same VIN-VOUT conversion. Compared with conventional buck converters, the SAC VTM minimizes switching-related EMI and provides exceptionally low output impedance above downstream regulator bandwidth, improving transient response under GPU load steps.
Empfohlen
High-Density Server Voltage Rails
Servers and high-density compute platforms benefit from the VTM1408S52Z0250T00's small SM-ChiP footprint and high current density. The non-isolated SAC topology delivers high efficiency at the 48V-to-PoL conversion stage, where traditional 12V intermediate bus architectures waste substantial power. Factorized Power Architecture using a PRM plus this VTM lets designers place bulk capacitance at the VTM input rather than at the load, freeing PCB area for memory and signal routing. The pick-and-place compatible SM-ChiP supports standard SMT assembly, lowering manufacturing cost versus through-hole or BGA-based modules.
Empfohlen
Telecom Base Station Digital Cards
Telecom base-station digital cards typically require high-current, low-voltage PoL rails for baseband DSPs, FPGAs, and network processors. The VTM1408S52Z0250T00's 67.5A output and SACTM topology deliver the necessary current with efficiency above 95%, keeping thermal rise on densely populated base-station cards within budget. The 38.4V-55V input range aligns with the standard 48V telecom bus. Operating temperature range compatible with industrial environments makes the part suitable for outdoor-cabinet base-station deployments where airflow is constrained.
Empfohlen
FPGA and ASIC Core Power
Modern FPGAs and ASICs demand high-current low-voltage cores with strict transient response. The VTM1408S52Z0250T00 supplies 1.2V at 67.5A, suitable for many FPGA core domains either directly or when followed by a final-stage buck regulator. The SACTM topology's low output impedance beyond downstream regulator bandwidth minimizes voltage droop during fast load steps typical of FPGA logic toggling. Designers can exploit the relocated-bulk-capacitor architecture to place fewer capacitors near the load, freeing area for high-speed signal routing on FPGA mezzanine cards.
Empfohlen
Industrial High-Performance Computing
Industrial HPC systems, edge servers, and ruggedized compute platforms benefit from the VTM1408S52Z0250T00's compact SM-ChiP package, surface-mount compatibility, and high efficiency. The non-isolated SAC topology reduces conversion losses in 48V-to-PoL architectures common in industrial computing. The wide operating temperature range supports industrial environments, and the high power density enables compact chassis designs. When paired with an upstream Vicor PRM, designers achieve full Factorized Power Architecture benefits in ruggedized edge compute platforms.
Empfohlen
Datacenter Intermediate Bus Conversion
Datacenter intermediate bus conversion from 48V to sub-2V PoL rails is the canonical use case for the VTM1408S52Z0250T00. The SACTM family achieves >95% efficiency at the 48V-to-PoL step, dramatically reducing distribution losses compared to legacy 12V bus architectures. The 1.2V output and 67.5A current rating cover a broad class of server CPU cores and memory terminations. Factorized Power Architecture lets a single PRM feed multiple VTMs in parallel for higher currents, supporting datacenter power-delivery designs with proven efficiency, density, and reliability.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für VTM1408S52Z0250T00 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | VTM1408S52Z0150T00 | VTM1408S52Z0350T00 | VTM1408S53Z0250T00 | PRM1408S52Z0250T00 | VTM1308S52Z0250T00 |
|---|---|---|---|---|---|---|
| Package | SM-ChiP (Vicor co-molded ChiP) | SM-ChiP - same | SM-ChiP - same | SM-ChiP - same | SM-ChiP - same family | SM-ChiP - same family, different generation |
| Brand | Vicor | Vicor | Vicor | Vicor | Vicor | Vicor |
| Topology | VTM / SACTM current multiplier | VTM / SACTM | VTM / SACTM | VTM / SACTM | PRM pre-regulator | VTM / SACTM |
| Input Voltage Range | 38.4 V to 55 V | 38.4 V to 55 V | 38.4 V to 55 V | S53 range variant | PRM input range | 38.4 V to 55 V |
| Isolation | Non-Isolated | Non-Isolated | Non-Isolated | Non-Isolated | Non-Isolated (typical) | Non-Isolated |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Wichtigste Unterscheidungsmerkmale
- Proprietary Sine Amplitude Converter topology enables >95% efficiency at full load (vs. Conventional buck regulator at the same 48V-to-PoL conversion)
- Relocated bulk capacitance architecture frees PCB area at the load (vs. Buck regulator requiring bulk capacitors at the load)
- Surface-mount SM-ChiP package with pick-and-place compatibility (vs. Through-hole Vicor modules (e.g. Maxi/Mini/Micro brick form factors))
Designhinweise
Place input bulk capacitors close to the VTM input power pads to exploit the SACTM topology's relocated-capacitance benefit. The datasheet states that capacitance normally at the load can be located at the input because the VTM has very low AC impedance beyond downstream regulator bandwidth. Use low-ESR ceramic or polymer capacitors rated for the input voltage with adequate voltage derating. Provide wide power-plane copper pours on VIN+, VIN-, VOUT+, and VOUT- pads to minimize parasitic inductance and support the 67.5A continuous current.
The SM-ChiP package provides a large thermal interface area and superior thermal conductivity per Vicor's datasheet. Even so, at 67.5A continuous output and high VIN-VOUT conversion ratios, dissipated power can be substantial. Provide adequate copper area or thermal vias beneath the package thermal interface, and ensure the airflow in the system meets the datasheet derating curves. Always design within the safe operating area specified in the datasheet and verify junction temperature under worst-case load and ambient conditions.
Do not attempt to operate the VTM without a proper upstream PRM stage. The VTM expects a regulated sine-amplitude drive and is not a standalone regulator. Confirm the PRM-VTM K-factor pair is matched per Vicor's Factorized Power Architecture guidelines. Do not exceed the 55V maximum input or drop below 38.4V minimum input. Verify the PRM control loop compensation matches the VTM input characteristics for stable operation.
Compliance-Informationen
RoHS compliance and UL/CUL NRTL safety recognition per the Vicor datasheet cover. Other compliance fields were not explicitly stated in the verified web data and are marked unknown.
