VTM2308S60Z01A1T00 - 131A 48V VTM Current Multiplier | Vicor
Teilenummer: VTM2308S60Z01A1T00 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
VTM2308S60Z01A1T00 Übersicht
A Voltage Transformation Module (VTM) is a specialized non-isolated DC-DC converter topology developed by Vicor that uses a proprietary zero-current-switching (ZCS) / zero-voltage-switching (ZVS) sine-amplitude-converter (SAC) architecture. The VTM family belongs to the broader hierarchical group of factorized power architecture (FPA) components, which in turn are a sub-category of board-mount DC-DC converters and ultimately power management ICs/modules. VTMs deliver a fixed transformation ratio (K-factor), are bidirectional, and exhibit very low output impedance - effectively multiplying output current while dividing voltage.
Key specifications include a 1 V output voltage, 131 A continuous output current, 48 V nominal input, and the high-efficiency SAC switching topology that minimizes switching losses. The 2308 SM-CHIP package integrates the SAC transformer and switching elements into a single surface-mount module, eliminating external magnetics and reducing total solution size compared with discrete synchronous buck designs. Operating temperature range and full-load efficiency numbers are published in the manufacturer datasheet.
Architecturally, the VTM2308S60Z01A1T00 uses Vicor's proprietary sine-amplitude-converter topology, which provides bidirectional current flow, fixed K-factor voltage transformation, and very fast transient response due to its low output impedance. Combined with a VI CHIP PRM pre-regulator upstream, it forms a complete factorized power solution that outperforms conventional intermediate-bus converters for high-current CPU/GPU core or POL applications.
Typical applications include 48 V direct-to-POL conversion for high-current processors (CPUs, GPUs, ASICs), high-performance computing and AI accelerator boards, telecom equipment 48 V backplane distribution, and server motherboard core voltage rails where board real estate and efficiency are critical.
When designing with this VTM, ensure that the upstream PRM or supply can source the reflected input current (Iin = Iout × K-factor), provide adequate thermal management under the 2308 SM-CHIP package, and respect the input voltage and polarity ratings. The module is non-isolated, so input-to-output isolation must be provided elsewhere in the system (typically in the upstream PRM/BCM).
This page synthesizes real distributor pricing, drop-in alternative candidates from web cross-reference data, and practical design notes not found in the bare manufacturer datasheet - useful for engineers evaluating the VTM2308S60Z01A1T00 for new high-current POL designs.
Drop-in-Alternativen für VTM2308S60Z01A1T00 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit VTM2308S60Z01A1T00 (gleiche Bauform und Footprint) – abweichend in Mounting Type, Nominal Input Voltage, Output Voltage, Package, Topology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
VTM2308S60Z01B0T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VTM2308S60Z1513T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$82.5 / Stück
Datenblatt ansehen →VTM2308S60Z00B0T00
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
VTM2308S60Z01A1T00 Grenzwerte & elektrische Eigenschaften
| Topologie | Non-Isolated PoL Module / VTM Current Multiplier (Sine-Amplitude Converter) |
| Ausgangstyp | Fixed (1 V) |
| Anzahl der Ausgänge | 1 |
| Nominal Input Voltage | 48 V |
| Ausgangsspannung | 1 V |
| Maximaler Ausgangsstrom | 131 A |
| Gehäuse | 2308 SM-CHIP |
| Montageart | Surface Mount |
| Isolation | Non-Isolated |
| Manufacturer | Vicor Corporation |
| Series | VTM (Voltage Transformation Module) |
| Lifecycle | Active per DigiKey listing (Oct 2026) |
VTM2308S60Z01A1T00 2308 sm-chip Pinbelegungsleitfaden
Pinbelegung für VTM2308S60Z01A1T00 (2308 sm-chip-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für VTM2308S60Z01A1T00.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
VTM2308S60Z01A1T00 ist geeignet für 6 Anwendungs: 48 V Direct-to-POL CPU/GPU Core Rail, AI Accelerator Card Power Delivery, Telecom 48 V Backplane POL Conversion, High-Performance Server Core Voltage Rails, Datacenter 48 V-to-Load Power Shelves, Test & Measurement Load Simulator.
48 V Direct-to-POL CPU/GPU Core Rail
The VTM2308S60Z01A1T00's 1 V / 131 A output and 48 V nominal input are a direct match for high-current processor core voltage rails. Placed downstream of a Vicor PRM pre-regulator on a 48 V bus, it delivers 1 V at full load with the high efficiency and fast transient response of the sine-amplitude-converter topology. Unlike discrete synchronous buck converters at 130 A, the 2308 SM-CHIP module eliminates external magnetics and shrinks the POL footprint by roughly 50%, freeing board area for memory channels or signal routing in CPU/GPU mezzanine cards.
Empfohlen
AI Accelerator Card Power Delivery
AI accelerator cards (training and inference ASICs) routinely draw 100-150 A at sub-1 V core voltages from a 48 V rack bus. The VTM2308S60Z01A1T00's 131 A / 1 V rating and SAC topology deliver the required current with sub-millisecond transient response, which is critical for the dynamic load steps created by tensor pipelines. Compared with a discrete buck at this current level, the SM-CHIP module reduces BOM count by eliminating output inductors and most output capacitors, enabling a denser accelerator PCB layout.
Empfohlen
Telecom 48 V Backplane POL Conversion
In telecom base-station and central-office equipment, -48 V backplanes are stepped down to intermediate 48 V then to sub-1 V rails for DSPs and ASICs. The VTM2308S60Z01A1T00 enables this final 48 V-to-1 V conversion with high efficiency and a small footprint, and its bidirectional SAC topology provides graceful pre-bias startup into a pre-charged load - avoiding the inrush and latch-up problems of conventional buck regulators on telecom boards. The SM-CHIP package withstands the vibration and thermal-cycling profiles typical of telecom hardware.
Empfohlen
High-Performance Server Core Voltage Rails
Hyperscale and enterprise server motherboards increasingly migrate from 12 V to 48 V intermediate bus to reduce I²R losses. The VTM2308S60Z01A1T00 mounted directly next to a CPU or GPU socket converts the 48 V bus to a clean 1 V at 131 A with minimal board area, helping server designers meet strict dynamic-voltage-identification (DVID) transient windows. The VTM's low output impedance also reduces the bulk-output-capacitor bank required on the CPU socket, which is often the largest single component cluster on a server PCB.
Empfohlen
Datacenter 48 V-to-Load Power Shelves
Open Compute Project (OCP) and similar 48 V rack architectures use point-of-load conversion near the load to minimize distribution losses. The VTM2308S60Z01A1T00 placed on the load-side of a 48 V bus-bar delivers 1 V at 131 A per device, and multiple VTMs can be paralleled (with Vicor's array-control techniques) for higher-current rails. Compared with discrete 48 V-to-1 V buck stages, the VTM-based architecture delivers higher efficiency at partial load - critical for datacenter PUE targets and thermal budgets.
Empfohlen
Test & Measurement Load Simulator
ATE and burn-in systems that emulate high-current CPU/GPU loads benefit from the VTM2308S60Z01A1T00's bidirectional current flow. The SAC topology naturally supports sourcing and sinking current, allowing the test rig to simulate dynamic processor load profiles without external load-step circuitry. The SM-CHIP module's small footprint fits inside a tester load board, and the 1 V / 131 A rating covers the majority of modern processor stress-test currents at sub-1 V core voltages.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für VTM2308S60Z01A1T00 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | VTM2308S60Z01B0T00 | VTM2308S60Z1513T00 | VTM2308S60Z00B0T00 |
|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor |
| Package | 2308 SM-CHIP | 2308 SM-CHIP - same | 2308 SM-CHIP - same | 2308 SM-CHIP - same |
| Topology | VTM (Sine-Amplitude Converter), Non-Isolated PoL | VTM (Sine-Amplitude Converter) | VTM (Sine-Amplitude Converter) | VTM (Sine-Amplitude Converter) |
| Nominal Input Voltage | 48 V | 48 V | 48 V | 48 V |
| Isolation | Non-Isolated | Non-Isolated | Non-Isolated | Non-Isolated |
| Bidirectional Current Flow | Yes (SAC topology) | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Proprietary sine-amplitude-converter (SAC) topology with bidirectional current flow (vs. Discrete synchronous buck regulator at 1 V / 130 A)
- Integrated 2308 SM-CHIP package eliminates external magnetics (vs. Discrete buck at 1 V / 130 A)
- Drop-in compatible with the VTM2308S60Z family at different K-factors (vs. VTM2308S60Z1513T00)
Designhinweise
Estimated: at 48 V input, 1 V output, and 131 A output, the VTM2308S60Z01A1T00 reflects an input current of roughly 2.7-3.0 A (depending on K-factor). The 2308 SM-CHIP package dissipates the conversion losses as heat into the host PCB. Follow Vicor's thermal-via and copper-pour recommendations for the land pattern; without the recommended PCB thermal design, the device cannot sustain full 131 A output. Designers should model the PCB's effective theta_JA using the Vicor application-note thermal model before committing to a layout.
The 2308 SM-CHIP land pattern is Vicor-proprietary. Do not substitute a generic QFN or BGA footprint; use the land pattern published in the VTM2308 datasheet exactly. Place the device near the load (CPU/GPU socket) to minimize the high-current 1 V output loop. Provide a direct, low-inductance path from the upstream PRM/BCM 48 V output to the VTM input, including adequate input bulk capacitance per the datasheet.
Do not connect the VTM2308S60Z01A1T00 directly to a -48 V telecom backplane without a PRM/BCM upstream; the VTM is non-isolated and bidirectional, so input polarity and voltage must be respected. Avoid paralleling multiple VTM2308S60Z01A1T00 devices without using Vicor's array-control or current-sharing technique - simply paralleling outputs can cause circulating currents and thermal runaway. Finally, do not assume the K-factor can be modified in software; the VTM's transformation ratio is fixed by internal transformer construction.
Compliance-Informationen
RoHS and REACH compliance per Vicor standard product environmental statements for the VTM SM-CHIP family. AEC-Q100 is not applicable - this is a board-mount power module, not an automotive-grade IC. Halogen-free status not explicitly listed in verified web data and is marked unknown.
