W634GU6RB-09 - 4Gb DDR3L SDRAM 1066MHz | Winbond
Teilenummer: W634GU6RB-09 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16.15 | $16,15 |
| 10 | $14.53 | $145,30 |
| 100 | $12.92 | $1.292,00 |
| 500 | $11.3 | $5.650,00 |
| 1.000 | $9.69 | $9.690,00 |
W634GU6RB-09 Übersicht
DDR3L SDRAM (Double Data Rate 3 Low Voltage Synchronous Dynamic Random-Access Memory) is a type of volatile memory that operates at a lower supply voltage of 1.35V, reducing power consumption compared to standard DDR3 (1.5V). It is part of the DDR3 family, which uses double data rate signaling to transfer data on both edges of the clock, and is widely used in computing, networking, and embedded systems for high-bandwidth data storage and processing.
Key features include a 4Gbit density, 1.35V supply voltage, 1066 MHz clock speed, and a 96-ball VFBGA package. The low voltage operation makes it ideal for power-sensitive applications, while the high speed supports demanding workloads. The device is RoHS compliant and halogen-free, meeting modern environmental standards.
Technically, the W634GU6RB-09 uses an 8n-prefetch architecture typical of DDR3L, enabling high burst lengths and efficient data transfer. The 20 ns access time indicates the row-to-column delay, and the 1.067 GHz clock allows data rates up to 2133 Mbps. The VFBGA package offers excellent thermal and electrical performance, with a compact footprint suitable for space-constrained designs.
Typical applications include high-performance computing, networking equipment, embedded systems, and industrial automation. The low power consumption and high speed make it suitable for servers, routers, and IoT gateways where memory bandwidth and efficiency are critical.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at high frequencies. The 1.35V supply must be regulated accurately to avoid data corruption.
Drop-in-Alternativen für W634GU6RB-09 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit W634GU6RB-09 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Memory Size, Package, Data Rate, Memory Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
W634GU6RB09J
✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →W634GU6RB09I
✓ Auf Lager
$6 / Stück
Datenblatt ansehen →W634GU6RB-09TR
✓ Auf Lager
$25 / Stück
Datenblatt ansehen →W634GU6RB-11
✓ Auf Lager
$13.5227 / Stück
Datenblatt ansehen →W634GU6RB12J
✓ Auf Lager
$6 / Stück
Datenblatt ansehen →MT40A512M16LY-062E
✓ Auf Lager
$6.65 / Stück
Datenblatt ansehen →K4A8G165WB-BCWE
✓ Auf Lager
$6.55 / Stück
Datenblatt ansehen →H5AN8G6NDJR
✓ Auf Lager
$35 / Stück
Datenblatt ansehen →W634GU6RB-09 Grenzwerte & elektrische Eigenschaften
| Speichertyp | DDR3L SDRAM |
| Speichergröße | 4Gbit (512M x 8) |
| Versorgungsspannung | 1.35V |
| Clock Frequency | 1.067 GHz |
| Datenrate | 2133 Mbps |
| Access Time | 20 ns |
| Schnittstelle | Parallel |
| Gehäuse | 96-VFBGA (7.5x13 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40°C to 95°C |
| RoHS-Status | Compliant |
| Halogenfrei | Yes |
| Speicherorganisation | 512M x 8 |
| Anzahl der Pins | 96 |
W634GU6RB-09 Pin-Konfiguration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin B1 | DQ2 — Data input/output 2 |
| Pin B2 | DQ3 — Data input/output 3 |
| Pin B3 | VDD — Power supply |
| Pin B4 | DQ4 — Data input/output 4 |
| Pin C1 | DQ5 — Data input/output 5 |
| Pin C2 | VSS — Ground |
| Pin C3 | DQ6 — Data input/output 6 |
| Pin C4 | DQ7 — Data input/output 7 |
Typische Anwendungen
W634GU6RB-09 ist geeignet für 6 Anwendungs: High-Performance Computing, Networking Equipment, Embedded Systems, Industrial Automation, IoT Gateways, Servers.
High-Performance Computing
The W634GU6RB-09 provides 4Gbit DDR3L memory with 2133 Mbps data rate, making it ideal for high-performance computing systems that require fast data access and low power consumption. Its 1.35V operation reduces thermal load, enabling denser memory configurations. The 96-ball VFBGA package allows compact PCB layouts, crucial for servers and workstations where space is at a premium. With a 20 ns access time, it ensures low latency for compute-intensive tasks.
Empfohlen
Networking Equipment
In networking equipment such as routers and switches, the W634GU6RB-09 offers high bandwidth and low power, essential for handling large data packets efficiently. Its 1066 MHz clock and 2133 Mbps data rate support high-throughput packet processing. The low voltage operation helps meet energy efficiency standards in data centers. The compact VFBGA package enables high-density memory arrays on network line cards, improving scalability and performance.
Empfohlen
Embedded Systems
The W634GU6RB-09 is well-suited for embedded systems that require reliable, low-power memory. Its 1.35V supply reduces power consumption, extending battery life in portable devices. The 4Gbit density provides ample storage for complex applications, while the 96-ball VFBGA package fits space-constrained designs. The -40°C to 95°C operating range ensures reliability in harsh environments, making it suitable for industrial and automotive embedded applications.
Empfohlen
Industrial Automation
In industrial automation, the W634GU6RB-09 provides robust memory for PLCs and robotics controllers. Its high speed and low power make it ideal for real-time control systems that require fast data processing. The wide operating temperature range ensures reliable operation in factory environments. The VFBGA package offers good thermal performance, critical for systems with limited airflow. The 4Gbit density supports complex control algorithms and data logging.
Empfohlen
IoT Gateways
The W634GU6RB-09 is ideal for IoT gateways that need to process and store data from multiple sensors. Its low power consumption is critical for always-on devices, and the 4Gbit density provides ample buffer for data aggregation. The 1066 MHz clock ensures fast data processing, while the compact package allows for small form factor designs. The RoHS compliance makes it suitable for environmentally conscious products.
Empfohlen
Servers
In server applications, the W634GU6RB-09 provides high-density, low-power memory for improved energy efficiency. Its 2133 Mbps data rate supports high-bandwidth workloads, while the 1.35V supply reduces power consumption, lowering operational costs. The 96-ball VFBGA package enables high memory density on server motherboards. The 20 ns access time ensures low latency for database and virtualization workloads.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für W634GU6RB-09 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | W634GU6RB09J | W634GU6RB-11 | MT40A512M16LY-062E |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Winbond Electronics | Micron Technology |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Clock Frequency | 1.067 GHz | 1.067 GHz | 1.1 GHz | 1.067 GHz |
| Data Rate | 2133 Mbps | 2133 Mbps | 2200 Mbps | 2133 Mbps |
| Access Time | 20 ns | 20 ns | 18 ns | 20 ns |
| Operating Temperature | -40°C to 95°C | -40°C to 95°C | -40°C to 95°C | -40°C to 95°C |
Wichtigste Unterscheidungsmerkmale
- Low voltage operation at 1.35V (vs. MT40A512M16LY-062E)
- High data rate of 2133 Mbps (vs. W634GU6RB-11)
- Wide operating temperature range (vs. K4A8G165WB-BCWE)
Designhinweise
Place decoupling capacitors (0.1uF and 1uF) close to each VDD pin to minimize power supply noise. Follow the layout guidelines in the Winbond datasheet to maintain signal integrity at 1066 MHz. Ensure proper ground plane continuity under the VFBGA package.
The VFBGA package has a thermal resistance that should be considered. Ensure adequate airflow or a thermal pad to dissipate heat, especially in high-temperature environments. The operating range is -40°C to 95°C, so verify the junction temperature stays within limits.
At 2133 Mbps, signal integrity is critical. Use controlled impedance traces for DQ, DQS, and clock signals. Keep trace lengths matched to avoid skew. Add series termination resistors if needed, as recommended in the datasheet.
Compliance-Informationen
RoHS compliant and halogen-free per Winbond datasheet. REACH and conflict minerals status not specified in provided data.
